US6057598A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Face on face flip chip integration
Assignee: Adeia Semiconductor Technologies LLC
•
Filing: 1997-01-31
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Granted: 2000-05-02
•
Expires: 2017-01-31
Abstract
Abstract The present invention provides methods and apparatus capable of efficiently combining a logic circuit die with a memory circuit die in a single integrated circuit device capable of supporting memory intensive applications, such as 3-dimensional graphics rendering, encryption and signal processing. The logic circuit die is produced independently with a logic circuit fabrication process that optimizes the logic circuit's performance and reduces costs, and the memory circuit die, which may contain a large memory circuit, can be produced independently with a memory circuit fabrication process that optimizes the memory circuit's performance and reduces costs. The circuit dies are attached directly together in a flip-chip fashion to create a unitary integrated circuit assembly having a high-performance, low impedance, wide-word interface. This integrated circuit assembly can be enclosed within a typical integrated circuit package for insertion on a circuit board, such as those used in personal computers and other common electronic applications.
Inventors
- 👤 Robert L. Payne
- 👤 Herbert Reiter
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 08:39
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W90/00; H10W90/811; H10W72/00; H10W72/071; H10W72/072; H10W72/075; H10W72/20; H10W72/50; H10W72/551; H10W72/851; H10W72/853; H10W72/859; H10W72/90; H10W72/941; H10W72/9415; H10W72/951; H10W74/00; H10W90/701; H10W90/721; H10W90/722; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 39
Claim 1
Independent Claim
199 words
An integrated circuit device comprising: an integrated circuit assembly including (a) a memory circuit die made with a memory circuit fabrication process, said memory circuit die having (i) a first plurality of conductive contacts arranged on a first connecting side of said memory circuit die; and (ii) a memory circuit formed on said memory circuit die and electrically coupled to said first plurality of conductive contacts; and (b) a logic circuit die made with a logic circuit fabrication process, said memory circuit die and said logic circuit die being attached together, said logic circuit die having (i) a second plurality of conductive contacts arranged on a second connecting side of said logic circuit die; and (ii) a logic circuit formed on said logic circuit die and electrically coupled to said second plurality of connecting contacts; wherein said memory circuit die and said logic circuit die are attached together in a flip-chip fashion with said first connecting side in close proximity to said second connecting side and with said first plurality of conductive contacts connected to said second plurality of contacts to provide electrical connections between said memory circuit and said logic circuit, thereby forming a unitary, integrated circuit assembly.
Claim 2
Dependent Claim
199 words
An integrated circuit device comprising: an integrated circuit assembly including (a) a memory circuit die made with a memory circuit fabrication process, said memory circuit die having (i) a first plurality of conductive contacts arranged on a first connecting side of said memory circuit die; and (ii) a memory circuit formed on said memory circuit die and electrically coupled to said first plurality of conductive contacts; and (b) a logic circuit die made with a logic circuit fabrication process, said memory circuit die and said logic circuit die being attached together, said logic circuit die having (i) a second plurality of conductive contacts arranged on a second connecting side of said logic circuit die; and (ii) a logic circuit formed on said logic circuit die and electrically coupled to said second plurality of connecting contacts; wherein said memory circuit die and said logic circuit die are attached together in a flip-chip fashion with said first connecting side in close proximity to said second connecting side and with said first plurality of conductive contacts connected to said second plurality of contacts to provide electrical connections between said memory circuit and said logic circuit, thereby forming a unitary, integrated circuit assembly.
Claim 3
Dependent Claim
46 words
The integrated circuit device of claim 1, wherein said first circuit die and said second circuit die are comprised of substrate materials having similar coefficients of thermal expansion such that mechanical stress on said first plurality of contacts and said second plurality of contacts is minimized.
Claim 4
Dependent Claim
17 words
The integrated circuit device of claim 1, wherein said memory circuit is a dynamic random access memory.
Claim 5
Dependent Claim
17 words
The integrated circuit device of claim 1, wherein said memory circuit is a static random access memory.
