Sequential wire and articlebonding methods

Claim 1

IN THE MANUFACTURE OF ELECTRICAL DEVICES OF A TYPE WHEREIN AT LEAST ONE METALLIZED WAFER IS BONDED TO A HEADER AND AT LEAST ONE METALLIC LEAD WIRE IS BONDED BETWEEN A PORTION OF THE WAFER AND A TERMINAL POST ON THE HEADER, AN IMPROVED METHOD OF MAKING THE WIRE AND WAFER BONDS AND OF ASSEMBLING THE PARTS COMPRISING: (A) THERMALLY BONDING AN END OF THE WIRE TO ONE SURFACE OF A WAFER WITH A HEATED BONDED NEEDLE HAVING AN OPENING THROUGH WHICH THE END OF THE WIRE PROTRUDES, SO AS TO FORM A FIRST WIRE BOND OF SUFFICIENT STRENGTH THAT THE WIRE CAN SUPPORT THE WEIGHT OF THE WAFER; (B) MOVING THE NEEDLE TO TRANSPORT THE WAFTER TO A POSITION FACING THE HEDER AND TO PLACE THE WAFER AGAINST THE HEADER IN THE DESIRED BONDING POSITION; (C) BONDING THE WAFER TO THE HEADER; (D) MOVING THE NEEDLE TO A POSTITION OPPOSITE TO THE POST TO ADVANCE A LENGTH OF WIRE THROUGH THE NEEDLE; (E) THERMALLY BONDING A PORTION OF THE WIRE TO THE POST WITH THE NEEDLE TO FORM A SECOND WIRE BOND; AND THEN (F) BREAKING THE WIRE ADJACENT TO THE POST SO AS TO LEAVE THE LENGTH OF WIRE CONNECTING THE WAFER TO THE POST.