Patent US6806981B1 successfully refreshed from Google Patents.
Patent US6417685B1 successfully refreshed from Google Patents.
US6417685B1
Expired / Lapsed
US
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Test system having alignment member for aligning semiconductor components
Assignee: Micron Technology Inc
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Filing: 2002-01-15
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Granted: 2002-07-09
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Expires: 2022-01-15
Abstract
Abstract A test system for testing semiconductor components includes an interconnect having contacts for making temporary electrical connections with terminal contacts on the components. The interconnect contacts can be configured to electrically engage planar terminal contacts (e.g., bond pads, test pads) or bumped terminal contacts (e.g., solder bumps, solder balls) on the components. The test system also includes an alignment member for aligning the components to the interconnect. Different embodiments of the alignment member include: a curable polymer material molded in place on the interconnect; an alignment opening formed as an etched pocket in a substrate of the interconnect; and a separate fence attached to the interconnect using an alignment fixture.
Inventors
- 👤 Salman Akram
- 👤 Warren M. Farnworth
- 👤 Michael E. Hess
- 👤 David R. Hembree
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:58
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/04; G01R1/0408; G01R1/0433; G01R1/0483; G01R31/00; G01R31/28; G01R31/2851; G01R31/2886; H; H10; H10W; H10W72/00; H10W72/01; H10W72/015; H10W72/01515; H10W72/071; H10W72/075; H10W72/50; H10W72/541; H10W72/5445; H10W72/90; H10W72/931; H10W72/932; H10W72/941; H10W72/9415; H10W72/944; H10W72/9445; H10W74/00; H10W74/10; H10W90/00; H10W90/701; H10W90/721; H10W90/722; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
98 words
A test system for testing a semiconductor component comprising: a base comprising a plurality of terminal contacts configured for electrical communication with test circuitry; an interconnect on the base comprising a plurality of first contacts configured to electrically engage a plurality of second contacts on the component; a plurality of wires electrically connecting the terminal contacts to the first contacts; and an alignment member comprising an alignment opening configured to engage an edge of the component to align the component to the interconnect, the alignment member comprising a polymer on the interconnect and the base encapsulating the wires.
Claim 2
Dependent Claim
98 words
A test system for testing a semiconductor component comprising: a base comprising a plurality of terminal contacts configured for electrical communication with test circuitry; an interconnect on the base comprising a plurality of first contacts configured to electrically engage a plurality of second contacts on the component; a plurality of wires electrically connecting the terminal contacts to the first contacts; and an alignment member comprising an alignment opening configured to engage an edge of the component to align the component to the interconnect, the alignment member comprising a polymer on the interconnect and the base encapsulating the wires.
Claim 3
Dependent Claim
32 words
The test system of claim 1 wherein at least one of the wires comprises a dummy wire configured to confine the polymer to a selected area of the interconnect or the base.
Claim 4
Dependent Claim
27 words
The test system of claim 1 further comprising a mold on the interconnect or on the base configured to mold the polymer for forming the alignment member.
Claim 5
Dependent Claim
26 words
The test system of claim 1 further comprising a dam on the interconnect or the base configured to mold the polymer for encapsulating the electrical paths.
Claim 6
Dependent Claim
109 words
A test system for testing a semiconductor component comprising: a base comprising a plurality of terminal contacts; an interconnect comprising a dam, and a plurality of first contacts in electrical communication with the terminal contacts configured to electrically engage a plurality of second contacts on the component; a plurality of wires and wire bonds electrically connecting the first contacts to the terminal contacts; an encapsulant encapsulating the wires and the wire bonds, the dam preventing the encapsulant from contacting a selected portion of the interconnect; and at least one dummy wire bonded to the interconnect and to the base configured to prevent the encapsulant from contacting the selected portion.
Claim 7
Dependent Claim
109 words
A test system for testing a semiconductor component comprising: a base comprising a plurality of terminal contacts; an interconnect comprising a dam, and a plurality of first contacts in electrical communication with the terminal contacts configured to electrically engage a plurality of second contacts on the component; a plurality of wires and wire bonds electrically connecting the first contacts to the terminal contacts; an encapsulant encapsulating the wires and the wire bonds, the dam preventing the encapsulant from contacting a selected portion of the interconnect; and at least one dummy wire bonded to the interconnect and to the base configured to prevent the encapsulant from contacting the selected portion.
Claim 8
Dependent Claim
17 words
The test system of claim 5 wherein the dam comprises at least one ridge on the interconnect.
