Patent US6040702A successfully refreshed from Google Patents.
US6040702A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Carrier and system for testing bumped semiconductor components
Assignee: Micron Technology Inc
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Filing: 1997-07-03
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Granted: 2000-03-21
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Expires: 2017-07-03
Abstract
Abstract A semiconductor carrier and system for testing bumped semiconductor components, such as dice and packages, having contact bumps are provided. The carrier includes a base, an interconnect, and a force applying mechanism. The interconnect includes patterns of contact members adapted to electrically contact the contact bumps. The interconnect can include a substrate having contact members formed as recesses, or as projections, covered with conductive layers. Alternately, the interconnect can be a multi layered tape bonded directly to a base of the carrier. In addition to providing electrical connections, the contact members perform an alignment function by self centering the contact bumps within the contact members. The carrier can also include an alignment member configured to align the components with the interconnect. The system can include the carrier, a socket, and a testing apparatus such as a burn-in board in electrical communication with test circuitry.
Inventors
- 👤 David R. Hembree
- 👤 Warren M. Farnworth
- 👤 Alan G. Wood
- 👤 Derek Gochnour
- 👤 Salman Akram
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 05:47
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/04; G01R1/0408; G01R1/0433; G01R1/0483; H; H10; H10W; H10W72/00; H10W72/071; H10W72/072; H10W72/20; H10W72/29; H10W72/90; H10W72/931; H10W72/932
Claims Analysis
Total Claims: 38
Claim 1
Independent Claim
121 words
A semiconductor carrier comprising: a base comprising an external contact, the base configured to retain a semiconductor component comprising a contact bump; an interconnect on the base comprising a contact member in electrical communication with the external contact configured to electrically contact the contact bump on the component; a first alignment member on the base comprising a first opening configured to contact an edge of the component to coarse align the contact bump to the contact member; a second alignment member on the interconnect comprising a second opening configured to contact the contact bump to fine align the contact bump to the contact member; and a force applying mechanism attached to the base configured to bias the component against the interconnect.
Claim 2
Dependent Claim
121 words
A semiconductor carrier comprising: a base comprising an external contact, the base configured to retain a semiconductor component comprising a contact bump; an interconnect on the base comprising a contact member in electrical communication with the external contact configured to electrically contact the contact bump on the component; a first alignment member on the base comprising a first opening configured to contact an edge of the component to coarse align the contact bump to the contact member; a second alignment member on the interconnect comprising a second opening configured to contact the contact bump to fine align the contact bump to the contact member; and a force applying mechanism attached to the base configured to bias the component against the interconnect.
Claim 3
Dependent Claim
49 words
The carrier of claim 1 wherein the component comprises a plurality of contact bumps and the interconnect comprises a plurality of contact members including at least one contact member configured to form a mark on a selected contact bums to indicate an orientation of the component on the base.
Claim 4
Dependent Claim
28 words
The carrier of claim 1 the first alignment member provides a first registration between the contact bump and the contact member of about 1 mil to 6 mils.
Claim 5
Dependent Claim
28 words
The carrier of claim 1 the second alignment member provides a second registration between the contact bump and the contact member of about 1 mil to 3 mils.
Claim 6
Dependent Claim
21 words
The carrier of claim 1 wherein the first alignment member and the second alignment member comprise a patterned layer of resist.
Claim 7
Dependent Claim
21 words
The carrier of claim 1 wherein the first opening has a peripheral shape corresponding to a peripheral outline of the component.
Claim 8
Dependent Claim
116 words
A semiconductor carrier comprising: a base configured to retain a semiconductor component comprising a plurality of contact bumps, the base comprising a plurality of external contacts; an interconnect on the base comprising a plurality of contact members configured to electrically contact the contact bumps on the components; a plurality of electrical connections on the base electrically connecting the external contacts to the contact members; a first alignment member on the base configured to contact an edge of the component to align the component to the interconnect during assembly of the carrier; and a second alignment member on the interconnect configured to contact and align the contact bumps to the contact members during assembly of the carrier.
