Patent JPS5359432A successfully refreshed from Google Patents.
US5994152A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Fabricating interconnects and tips using sacrificial substrates
Assignee: FormFactor Inc
•
Filing: 1997-01-24
•
Granted: 1999-11-30
•
Expires: 2017-01-24
Abstract
Abstract Interconnection elements and/or tip structures for interconnection elements may first be fabricated upon sacrificial substrates for subsequent mounting to electronic components. In this manner, the electronic components are not `at risk` during the fabrication process. The sacrificial substrate establishes a predetermined spatial relationship between the interconnection elements which may be composite interconnection elements having a relatively soft elongate element as a core and a relatively hard (springy material) overcoat. Tip structures fabricated on sacrificial substrates may be provided with a surface texture optimized for mounting to any interconnection elements for making pressure connections to terminals of electronic components. Interconnection elements may be fabricated upon such tip structures, or may first be mounted to the electronic component and the tip structures joined to the free-ends of the interconnection elements. Tip structures formed as cantilever beams are described.
Inventors
- 👤 Igor Y. Khandros
- 👤 Benjamin N. Eldridge
- 👤 Gaetan L. Mathieu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 08:46
CPC Classifications
H; H10; H10D; H10D64/00; H10D64/01; H10D64/011
Claims Analysis
Total Claims: 63
Claim 1
Independent Claim
55 words
A method of an fabricating interconnection element, comprising: fabricating an interconnection component, including a connection region, fabricating a cantilever structure on a sacrificial substrate; mounting the cantilever structure to the connection region of the interconnection component; and releasing the cantilever structure from the sacrificial substrate by removing at least a portion of the sacrificial substrate.
Claim 2
Independent Claim
55 words
A method of an fabricating interconnection element, comprising: fabricating an interconnection component, including a connection region, fabricating a cantilever structure on a sacrificial substrate; mounting the cantilever structure to the connection region of the interconnection component; and releasing the cantilever structure from the sacrificial substrate by removing at least a portion of the sacrificial substrate.
Claim 3
Dependent Claim
14 words
The method, according to claim 1, characterized in that: the interconnection component is elongate.
Claim 4
Dependent Claim
17 words
The method, according to claim 1, characterized in that: the interconnection component is a composite interconnection element.
Claim 5
Dependent Claim
17 words
The method, according to claim 1, characterized in that: the interconnection component is a monolithic interconnection element.
Claim 6
Dependent Claim
20 words
The method, according to claim 1, characterized in that: the interconnection component is a contact bump of a membrane probe.
Claim 7
Dependent Claim
16 words
The method, according to claim 1, characterized in that: the cantilever structure has a surface texture.
Claim 8
Dependent Claim
20 words
The method, according to claim 1, characterized in that: the cantilever structure is brazed or soldered to the interconnection component.
Claim 9
Dependent Claim
21 words
The method, according to claim 1, characterized in that: a plurality of cantilever structures are lithographically defined on the sacrificial substrate.
Claim 10
Dependent Claim
19 words
The method, according to claim 1, characterized in that: the interconnection component is an element on a second substrate.
Claim 11
Dependent Claim
37 words
The method, according to claim 1, characterized in that: the cantilever structure is formed by providing a masking layer on the sacrificial substrate, forming an opening in the masking layer, and depositing spring material in the opening.
Claim 12
Dependent Claim
23 words
The method, according to claim 1, characterized in that: the cantilever structure is tapered from a one end to an opposite end thereof.
Claim 13
Dependent Claim
18 words
The method, according to claim 1, characterized in that: the interconnection component is resident on an electronic component.
Claim 14
Dependent Claim
28 words
The method, according to claim 1, characterized in that: the interconnection component is fabricated upon the cantilever structure while the cantilever structure is resident on the sacrificial substrate.
Claim 15
Dependent Claim
15 words
The method, according to claim 1, wherein: the sacrificial substrate comprises a sheet of metal.
Claim 16
Dependent Claim
14 words
The method, according to claim 1, wherein: the sacrificial substrate comprises a silicon wafer.
Claim 17
Independent Claim
45 words
A method of fabricating an elongate interconnection element, comprising: mounting an elongate interconnection element at a selected area on a surface of a sacrificial substrate; and releasing the elongate interconnection element from the sacrificial substrate by removing at least a portion of the sacrificial substrate.
Claim 18
Independent Claim
45 words
A method of fabricating an elongate interconnection element, comprising: mounting an elongate interconnection element at a selected area on a surface of a sacrificial substrate; and releasing the elongate interconnection element from the sacrificial substrate by removing at least a portion of the sacrificial substrate.
