US6285203B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Test system having alignment member for aligning semiconductor components
Assignee: Micron Technology Inc
•
Filing: 1999-06-14
•
Granted: 2001-09-04
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Expires: 2019-06-14
Abstract
Abstract A test system for testing semiconductor components includes an interconnect having contacts for making temporary electrical connections with terminal contacts on the components. The interconnect contacts can be configured to electrically engage planar terminal contacts (e.g., bond pads, test pads) or bumped terminal contacts (e.g., solder bumps, solder balls) on the components. The test system also includes an alignment member for aligning the components to the interconnect. Different embodiments of the alignment member include: a curable polymer material molded in place on the interconnect; an alignment opening formed as an etched pocket in a substrate of the interconnect; and a separate fence attached to the interconnect using an alignment fixture.
Inventors
- 👤 Salman Akram
- 👤 Warren M. Farnworth
- 👤 Michael E. Hess
- 👤 David R. Hembree
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 17:10
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/04; G01R1/0408; G01R1/0433; G01R1/0483; G01R31/00; G01R31/28; G01R31/2851; G01R31/2886; H; H10; H10W; H10W72/00; H10W72/01; H10W72/015; H10W72/01515; H10W72/071; H10W72/075; H10W72/50; H10W72/541; H10W72/5445; H10W72/90; H10W72/931; H10W72/932; H10W72/941; H10W72/9415; H10W72/944; H10W72/9445; H10W74/00; H10W74/10; H10W90/00; H10W90/701; H10W90/721; H10W90/722; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 40
Claim 1
Independent Claim
90 words
A test system for testing a semiconductor component having a plurality of component contacts comprising: a substrate; an alignment member comprising a pocket in the substrate that includes a sidewall comprising a sloped portion of the substrate configured to engage an edge of the component, and a surface comprising a planar portion of the substrate enclosed by the sidewall; and a plurality of contacts on the surface configured to electrically engage the component contacts as the sidewall engages the edge of the component and aligns the component on the substrate.
Claim 2
Dependent Claim
90 words
A test system for testing a semiconductor component having a plurality of component contacts comprising: a substrate; an alignment member comprising a pocket in the substrate that includes a sidewall comprising a sloped portion of the substrate configured to engage an edge of the component, and a surface comprising a planar portion of the substrate enclosed by the sidewall; and a plurality of contacts on the surface configured to electrically engage the component contacts as the sidewall engages the edge of the component and aligns the component on the substrate.
Claim 3
Dependent Claim
25 words
The test system of claim 1 wherein the component contacts comprise bumps, and the contacts comprise recesses in the surface configured to center the bumps.
Claim 4
Dependent Claim
35 words
The test system of claim 1 wherein the component contacts comprise bumps, and the contacts comprise projections configured to penetrate the bumps, and recesses enclosing the projections configured to center the bumps on the projections.
Claim 5
Dependent Claim
20 words
The test system of claim 1 wherein the sidewall has a peripheral shape corresponding to an outline of the component.
Claim 6
Dependent Claim
18 words
The test system of claim 1 wherein the sidewall and the surface comprise etched portions of the substrate.
Claim 7
Dependent Claim
86 words
A test system for testing a semiconductor component having a plurality of component contacts comprising: a substrate having a thickness; an alignment member configured to align the component on the substrate, the alignment member comprising a pocket in the substrate having a depth that is less than the thickness, the pocket comprising a surface at the depth and a sidewall enclosing the surface configured to engage an edge of the component; and a plurality of contacts on the surface configured to electrically engage the component contacts.
Claim 8
Dependent Claim
86 words
A test system for testing a semiconductor component having a plurality of component contacts comprising: a substrate having a thickness; an alignment member configured to align the component on the substrate, the alignment member comprising a pocket in the substrate having a depth that is less than the thickness, the pocket comprising a surface at the depth and a sidewall enclosing the surface configured to engage an edge of the component; and a plurality of contacts on the surface configured to electrically engage the component contacts.
Claim 9
Dependent Claim
20 words
The test system of claim 6 wherein the sidewall comprises a sloped surface and the surface comprises a planar surface.
Claim 10
Dependent Claim
24 words
The test system of claim 6 wherein the component contacts comprise bumped contacts, and the contacts comprise recesses configured to retain the bumped contacts.
