US3673681A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electrical circuit board wiring
Assignee: Recognition Equipment Inc
•
Filing: 1969-04-01
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Granted: 1972-07-04
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Expires: 1989-04-01
Abstract
Abstract In the wiring of an electrical circuit on a circuit board having solder pads suitable for connection to circuit components, insulated wire passes through a solder tip which is moved relative to the position of the board. A portion of the wire extending from the head successively contacts the pads to which a wire connection is to be made. The application of heat to the insulated wire and the pad with which the tip is in contact sublimate the insulation on the wire and reflow solders the wire to the pad.
Inventors
- 👤 James J Steranko
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 20:12
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; B; B23; B23K; B23K3/00; B23K3/02; B23K3/03; B23K3/04; B23K3/047; H05K13/00; H05K13/06; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10287; H05K2203/00; H05K2203/01; H05K2203/0195; H05K3/22; H05K3/222; H05K3/3494; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49155; Y10T29/49162
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
160 words
The method of wiring an electrical circuit on a circuit board having solder contacts suitable for connection to circuit components comprising the steps of: passing heat sublimable insulated wire from a supply through the passage of a bonding tip having a heat and force applying bonding surface, moving said bonding tip and said board relative to each other while maintaining the wire extending from said tip fixed with respect to said board so that the wire in the passage of the tip is drawn therethrough and the wire is then forced against the contact solder by pressure form the tip bonding surface, and solder bonding the wire to the contact by sublimating the insulation on the wire interposed between the said bonding surface and solder and contemporanseously causing the solder thereabout to melt and flow around the wire by heating the tip while concentrating said heat in the end of said tip so that the insulation is only locally sublimated.
Claim 2
Independent Claim
160 words
The method of wiring an electrical circuit on a circuit board having solder contacts suitable for connection to circuit components comprising the steps of: passing heat sublimable insulated wire from a supply through the passage of a bonding tip having a heat and force applying bonding surface, moving said bonding tip and said board relative to each other while maintaining the wire extending from said tip fixed with respect to said board so that the wire in the passage of the tip is drawn therethrough and the wire is then forced against the contact solder by pressure form the tip bonding surface, and solder bonding the wire to the contact by sublimating the insulation on the wire interposed between the said bonding surface and solder and contemporanseously causing the solder thereabout to melt and flow around the wire by heating the tip while concentrating said heat in the end of said tip so that the insulation is only locally sublimated.
Claim 3
Dependent Claim
32 words
The method recited in claim 1 wherein concentrating said heat in the end of said tip includes thermally insulating said tip from the body portion of a head which carries said tip.
Claim 4
Dependent Claim
47 words
The method recited in claim 1 wherein concentrating said heat in the end of said tip includes cooling the remaining portion of said wire while applying heat to the contact so that the insulation is sublimated only on that portion of the wire extending from said tip.
Claim 5
Dependent Claim
20 words
The method recited in claim 1 further comprising: soldering components to said circuit board after said board has been wired.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-07-04 | 1976-01-03 | 1976-07-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-07-04 | 1980-01-03 | 1980-07-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-07-04 | 1984-01-03 | 1984-07-04 | $7700.00 | Window Closed / Lapsed |