Claim 19
Dependent Claim
33 words
The method, according to claim 16, further comprising: prior to removing the at least a portion of the sacrificial substrate, attaching a first region of the elongate interconnection element to an electronic component.
Claim 20
Dependent Claim
23 words
The method, according to claim 16, further comprising: prior to mounting the elongate interconnection element, fabricating a cantilever structure at the selected area.
Claim 21
Dependent Claim
16 words
The method, according to claim 16, wherein: the elongate interconnection element is a composite interconnection element.
Claim 22
Dependent Claim
16 words
The method, according to claim 16, wherein: the elongate interconnection element is a monolithic interconnection element.
Claim 23
Independent Claim
79 words
A method of forming a cantilever element, comprising: providing a support substrate, applying a release material on a first side of the support substrate, the release material suitable for destructive removal, applying a masking material on the first side of the support substrate and masking at least a portion of the release material, patterning the masking material to expose a selected portion through the masking layer, and depositing spring material in the selected portion to form a cantilever element.
Claim 24
Independent Claim
79 words
A method of forming a cantilever element, comprising: providing a support substrate, applying a release material on a first side of the support substrate, the release material suitable for destructive removal, applying a masking material on the first side of the support substrate and masking at least a portion of the release material, patterning the masking material to expose a selected portion through the masking layer, and depositing spring material in the selected portion to form a cantilever element.
Claim 25
Dependent Claim
21 words
The method of claim 21 further comprising releasing the cantilever element by removing at least a portion of the release material.
Claim 26
Dependent Claim
11 words
The method of claim 21 wherein the support substrate is silicon.
Claim 27
Dependent Claim
16 words
The method of claim 21 wherein the support substrate is a portion of a silicon wafer.
Claim 28
Dependent Claim
11 words
The method of claim 21 wherein the release material is conductive.
Claim 29
Dependent Claim
11 words
The method of claim 21 wherein the release material is aluminum.
Claim 30
Dependent Claim
11 words
The method of claim 21 wherein the release material is copper.
Claim 31
Dependent Claim
13 words
The method of claim 21 wherein the release material is removed by etching.
Claim 32
Dependent Claim
17 words
The method of claim 21 wherein the release material covers the first surface of the support substrate.
Claim 33
Dependent Claim
11 words
The method of claim 21 wherein the masking material is photoresist.
Claim 34
Dependent Claim
11 words
The method of claim 21 wherein the spring material comprises nickel.
Claim 35
Dependent Claim
11 words
The method of claim 21 wherein the spring material comprises cobalt.
Claim 36
Dependent Claim
33 words
The method of claim 21 wherein the spring material comprises one or more materials with final material properties and dimensions sufficient to form a resilient member after being released from the support substrate.
Claim 37
Dependent Claim
13 words
The method of claim 21 wherein the spring material is deposited by electroplating.
Claim 38
Dependent Claim
31 words
The method of claim 21 wherein the spring material is deposited by a method selected from the group consisting of plating, electroless plating, chemical vapor deposition, physical vapor deposition, and sputtering.
Claim 39
Dependent Claim
25 words
The method of claim 21 wherein the spring material is deposited to a thickness in the range of about 25 microns to about 75 microns.
Claim 40
Dependent Claim
29 words
The method of claim 21 further comprising applying a first compatibility material on the first side of the support substrate, covering at least a portion of the release material.
Claim 41
Dependent Claim
22 words
The method of claim 37 further comprising applying the masking material to mask at least a portion of the first compatibility material.
Claim 42
Dependent Claim
23 words
The method of claim 38 further comprising patterning the masking material so the selected portion exposes a portion of the first compatibility material.
Claim 43
Dependent Claim
24 words
The method of claim 37 wherein the first compatibility material comprises a material which promotes adhesion of the release material and the spring material.
Claim 44
Dependent Claim
45 words
The method of claim 37 wherein the first compatibility material comprises a material which forms a more stable interface with one or both of the release material or the spring material as compared to the interface directly between the release material and the spring material.
Claim 45
Dependent Claim
19 words
The method of claim 37 wherein the first compatibility material comprises a material which a good electrical contact material.
Claim 46
Dependent Claim
23 words
The method of claim 37 wherein the first compatibility material is selected from the group consisting of gold, rhodium, palladium, copper and cobalt.
Claim 47
Dependent Claim
30 words
The method of claim 21 further comprising applying a second compatibility material on the first side of the support substrate to cover at least a portion of the spring material.
Claim 48
Dependent Claim
24 words
The method of claim 44 wherein the second compatibility material comprises a material to promote connection or the spring material to an interconnection element.
Claim 49
Dependent Claim
31 words
The method of claim 44 wherein the second compatibility material comprises a material which forms a more stable interface with one or both of the spring material and the interconnection element.