Claim 11
Dependent Claim
27 words
The test system of claim 6 wherein the component contacts comprise bumped contacts, and the contacts comprise projections on the surface configured to penetrate the component contacts.
Claim 12
Dependent Claim
44 words
The test system of claim 6 wherein the component contacts comprise bumped contacts, and the contacts comprise projections on the surface configured to penetrate the bumped contacts, the projections contained in recesses in the surface configured to center the bumped contacts on the projections.
Claim 13
Dependent Claim
43 words
The test system of claim 6 wherein the component comprises an element selected from the group consisting of semiconductor wafers, semiconductor dice, semiconductor packages, chip scale packages, wafers or panels containing semiconductor packages, boards containing semiconductor dice, and electronic assemblies containing semiconductor dice.
Claim 14
Dependent Claim
92 words
A test system for testing a semiconductor component having a plurality of component contacts comprising: a substrate; an alignment member configured to align the component on the substrate, the alignment member comprising a sloped sidewall comprising a first etched portion of the substrate configured to engage an edge of the component, and a surface comprising a second etched portion of the substrate enclosed by the sloped sidewall; and a plurality of contacts on the surface configured to electrically engage the component contacts as the sloped sidewall engages the edge of the component.
Claim 15
Dependent Claim
92 words
A test system for testing a semiconductor component having a plurality of component contacts comprising: a substrate; an alignment member configured to align the component on the substrate, the alignment member comprising a sloped sidewall comprising a first etched portion of the substrate configured to engage an edge of the component, and a surface comprising a second etched portion of the substrate enclosed by the sloped sidewall; and a plurality of contacts on the surface configured to electrically engage the component contacts as the sloped sidewall engages the edge of the component.
Claim 16
Dependent Claim
18 words
The test system of claim 12 wherein the alignment member comprises an anisotropically etched pocket in the substrate.
Claim 17
Dependent Claim
20 words
The test system of claim 12 wherein the sloped sidewall has a peripheral outline corresponding to that of the component.
Claim 18
Dependent Claim
23 words
The test system of claim 12 wherein the substrate comprises silicon or ceramic and the sidewall and the surface comprising anisotropically etched surfaces.
Claim 19
Dependent Claim
37 words
The test system of claim 12 further comprising a plurality of conductive vias in the substrate in electrical communication with the contacts, and a plurality of pads on the substrate in electrical communication with the conductive vias.
Claim 20
Dependent Claim
31 words
The test system of claim 12 further comprising a base configured to support the substrate and a force applying mechanism on the base configured to bias the component against the interconnect.
Claim 21
Dependent Claim
115 words
A test system for testing a semiconductor component having bumped contacts comprising: a base configured to retain the component; an interconnect on the base comprising a substrate and a plurality of contacts on the substrate comprising projections configured to electrically engage the bumped contacts, and recesses configured to center the bumped contacts on the projections; and an alignment member comprising a pocket extending part way through the substrate having a sidewall with a peripheral outline corresponding to a peripheral edge of the component, and a surface enclosed by the sidewall, the contacts located on the surface, the sidewall configured to engage the peripheral edge of the component to align the bumped contacts to the contacts.
Claim 22
Dependent Claim
115 words
A test system for testing a semiconductor component having bumped contacts comprising: a base configured to retain the component; an interconnect on the base comprising a substrate and a plurality of contacts on the substrate comprising projections configured to electrically engage the bumped contacts, and recesses configured to center the bumped contacts on the projections; and an alignment member comprising a pocket extending part way through the substrate having a sidewall with a peripheral outline corresponding to a peripheral edge of the component, and a surface enclosed by the sidewall, the contacts located on the surface, the sidewall configured to engage the peripheral edge of the component to align the bumped contacts to the contacts.
Claim 23
Dependent Claim
35 words
The test system of claim 18 further comprising a plurality of conductive layers at least partially covering the projections, and a plurality of conductive vias in the substrate in electrical communication with the conductive layers.
Claim 24
Dependent Claim
30 words
The test system of claim 18 further comprising a plurality of external contacts on the base in electrical communication with the contacts and configured to electrically engage a test circuitry.
Claim 25
Dependent Claim
25 words
The test system of claim 18 further comprising a force applying mechanism attached to the base configured to bias the component and the interconnect together.
