Patent US2444438A successfully refreshed from Google Patents.
US3689991A
Expired / Lapsed
US
⏱️ 0.0 years remaining
A method of manufacturing a semiconductor device utilizing a flexible carrier
Assignee: General Electric Co
•
Filing: 1970-03-06
•
Granted: 1972-09-12
•
Expires: 1990-03-06
Abstract
Abstract Semiconductor devices such as transistors are manufactured by use of a longitudinally extending tape-like carrier including a metallic layer secured to a flexible insulative layer, with the insulative layer having centrally located longitudinally spaced apertures. These apertures are covered by the metallic layer and are dimensioned to encompass contact regions of a semiconductor body such as a transistor or monolithic integrated circuit pellet. Longitudinally spaced sets of finger-like leads are formed from the metallic layer with the inner portions of the leads of each set extending cantilever-wise within the periphery of a respective adjacent aperture for registry with the contact portions of a semiconductor pellet. The leads of each set are connected to the contacts of a pellet registered with the adjacent aperture, the respective pellets and portions of the leads connected thereto are encapsulated, and the carrier may be reeled or otherwise automatically handled, with individual devices obtainable by severance from the carrier.
Inventors
- 👤 Alanson D Aird
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 19:56
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/701; H10W70/00; H10W70/01; H10W70/04; H10W70/047; H10W70/40; H10W70/453; H10W70/461; H10W70/464; H10W70/466; H10W72/071; H10W72/077; H10W90/00; H10W90/701; H10W90/731; H10W90/736; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
151 words
A process for fabricating a semiconductor device comprising forming in a flexible insulative carrier an aperture which is substantially larger than a semiconductor pellet intended to be located therein, securing a metallic foil to the carrier so that the foil entirely covers the aperture, removing portions of the foil, including portions that cover the aperture, to form on the insulative carrier a plurality of spaced finger-like leads each extending inwardly beyond the periphery of the aperture in cantilevered relation to the carrier, locating a semiconductor pellet within the aperture having formed thereon metallic contacts, the semiconductor pellet being spaced inwardly from the periphery of the aperture and the metallic contacts being registered with the cantilevered portions of the leads, simultaneously joining the inner terminations of the leads to the registered metallic contacts on the semiconductor pellet, and severing the leads within the aperture to separate the semiconductor device from the carrier.
Claim 2
Dependent Claim
151 words
A process for fabricating a semiconductor device comprising forming in a flexible insulative carrier an aperture which is substantially larger than a semiconductor pellet intended to be located therein, securing a metallic foil to the carrier so that the foil entirely covers the aperture, removing portions of the foil, including portions that cover the aperture, to form on the insulative carrier a plurality of spaced finger-like leads each extending inwardly beyond the periphery of the aperture in cantilevered relation to the carrier, locating a semiconductor pellet within the aperture having formed thereon metallic contacts, the semiconductor pellet being spaced inwardly from the periphery of the aperture and the metallic contacts being registered with the cantilevered portions of the leads, simultaneously joining the inner terminations of the leads to the registered metallic contacts on the semiconductor pellet, and severing the leads within the aperture to separate the semiconductor device from the carrier.
Claim 3
Dependent Claim
29 words
A process according to claim 1 in which the semiconductor pellet and adjacent lead portions are encapsulated within a molded housing prior to severing the leads from the carrier.
Claim 4
Dependent Claim
27 words
A process according to claim 1 in which a heat sink is attached to a surface of the semiconductor pellet opposite to that bonded to the leads.
Claim 5
Dependent Claim
63 words
A process according to claim 1 in which the inner terminations of the leads are joined to the metallic contacts of the semiconductor pellet by bringing a heatable bonding tool into engagement with the portions of the leads that overlie the semiconductor pellet, the heatable bonding tool remaining spaced from the surrounding carrier, and generating heat wiThin the bonding tool to effect bonding.
Claim 6
Dependent Claim
176 words
A process for fabricating a semiconductor device comprising forming an aperture in a flexible insulative carrier for the purpose of receiving a semiconductor pellet therein, forming adjacent to, but spaced from the aperture a plurality of slots in the flexible insulative carrier, securing a metallic foil to the carrier so that the foil entirely covers the aperture and the slots, removing portions of the foil, including portions that cover the aperture and slots, to form on the insulative carrier a plurality of spaced finger-like leads each extending inwardly beyond the periphery of the aperture in cantilevered relation and each extending outwardly to overlie the slots, locating a semiconductor pellet within the aperture having formed thereon metallic contacts so that the metallic contacts are registered with the cantilevered portions of the leads, simultaneously joining the inner terminations of the leads to the registered metallic contacts on the semiconductor pellet, and severing from the carrier the portion thereof lying between the aperture and the slots for the purpose of permitting removal of the semiconductor device from the carrier.
Claim 7
Dependent Claim
176 words
A process for fabricating a semiconductor device comprising forming an aperture in a flexible insulative carrier for the purpose of receiving a semiconductor pellet therein, forming adjacent to, but spaced from the aperture a plurality of slots in the flexible insulative carrier, securing a metallic foil to the carrier so that the foil entirely covers the aperture and the slots, removing portions of the foil, including portions that cover the aperture and slots, to form on the insulative carrier a plurality of spaced finger-like leads each extending inwardly beyond the periphery of the aperture in cantilevered relation and each extending outwardly to overlie the slots, locating a semiconductor pellet within the aperture having formed thereon metallic contacts so that the metallic contacts are registered with the cantilevered portions of the leads, simultaneously joining the inner terminations of the leads to the registered metallic contacts on the semiconductor pellet, and severing from the carrier the portion thereof lying between the aperture and the slots for the purpose of permitting removal of the semiconductor device from the carrier.
Claim 8
Dependent Claim
78 words
A process according to claim 5 in which the semiconductor pellet, the portion severed from the carrier, and the leads are mounted within a housing by the additional steps comprising attaching comparatively stiff terminal pins to those portions of the leads which originally overlay the slots, and molding an encapsulant about the semiconductor pellet, severed carrier portion retained with the semiconductor pellet, and the leads so that only the comparatively stiff terminal pins extend from the plastic encapsulant.
Claim 9
Dependent Claim
89 words
A process according to claim 5 in which the semiconductor pellet, the portion severed from the carrier, and the leads are mounted within a housing by the additional steps comprising attaching comparatively stiff terminal pins to those portions of the leads which originally overlay the slots, bonding the semiconductor pellet to a comparatively stiff terminal pin intended to serve as a heat sink for the device, and molding an encapsulant about the semiconductor pellet and leads so that only the comparatively stiff terminal pins extend from the plastic encapsulant.
Claim 10
Dependent Claim
89 words
A process according to claim 1 in which the semiconductor device removed from the carrier is mounted on a dielectric substrate by the additional steps comprising bonding a surface of the semiconductor pellet opposite to the surface bonded to the leads to the surface of a dielectric substrate, bonding the outer extremities of the leads to the dielectric substrate at locations spaced from the bonding of the semiconductor pellet thereto and spaced from each other, and forming an insulative protective member on exposed surface portions of the semiconductor pellet.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-09-12 | 1976-03-13 | 1976-09-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-09-12 | 1980-03-13 | 1980-09-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-09-12 | 1984-03-13 | 1984-09-12 | $7700.00 | Window Closed / Lapsed |