Claim 9
Dependent Claim
18 words
The test system of claim 5 wherein the interconnect comprises silicon and the dam comprises a silicon ridge.
Claim 10
Dependent Claim
21 words
The test system of claim 5 wherein the encapsulant includes an alignment opening configured to align the component on the interconnect.
Claim 11
Dependent Claim
82 words
A test system for testing a semiconductor component comprising: an interconnect comprising a plurality of first contacts configured to electrically engage a plurality of second contacts on the component; an alignment member configured to align the component to the interconnect; and an alignment fixture having an outline substantially identical to the component, the alignment fixture configured for placement on the interconnect and comprising a plurality of openings configured for alignment with the first contacts for aligning the alignment member to the interconnect.
Claim 12
Dependent Claim
82 words
A test system for testing a semiconductor component comprising: an interconnect comprising a plurality of first contacts configured to electrically engage a plurality of second contacts on the component; an alignment member configured to align the component to the interconnect; and an alignment fixture having an outline substantially identical to the component, the alignment fixture configured for placement on the interconnect and comprising a plurality of openings configured for alignment with the first contacts for aligning the alignment member to the interconnect.
Claim 13
Dependent Claim
18 words
The test system of claim 9 wherein the openings are configured for visual alignment to the first contacts.
Claim 14
Dependent Claim
72 words
A test system for testing a semiconductor component comprising: an interconnect comprising a plurality of first contacts configured to electrically engage a plurality of second contacts on the component; an alignment member configured to align the component to the interconnect; and an alignment fixture having an outline substantially identical to the component, the alignment fixture comprising at least one alignment mark configured for alignment to an alignment feature on the alignment member.
Claim 15
Dependent Claim
72 words
A test system for testing a semiconductor component comprising: an interconnect comprising a plurality of first contacts configured to electrically engage a plurality of second contacts on the component; an alignment member configured to align the component to the interconnect; and an alignment fixture having an outline substantially identical to the component, the alignment fixture comprising at least one alignment mark configured for alignment to an alignment feature on the alignment member.
Claim 16
Dependent Claim
73 words
A test system for testing a semiconductor component comprising: an interconnect comprising a plurality of first contacts configured to electrically engage a plurality of second contacts on the component; an alignment member configured to align the component to the interconnect; and an alignment fixture having an outline substantially identical to the component, the alignment fixture comprising a transparent substrate configured for placement on the interconnect for aligning the alignment member to the interconnect.
Claim 17
Dependent Claim
73 words
A test system for testing a semiconductor component comprising: an interconnect comprising a plurality of first contacts configured to electrically engage a plurality of second contacts on the component; an alignment member configured to align the component to the interconnect; and an alignment fixture having an outline substantially identical to the component, the alignment fixture comprising a transparent substrate configured for placement on the interconnect for aligning the alignment member to the interconnect.
Claim 18
Dependent Claim
27 words
The test system of claim 12 wherein the alignment fixture includes at least one alignment mark thereon configured for visual alignment with a feature on the interconnect.
Claim 19
Dependent Claim
118 words
A test system for testing a semiconductor component comprising: a base comprising a plurality of first bonding pads configured for electrical communication with a test circuitry; an interconnect on the base comprising a plurality of first contacts configured to electrically engage a plurality of second contacts on the component, and a plurality of second bonding pads in electrical communication with the first contacts; a plurality of wires bonded to the first bonding pads and to the second bonding pads; an alignment member on the interconnect comprising an alignment opening configured to align the component to the interconnect, the alignment member forming a space at least partially enclosing the wires; and an encapsulant in the space encapsulating the wires.
Claim 20
Dependent Claim
118 words
A test system for testing a semiconductor component comprising: a base comprising a plurality of first bonding pads configured for electrical communication with a test circuitry; an interconnect on the base comprising a plurality of first contacts configured to electrically engage a plurality of second contacts on the component, and a plurality of second bonding pads in electrical communication with the first contacts; a plurality of wires bonded to the first bonding pads and to the second bonding pads; an alignment member on the interconnect comprising an alignment opening configured to align the component to the interconnect, the alignment member forming a space at least partially enclosing the wires; and an encapsulant in the space encapsulating the wires.
Claim 21
Dependent Claim
18 words
The test system of claim 14 wherein the alignment member comprises a separate member attached to the interconnect.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-07-08 | 2006-01-07 | 2006-07-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-07-08 | 2010-01-07 | 2010-07-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-07-08 | 2014-01-07 | 2014-07-09 | $7700.00 | Window Closed / Lapsed |