Claim 50
Dependent Claim
22 words
The method of claim 21 further comprising shaping the support substrate to define at least partially a feature on the cantilever element.
Claim 51
Dependent Claim
19 words
The method of claim 47 further comprising etching a trench in the support substrate before applying the release material.
Claim 52
Dependent Claim
26 words
The method of claim 48 further comprising patterning the masking material so that the trench leads to the formation of a ridge on the cantilever element.
Claim 53
Dependent Claim
23 words
The method of claim 49 further comprising patterning the masking material so that the ridge is near an end of the cantilever element.
Claim 54
Dependent Claim
20 words
The method of claim 21 further comprising providing an interconnection element, and securing the interconnection element to the cantilever element.
Claim 55
Dependent Claim
15 words
The method of claim 51 further comprising securing the interconnection element to a second substrate.
Claim 56
Dependent Claim
25 words
The method of claim 51 wherein the interconnection element is a rigid structure with a connection region suitable to be secured to the cantilever element.
Claim 57
Dependent Claim
17 words
The method of claim 51 wherein the interconnection element is a post secured to a second substrate.
Claim 58
Dependent Claim
25 words
The method of claim 51 wherein the interconnection element is a resilient structure with a connection region suitable to be secured to the cantilever element.
Claim 59
Dependent Claim
20 words
The method of claim 51 wherein the interconnection element is a flexible member which is secured to the cantilever element.
Claim 60
Dependent Claim
34 words
The method of claim 51 wherein the interconnection element is a flexible member which is secured to the cantilever element and further comprising plating the flexible element so that it becomes a resilient structure.
Claim 61
Dependent Claim
10 words
The method of claim 51 wherein the securing comprises brazing.
Claim 62
Dependent Claim
10 words
The method of claim 51 wherein the securing comprises soldering.
Claim 63
Dependent Claim
13 words
The method of claim 51 wherein the securing comprises reflowing a eutectic material.
References Cited (Backward Citations)
US3302067A
Cited
US3258736A
Cited
US2429222A
Cited
DE1026876B
Cited
US2923859A
Cited
US3006067A
Cited
US3075282A
Cited
US3202489A
Cited
US3070650A
Cited
US3047683A
Cited
US3227933A
Cited
US3266137A
Cited
US3214563A
Cited
US3281751A
Cited
US3296692A
Cited
US3286340A
Cited
US3389457A
Cited
US3344228A
Cited
US3381081A
Cited
US3429040A
Cited
US3373481A
Cited
US3392442A
Cited
US3368114A
Cited
US3467765A
Cited
US3614832A
Cited
US3390308A
Cited
US3397451A
Cited
US3426252A
Cited
US3517438A
Cited
US3487541A
Cited
US3472365A
Cited
US3460238A
Cited
US3474297A
Cited
US3495170A
Cited
US3689991A
Cited
US3509270A
Cited
US3567846A
Cited
US3590480A
Cited
US3550645A
Cited
US3636242A
Cited
US3555477A
Cited
US3673681A
Cited
US3623649A
Cited
US3680206A
Cited
US3871015A
Cited
US3871014A
Cited
US3591839A
Cited
US3569610A
Cited
US3672047A
Cited
US3627124A
Cited
US3616532A
Cited
US3795037A
Cited
US3683105A
Cited
US3680037A
Cited
US3753665A
Cited
US3844909A
Cited
US3864728A
Cited
US3894671A
Cited
US3724068A
Cited
US3772575A
Cited
US3832769A
Cited
US3611061A
Cited
US3862790A
Cited
US3917900A
Cited
US3832632A
Cited
US3719981A
Cited
US3825353A
Cited
US3900153A
Cited
DE2232794B1
Cited
US3939559A
Cited
US3811186A
Cited
US3842189A
Cited
US3861135A
Cited
US3795884A
Cited
US3862791A
Cited
US3839727A
Cited
US3873173A
Cited
US3868724A
Cited
US3940786A
Cited
US3877064A
Cited
US3926360A
Cited
US3921285A
Cited
US3904262A
Cited
US4074342A
Cited
US4009485A
Cited
US3982320A
Cited
US3984166A
Cited
US3991463A
Cited
US4189825A
Cited
US4025143A
Cited
US4003621A
Cited
US3990689A
Cited
US4060828A
Cited
US4142288A
Cited
US4080722A
Cited
US4149135A
Cited
US4034468A
Cited
US4132341A
Cited
US4067104A
Cited
US4356374A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-11-29 | 2003-05-31 | 2003-11-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-11-29 | 2007-05-31 | 2007-11-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-11-29 | 2011-05-31 | 2011-11-30 | $7700.00 | Window Closed / Lapsed |