US5633122A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Test fixture and method for producing a test fixture for testing unpackaged semiconductor die
Assignee: Micron Technology Inc
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Filing: 1995-03-07
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Granted: 1997-05-27
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Expires: 2015-03-07
Abstract
Abstract An improved test fixture for testing unpackaged semiconductor die and a method for forming the test fixture are provided. The test fixture includes a base formed of a material such as silicon. The base includes a pattern of contact pads corresponding to a pattern of contact locations on the die (e.g., bumped bond pads). The contact pads are connectable via external contacts to external test circuitry. In addition, the test fixture includes an alignment member adapted to align the die on the base. The alignment member includes an alignment opening adapted to cradle the die and form a fluid tight seal. During a test procedure an enclosed cavity is formed between the die held in the alignment opening and the base. The alignment opening is in fluid communication with a vacuum source. Upon application of a vacuum to the cavity, a force is exerted on the die. This places the contact locations on the die in temporary electrical contact with the contact pads on the base.
Inventors
- 👤 Mark E. Tuttle
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 10:50
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/04
Claims Analysis
Total Claims: 35
Claim 1
Independent Claim
92 words
A method for forming a test fixture for testing an unpackaged semiconductor die comprising: forming a base; forming a contact structure on the base configured to establish electrical communication between a contact location on the die and test circuitry; forming an alignment layer on the base; forming an alignment opening through the alignment layer to the base, said alignment opening configured to contact an outer periphery of the die to form a space between the die and base; and forming a vacuum opening on the base in flow communication with the space.
Claim 2
Independent Claim
92 words
A method for forming a test fixture for testing an unpackaged semiconductor die comprising: forming a base; forming a contact structure on the base configured to establish electrical communication between a contact location on the die and test circuitry; forming an alignment layer on the base; forming an alignment opening through the alignment layer to the base, said alignment opening configured to contact an outer periphery of the die to form a space between the die and base; and forming a vacuum opening on the base in flow communication with the space.
Claim 3
Dependent Claim
38 words
The method as claimed in claim 1 and further comprising applying a vacuum through the vacuum opening to the space to press the die against the base with the contact structure in electrical contact with the contact location.
Claim 4
Dependent Claim
14 words
The method as claimed in claim 1 and wherein the alignment layer comprises polyimide.
Claim 5
Dependent Claim
20 words
The method as claimed in claim 1 and wherein the contact structure comprises a pad formed by a metallization process.
Claim 6
Dependent Claim
22 words
The method as claimed in claim 1 and wherein the contact structure comprises a pad and the contact location comprises a bump.
Claim 7
Dependent Claim
27 words
The method as claimed in claim 1 and wherein a plurality of test fixtures are formed on a single wafer of base material and are then singulated.
Claim 8
Dependent Claim
27 words
The method as claimed in claim 1 and wherein a plurality of test fixtures are formed on a wafer having scribe lines for singulating the test fixtures.
Claim 9
Dependent Claim
19 words
The method as claimed in claim 1 and wherein the alignment layer comprises polyimide that is photopatterned and etched.
Claim 10
Independent Claim
117 words
A method for forming a test fixture for testing an unpackaged semiconductor die, comprising: forming a base; forming a contact structure on the base, said contact structure configured to electrically contact a contact location on the die; forming an electrical path between the contact structure and test circuitry; forming an alignment member on the base comprising an alignment opening configured to form a sealed space between the die and base; forming a vacuum opening on the base to the sealed space; and applying a vacuum through the vacuum opening to the sealed space to press the die against the base with the contact structure on the base in electrical contact with the contact location on the die.
Claim 11
Independent Claim
117 words
A method for forming a test fixture for testing an unpackaged semiconductor die, comprising: forming a base; forming a contact structure on the base, said contact structure configured to electrically contact a contact location on the die; forming an electrical path between the contact structure and test circuitry; forming an alignment member on the base comprising an alignment opening configured to form a sealed space between the die and base; forming a vacuum opening on the base to the sealed space; and applying a vacuum through the vacuum opening to the sealed space to press the die against the base with the contact structure on the base in electrical contact with the contact location on the die.
Claim 12
Dependent Claim
20 words
The method as claimed in claim 9 and wherein the electrical path is formed by wire bonding or electrical clips.
Claim 13
Dependent Claim
23 words
The method as claimed in claim 9 and further comprising adjusting a pressure of the vacuum to control a force on the die.
Claim 14
Dependent Claim
21 words
The method as claimed in claim 9 and wherein the alignment member comprises a layer of polyimide deposited on the base.
Claim 15
Dependent Claim
23 words
The method as claimed in claim 12 and wherein the polyimide is deposited to a thickness of from 50 μm to 100 μm.
Claim 16
Dependent Claim
20 words
The method as claimed in claim 9 and wherein the contact structure comprises a pad formed by a metallization process.