Claim 9
Dependent Claim
116 words
A semiconductor carrier comprising: a base configured to retain a semiconductor component comprising a plurality of contact bumps, the base comprising a plurality of external contacts; an interconnect on the base comprising a plurality of contact members configured to electrically contact the contact bumps on the components; a plurality of electrical connections on the base electrically connecting the external contacts to the contact members; a first alignment member on the base configured to contact an edge of the component to align the component to the interconnect during assembly of the carrier; and a second alignment member on the interconnect configured to contact and align the contact bumps to the contact members during assembly of the carrier.
Claim 10
Dependent Claim
26 words
The carrier of claim 7 wherein the first alignment member comprises a first opening having a peripheral outline corresponding to a peripheral outline of the component.
Claim 11
Dependent Claim
24 words
The carrier of claim 7 wherein the second alignment member comprises a layer of resist patterned and developed with a plurality of alignment openings.
Claim 12
Dependent Claim
26 words
The carrier of claim 7 wherein the first alignment member or the second alignment member comprise a curable polymer at least partially encapsulating the electrical connections.
Claim 13
Dependent Claim
124 words
A semiconductor carrier for testing a semiconductor component having contact bumps comprising: a base configured to retain the component and comprising a plurality of external contacts; an interconnect on the base comprising a plurality of contact members configured to electrically contact the contact bumps; a plurality of bonded connections electrically connecting the external contacts to the contact members; a first alignment member on the base configured to contact the component to align the component to the interconnect; and a second alignment member on the interconnect configured to contact the contact bumps to align the contact bumps to the contact members; the first alignment member and the second alignment member comprising a polymer material at least partially encapsulating at least some of the bonded connections.
Claim 14
Dependent Claim
124 words
A semiconductor carrier for testing a semiconductor component having contact bumps comprising: a base configured to retain the component and comprising a plurality of external contacts; an interconnect on the base comprising a plurality of contact members configured to electrically contact the contact bumps; a plurality of bonded connections electrically connecting the external contacts to the contact members; a first alignment member on the base configured to contact the component to align the component to the interconnect; and a second alignment member on the interconnect configured to contact the contact bumps to align the contact bumps to the contact members; the first alignment member and the second alignment member comprising a polymer material at least partially encapsulating at least some of the bonded connections.
Claim 15
Dependent Claim
20 words
The carrier of claim 11 wherein the first alignment member provides a coarse alignment of from 1 to 6 mils.
Claim 16
Dependent Claim
20 words
The carrier of claim 11 wherein the second alignment member provides a fine alignment of from 1 to 3 mils.
Claim 17
Dependent Claim
133 words
A semiconductor carrier for testing a semiconductor component having contact bumps comprising: a base configured to retain the component and comprising a plurality of external contacts; a first alignment member on the base configured to align the component to the interconnect during assembly of the carrier, the first alignment member comprising a first opening having a peripheral outline corresponding to a peripheral outline of the component; an interconnect on the base comprising a plurality of contact members configured to electrically engage the contact bumps on the component; a second alignment member on the interconnect comprising a plurality of second openings configured to contact and align the contact bumps to the contact members; and a plurality of electrical paths electrically connecting the external contacts on the substrate and the contact members on the interconnect.
Claim 18
Dependent Claim
133 words
A semiconductor carrier for testing a semiconductor component having contact bumps comprising: a base configured to retain the component and comprising a plurality of external contacts; a first alignment member on the base configured to align the component to the interconnect during assembly of the carrier, the first alignment member comprising a first opening having a peripheral outline corresponding to a peripheral outline of the component; an interconnect on the base comprising a plurality of contact members configured to electrically engage the contact bumps on the component; a second alignment member on the interconnect comprising a plurality of second openings configured to contact and align the contact bumps to the contact members; and a plurality of electrical paths electrically connecting the external contacts on the substrate and the contact members on the interconnect.