Claim 26
Dependent Claim
43 words
The test system of claim 18 wherein the component comprises an element selected from the group consisting of semiconductor wafers, semiconductor dice, semiconductor packages, chip scale packages, wafers or panels containing semiconductor packages, boards containing semiconductor dice, and electronic assemblies containing semiconductor dice.
Claim 27
Independent Claim
83 words
A method for fabricating a test system for testing a semiconductor component having a plurality of component contacts comprising: providing a substrate; forming an alignment member on the substrate by etching a pocket in the substrate comprising a surface and a sidewall enclosing the surface and configured to contact an edge of the component to align the component on the substrate; and forming a plurality of contacts on the surface configured to electrically engage the component contacts as the sidewall engages the edge.
Claim 28
Independent Claim
83 words
A method for fabricating a test system for testing a semiconductor component having a plurality of component contacts comprising: providing a substrate; forming an alignment member on the substrate by etching a pocket in the substrate comprising a surface and a sidewall enclosing the surface and configured to contact an edge of the component to align the component on the substrate; and forming a plurality of contacts on the surface configured to electrically engage the component contacts as the sidewall engages the edge.
Claim 29
Dependent Claim
12 words
The method of claim 23 wherein the substrate comprises silicon or ceramic.
Claim 30
Dependent Claim
19 words
The method of claim 23 wherein the sidewall comprises a sloped surface comprising an etched portion of the substrate.
Claim 31
Dependent Claim
24 words
The method of claim 23 wherein the component contacts comprise bumped contacts, and the interconnect contacts comprise recesses configured to retain the bumped contacts.
Claim 32
Dependent Claim
26 words
The method of claim 23 wherein the component contacts comprise bumped contacts, and the contacts comprise projections on the surface configured to penetrate the bumped contacts.
Claim 33
Dependent Claim
42 words
The method of claim 23 wherein the component contacts comprise bumped contacts, and the contacts comprise projections on the surface configured to penetrate the bumped contacts, with the projections contained in recesses and configured to center the bumped contacts on the projections.
Claim 34
Dependent Claim
42 words
The method of claim 23 wherein the component comprises an element selected from the group consisting of semiconductor wafers, semiconductor dice, semiconductor packages, chip scale packages, wafers or panels containing semiconductor packages, boards containing semiconductor dice, and electronic assemblies containing semiconductor dice.
Claim 35
Independent Claim
110 words
A method for fabricating a test system for testing a semiconductor component having a plurality of component contacts comprising: providing a substrate having a thickness; forming an alignment member integrally with the substrate by etching a pocket in the substrate having a depth less than the thickness, the pocket comprising a surface comprising a first etched portion of the substrate and a sidewall comprising a second etched portion of the substrate extending to and enclosing the surface, the sidewall configured to contact an edge of the component to align the component on the substrate; and forming a plurality of contacts on the surface configured to electrically engage the component contacts.
Claim 36
Independent Claim
110 words
A method for fabricating a test system for testing a semiconductor component having a plurality of component contacts comprising: providing a substrate having a thickness; forming an alignment member integrally with the substrate by etching a pocket in the substrate having a depth less than the thickness, the pocket comprising a surface comprising a first etched portion of the substrate and a sidewall comprising a second etched portion of the substrate extending to and enclosing the surface, the sidewall configured to contact an edge of the component to align the component on the substrate; and forming a plurality of contacts on the surface configured to electrically engage the component contacts.
Claim 37
Dependent Claim
17 words
The method of claim 30 wherein the sidewall has an outline corresponding to that of the component.
Claim 38
Dependent Claim
19 words
The method of claim 30 wherein the substrate comprises silicon and etching the pocket comprises an anisotropic etch process.
Claim 39
Dependent Claim
23 words
The method of claim 30 wherein forming the contacts comprises etching recesses in the surface configured to retain or center the component contacts.
Claim 40
Dependent Claim
21 words
The method of claim 30 wherein forming the contacts comprises etching projections in the surface configured to penetrate the component contacts.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-09-03 | 2005-03-05 | 2005-09-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-09-03 | 2009-03-05 | 2009-09-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-09-03 | 2013-03-05 | 2013-09-04 | $7700.00 | Window Closed / Lapsed |