Claim 6
Dependent Claim
15 words
The integrated circuit device of claim 1, wherein said memory circuit is a flash memory.
Claim 7
Dependent Claim
22 words
The integrated circuit device of claim 1 wherein said first connecting side has a greater surface area than said second connecting side.
Claim 8
Dependent Claim
22 words
The integrated circuit device of claim 1 wherein said second connecting side has a greater surface area than said first connecting side.
Claim 9
Dependent Claim
22 words
The integrated circuit device of claim 1 wherein said first conductive contacts are conductive bumps extending outwardly from said first connecting side.
Claim 10
Dependent Claim
14 words
The integrated circuit device of claim 8 wherein said second conductive contacts are pads.
Claim 11
Dependent Claim
22 words
The integrated circuit device of claim 1 wherein said second connecting contacts are conductive bumps extending outwardly from said second connecting side.
Claim 12
Dependent Claim
14 words
The integrated circuit device of claim 10 wherein said first conductive contacts are pads.
Claim 13
Dependent Claim
38 words
The integrated circuit device of claim 1 further comprising: (a) an insulating package enclosing said integrated circuit assembly; and (b) a plurality of conductive leads electrically coupled to said integrated circuit assembly and extending from said insulating package.
Claim 14
Dependent Claim
22 words
The integrated circuit assembly of claim 1 wherein said second connecting contacts are conductive bumps extending outwardly from said second connecting side.
Claim 15
Independent Claim
186 words
A method for creating an integrated circuit device comprising: creating an integrated circuit assembly by providing a memory circuit die made with a memory circuit fabrication process, said memory circuit die having a first plurality of conductive contacts arranged on a first connecting side of said memory circuit die, and a memory circuit formed on said memory circuit die and electrically coupled to said first plurality of conductive contacts; providing a logic circuit die made with a logic circuit fabrication process, said logic circuit die having a second plurality of conductive contacts arranged on a second connecting side of said logic circuit die, and a logic circuit formed on said logic circuit die and electrically coupled to said second plurality of connecting contacts; and attaching said memory circuit die and said logic circuit die together in a flip-chip fashion with said first connecting side in close proximity to said second connecting side and with said first plurality of conductive contacts connected to said second plurality of contacts to provide electrical connections between said memory circuit and said logic circuit, thereby forming a unitary, integrated circuit assembly.
Claim 16
Independent Claim
186 words
A method for creating an integrated circuit device comprising: creating an integrated circuit assembly by providing a memory circuit die made with a memory circuit fabrication process, said memory circuit die having a first plurality of conductive contacts arranged on a first connecting side of said memory circuit die, and a memory circuit formed on said memory circuit die and electrically coupled to said first plurality of conductive contacts; providing a logic circuit die made with a logic circuit fabrication process, said logic circuit die having a second plurality of conductive contacts arranged on a second connecting side of said logic circuit die, and a logic circuit formed on said logic circuit die and electrically coupled to said second plurality of connecting contacts; and attaching said memory circuit die and said logic circuit die together in a flip-chip fashion with said first connecting side in close proximity to said second connecting side and with said first plurality of conductive contacts connected to said second plurality of contacts to provide electrical connections between said memory circuit and said logic circuit, thereby forming a unitary, integrated circuit assembly.
Claim 17
Dependent Claim
44 words
The method of claim 14 wherein said first circuit die and said second circuit die are comprised of substrate materials having similar coefficients of thermal expansion such that mechanical stress on said first plurality of contacts and said second plurality of contacts is minimized.
Claim 18
Dependent Claim
15 words
The method of claim 14, wherein said memory circuit is a dynamic random access memory.
Claim 19
Dependent Claim
15 words
The method of claim 14, wherein said memory circuit is a static random access memory.
Claim 20
Dependent Claim
13 words
The method of claim 14, wherein said memory circuit is a flash memory.
Claim 21
Dependent Claim
20 words
The method of claim 14 wherein said first connecting side has a greater surface area than said second connecting side.
Claim 22
Dependent Claim
20 words
The method of claim 14 wherein said second connecting side has a greater surface area than said first connecting side.