Claim 19
Dependent Claim
26 words
The carrier of claim 14 wherein a selected contact member comprises a pin one indicator configured to form a distinctive mark on a selected contact bump.
Claim 20
Dependent Claim
19 words
The carrier of claim 14 wherein at least one contact member comprises a recess covered with a conductive layer.
Claim 21
Dependent Claim
18 words
The carrier of claim 14 wherein at least one contact member comprises a recess with a blade therein.
Claim 22
Dependent Claim
25 words
The carrier of claim 14 wherein at least one contact member comprises an array of projections configured to center and electrically engage the contact bumps.
Claim 23
Dependent Claim
29 words
The carrier of claim 14 wherein at least one contact member comprises a single projection covered with a plurality of separate conductive layers configured to contact multiple contact bumps.
Claim 24
Dependent Claim
25 words
The carrier of claim 14 wherein at least one contact member comprises a stepped edge covered with a conductive layer and including multiple peripheral edges.
Claim 25
Dependent Claim
18 words
The carrier of claim 14 wherein at least one contact member comprises a serpentine recess comprising an edge.
Claim 26
Dependent Claim
15 words
The carrier of claim 14 wherein at least one contact member comprises a penetrating projection.
Claim 27
Dependent Claim
19 words
The carrier of claim 14 wherein at least one contact member comprises a flat pad and an opening therein.
Claim 28
Dependent Claim
113 words
A semiconductor carrier for testing a semiconductor component having a plurality of contact bumps comprising: a base configured to retain the component, the base comprising a plurality of external contacts and a plurality of conductors in electrical communication with the external contacts; an interconnect on the base comprising a substrate with a plurality of contact members for electrically engaging the contact bumps, each contact member comprising an array of projections covered with a conductive layer in electrical communication with a selected conductor on the base, each contact member configured to electrically engage and center a selected contact bump on the component; and a force applying mechanism for biasing the component against the interconnect.
Claim 29
Dependent Claim
113 words
A semiconductor carrier for testing a semiconductor component having a plurality of contact bumps comprising: a base configured to retain the component, the base comprising a plurality of external contacts and a plurality of conductors in electrical communication with the external contacts; an interconnect on the base comprising a substrate with a plurality of contact members for electrically engaging the contact bumps, each contact member comprising an array of projections covered with a conductive layer in electrical communication with a selected conductor on the base, each contact member configured to electrically engage and center a selected contact bump on the component; and a force applying mechanism for biasing the component against the interconnect.
Claim 30
Independent Claim
154 words
A system for testing semiconductor components comprising: a testing apparatus in electrical communication with test circuitry; a carrier for retaining a semiconductor component in electrical communication with the test circuitry, the carrier comprising a base including a plurality of conductors in electrical communication with a plurality of external contacts; the carrier further comprising an interconnect on the base, the interconnect comprising a substrate with a plurality of contact members configured to electrically contact a plurality of contact bumps on the component; the carrier further comprising a plurality of electrical paths in electrical communication with the conductors on the base and the contact members on the interconnect; the carrier further comprising a first alignment member comprising a first opening for engaging an edge of the component for aligning the component to the interconnect, and a second alignment member comprising a plurality of second openings for contacting and aligning the contact bumps to the contact members.
Claim 31
Independent Claim
154 words
A system for testing semiconductor components comprising: a testing apparatus in electrical communication with test circuitry; a carrier for retaining a semiconductor component in electrical communication with the test circuitry, the carrier comprising a base including a plurality of conductors in electrical communication with a plurality of external contacts; the carrier further comprising an interconnect on the base, the interconnect comprising a substrate with a plurality of contact members configured to electrically contact a plurality of contact bumps on the component; the carrier further comprising a plurality of electrical paths in electrical communication with the conductors on the base and the contact members on the interconnect; the carrier further comprising a first alignment member comprising a first opening for engaging an edge of the component for aligning the component to the interconnect, and a second alignment member comprising a plurality of second openings for contacting and aligning the contact bumps to the contact members.