Claim 17
Independent Claim
110 words
A method for forming a test fixture for testing a semiconductor die, comprising: forming an unpackaged base; forming a contact structure on the base, configured to establish electrical communication between a bond pad on the die and test circuitry; forming an alignment layer on the base with an alignment opening therein configured to seal around a periphery of the die to form a sealed space; forming a vacuum opening through the base to the alignment opening; and applying a vacuum through the opening to the space to press the die against the base with the contact structure on the base in electrical contact with the bond pad on the die.
Claim 18
Independent Claim
110 words
A method for forming a test fixture for testing a semiconductor die, comprising: forming an unpackaged base; forming a contact structure on the base, configured to establish electrical communication between a bond pad on the die and test circuitry; forming an alignment layer on the base with an alignment opening therein configured to seal around a periphery of the die to form a sealed space; forming a vacuum opening through the base to the alignment opening; and applying a vacuum through the opening to the space to press the die against the base with the contact structure on the base in electrical contact with the bond pad on the die.
Claim 19
Independent Claim
22 words
The method as claimed in 15 and further comprising adjusting a vacuum pressure of the vacuum to provide a desired contact force.
Claim 20
Dependent Claim
23 words
The method as claimed in claim 15 and further comprising adjusting a size of the vacuum opening to provide a desired contact force.
Claim 21
Dependent Claim
22 words
The method as claimed in claim 15 and further comprising forming a plurality of vacuum openings to provide a desired contact force.
Claim 22
Dependent Claim
40 words
The method as claimed in claim 15 and wherein the contact structure comprises a material selected from the group consisting of aluminum (Al), iridium (Ir), copper (Cu), titanium (Ti), tungsten (W), tantalum (Ta), molybdenum (Mo) and alloys of these metals.
Claim 23
Dependent Claim
14 words
The method as claimed in claim 15 and wherein the alignment layer comprises polyimide.
Claim 24
Dependent Claim
96 words
A test fixture for testing an unpackaged semiconductor die comprising: a base having an opening thereon in flow communication with a vacuum source; a contact structure formed on the base for establishing temporary electrical communication between a contact location on the die and test circuitry; and an alignment member formed on the base for aligning the contact structure and contact location, said alignment member comprising an alignment opening configured to contact an outer periphery of the die and form a sealed space in flow communication with the opening for applying a vacuum pressure to the die.
Claim 25
Dependent Claim
96 words
A test fixture for testing an unpackaged semiconductor die comprising: a base having an opening thereon in flow communication with a vacuum source; a contact structure formed on the base for establishing temporary electrical communication between a contact location on the die and test circuitry; and an alignment member formed on the base for aligning the contact structure and contact location, said alignment member comprising an alignment opening configured to contact an outer periphery of the die and form a sealed space in flow communication with the opening for applying a vacuum pressure to the die.
Claim 26
Dependent Claim
22 words
The test fixture as claimed in claim 21 and wherein the alignment member is formed separately and then attached to the base.
Claim 27
Dependent Claim
23 words
The test fixture as claimed in claim 21 and wherein the alignment member comprises a layer of a material deposited on the base.
Claim 28
Dependent Claim
14 words
The test fixture as claimed in claim 23 and wherein the material comprises polyimide.
Claim 29
Dependent Claim
23 words
The test fixture as claimed in claim 21 and wherein the contact location comprises a bump and the contact structure comprises a pad.
Claim 30
Independent Claim
119 words
A method for testing an unpackaged semiconductor die comprising: providing a base having an opening thereon in flow communication with a vacuum source; providing a contact structure on the base in electrical communication with test circuitry and configured to establish temporary electrical communication with a contact location on the die; providing an alignment member on the base comprising an alignment opening configured to contact an outer periphery of the die to form a space in flow communication with the opening; aligning the die with the base using the alignment member; and applying a vacuum pressure through the opening to the space to press the die against the base with the contact structure and contact location in temporary electrical communication.
Claim 31
Independent Claim
119 words
A method for testing an unpackaged semiconductor die comprising: providing a base having an opening thereon in flow communication with a vacuum source; providing a contact structure on the base in electrical communication with test circuitry and configured to establish temporary electrical communication with a contact location on the die; providing an alignment member on the base comprising an alignment opening configured to contact an outer periphery of the die to form a space in flow communication with the opening; aligning the die with the base using the alignment member; and applying a vacuum pressure through the opening to the space to press the die against the base with the contact structure and contact location in temporary electrical communication.
Claim 32
Dependent Claim
21 words
The method as claimed in claim 26 and further comprising applying test signals through the contact structure to the contact location.
Claim 33
Dependent Claim
16 words
The method as claimed in claim 26 and wherein the contact location comprises a solder bump.
Claim 34
Dependent Claim
15 words
The method as claimed in claim 26 and wherein the contact structure comprises a pad.
Claim 35
Dependent Claim
14 words
The method as claimed in claim 26 and further comprising adjusting the vacuum pressure.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-05-26 | 2000-11-25 | 2001-05-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-05-26 | 2004-11-25 | 2005-05-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-05-26 | 2008-11-25 | 2009-05-27 | $7700.00 | Window Closed / Lapsed |