Claim 23
Dependent Claim
20 words
The method of claim 14 wherein said first conductive contacts are conductive bumps extending outwardly from said first connecting side.
Claim 24
Dependent Claim
12 words
The method of claim 21 wherein said second conductive contacts are pads.
Claim 25
Dependent Claim
20 words
The method of claim 14 wherein said second connecting contacts are conductive bumps extending outwardly from said second connecting side.
Claim 26
Dependent Claim
12 words
The method of claim 23 wherein said first conductive contacts are pads.
Claim 27
Dependent Claim
36 words
The method of claim 14 further comprising: enclosing said integrated circuit assembly within an insulating package; and providing a plurality of conductive leads electrically coupled to said integrated circuit assembly and extending from said insulating package.
Claim 28
Dependent Claim
150 words
An integrate circuit assembly comprising: a first circuit die made with a first circuit fabrication process, said first circuit die having a first plurality of conductive contacts arranged on a first connecting side of said first circuit die; a second circuit die made with a second circuit fabrication process, said first circuit die and said second circuit die being attached together, said second circuit die having a second plurality of conductive contacts arranged on a second connecting side of said second circuit die; and wherein said first circuit die and said second circuit die are attached together in a flip-chip fashion with said first connecting side in close proximity to said second connecting side and with said first plurality of conductive contacts connected to said second plurality of contacts to provide electrical connections between said first circuit die and said second circuit die, thereby forming a unitary, integrated circuit assembly.
Claim 29
Dependent Claim
150 words
An integrate circuit assembly comprising: a first circuit die made with a first circuit fabrication process, said first circuit die having a first plurality of conductive contacts arranged on a first connecting side of said first circuit die; a second circuit die made with a second circuit fabrication process, said first circuit die and said second circuit die being attached together, said second circuit die having a second plurality of conductive contacts arranged on a second connecting side of said second circuit die; and wherein said first circuit die and said second circuit die are attached together in a flip-chip fashion with said first connecting side in close proximity to said second connecting side and with said first plurality of conductive contacts connected to said second plurality of contacts to provide electrical connections between said first circuit die and said second circuit die, thereby forming a unitary, integrated circuit assembly.
Claim 30
Dependent Claim
46 words
The integrated circuit assembly of claim 26 wherein said first circuit die and said second circuit die are comprised of substrate materials having similar coefficients of thermal expansion such that mechanical stress on said first plurality of contacts and said second plurality of contacts is minimized.
Claim 31
Dependent Claim
18 words
The integrated circuit assembly of claim 26, wherein said first circuit die includes a dynamic random access memory.
Claim 32
Dependent Claim
18 words
The integrated circuit assembly of claim 26, wherein said first circuit die includes a static random access memory.
Claim 33
Dependent Claim
16 words
The integrated circuit assembly of claim 26, wherein said first circuit die includes a flash memory.
Claim 34
Dependent Claim
16 words
The integrated circuit assembly of claim 26, wherein said first circuit die includes an analog circuit.
Claim 35
Dependent Claim
22 words
The integrated circuit assembly of claim 26 wherein said first connecting side has a greater surface area than said second connecting side.
Claim 36
Dependent Claim
22 words
The integrated circuit assembly of claim 26 wherein said second connecting side has a greater surface area than said first connecting side.
Claim 37
Dependent Claim
14 words
The integrated circuit assembly of claim 33 wherein said second conductive contacts are pads.
Claim 38
Dependent Claim
22 words
The integrated circuit assembly of claim 26 wherein said first conductive contacts are conductive bumps extending outwardly from said first connecting side.
Claim 39
Dependent Claim
14 words
The integrated circuit assembly of claim 35 wherein said first conductive contacts are pads.
References Cited (Backward Citations)
US5777345A
Cited
US5773896A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-05-02 | 2003-11-01 | 2004-05-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-05-02 | 2007-11-01 | 2008-05-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-05-02 | 2011-11-01 | 2012-05-02 | $7700.00 | Window Closed / Lapsed |