Claim 32
Dependent Claim
25 words
The system of claim 25 wherein the second openings have a diameter about 1 to 3 mils greater than a diameter of the contact bumps.
Claim 33
Dependent Claim
26 words
The system of claim 25 wherein the first opening has a peripheral outline about 1 to 6 mils greater that a peripheral outline of the component.
Claim 34
Independent Claim
146 words
A system for testing a semiconductor component having contact bumps comprising: a testing apparatus comprising a socket configured for electrical communication with test circuitry; a carrier for retaining and placing the component in electrical communication with the socket, the carrier comprising a base including a plurality of conductors in electrical communication with a plurality of external contacts; the carrier further comprising an interconnect on the base comprising a substrate comprising a plurality of contact members configured to electrically contact the contact bumps on the component, each contact member comprising an array of projections covered with a conductive layer in electrical communication with a selected conductor on the base, each contact member configured to electrically engage and center a selected contact bump on the component; the carrier further comprising a plurality of electrical paths between the conductors on the base and the contact members on the interconnect.
Claim 35
Independent Claim
146 words
A system for testing a semiconductor component having contact bumps comprising: a testing apparatus comprising a socket configured for electrical communication with test circuitry; a carrier for retaining and placing the component in electrical communication with the socket, the carrier comprising a base including a plurality of conductors in electrical communication with a plurality of external contacts; the carrier further comprising an interconnect on the base comprising a substrate comprising a plurality of contact members configured to electrically contact the contact bumps on the component, each contact member comprising an array of projections covered with a conductive layer in electrical communication with a selected conductor on the base, each contact member configured to electrically engage and center a selected contact bump on the component; the carrier further comprising a plurality of electrical paths between the conductors on the base and the contact members on the interconnect.
Claim 36
Dependent Claim
13 words
The system of claim 28 wherein the substrate and the projections comprise silicon.
Claim 37
Dependent Claim
18 words
The system of claim 29 wherein the socket includes electrical connectors configured to electrically engage the external contacts.
Claim 38
Dependent Claim
20 words
The system of claim 30 wherein the carrier further comprises an alignment member for aligning the component to the interconnect.
References Cited (Backward Citations)
US4554505A
Cited
US4760335A
Cited
US4937653A
Cited
US5006792A
Cited
US5073117A
Cited
JPH0369131A
Cited
US5196726A
Cited
US5123850A
Cited
US5046239A
Cited
US5088190A
Cited
US5607818A
Cited
US5678301A
Cited
US5541525A
Cited
US5915755A
Cited
US5495179A
Cited
US5367253A
Cited
US5559444A
Cited
US5815000A
Cited
US5408190A
Cited
US5302891A
Cited
US5634267A
Cited
US5519332A
Cited
US5578934A
Cited
US5289631A
Cited
US5341564A
Cited
US5389873A
Cited
US5483174A
Cited
US5481205A
Cited
US5534785A
Cited
US5453701A
Cited
US5322446A
Cited
US5329423A
Cited
US5420520A
Cited
US5414372A
Cited
US5517125A
Cited
US5633122A
Cited
US5530376A
Cited
US5543725A
Cited
US5592736A
Cited
US5483741A
Cited
US5500605A
Cited
US5625298A
Cited
US5456404A
Cited
US5397245A
Cited
US5581195A
Cited
US5451165A
Cited
US5604445A
Cited
US5629630A
Cited
US5739050A
Cited
US5756370A
Cited
US5783461A
Cited
US5801452A
Cited
US5962921A
Cited
US5915977A
Cited
US5931685A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-03-21 | 2003-09-20 | 2004-03-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-03-21 | 2007-09-20 | 2008-03-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-03-21 | 2011-09-20 | 2012-03-21 | $7700.00 | Window Closed / Lapsed |