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US3216640A Expired / Lapsed US ⏱️ 0.0 years remaining

"bird-beak" wire bonding instrument for thermocompressively securing leads to semi-conductor devices

Assignee: Kulicke and Soffa Manufacturing Co
•
Filing: 1963-03-08
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Granted: 1965-11-09
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Expires: 1983-03-08
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Abstract

No abstract record available.

Inventors

  • 👤 Peter R Szasz

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-25 19:13
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/0711; H10W72/07141; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; Y; Y10; Y10S; Y10S228/00; Y10S228/904

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 114 words
A BONDING INSTRUMENT FOR THERMOCOMPRESSIVELY SECURING LEAD WIRE TO SEMICONDUCTOR DEVICES COMPRISING A FRAME, A BONDING HEAD VERTICALLY RECIPROCABLE IN SAID FRAME, A BONDING TOOL MOUNTED IN SAID BONDING HEAD AND HAVING A GROOVE AT THE BOTTOM SURFACE FOR CARRYING THE WIRE TO BE BONDED, DISPENSING MEANS DELIVERING WIRE TO THE GROOVE IN SAID BONDING TOOL, MEANS TO DEPRESS SAID BONDING TOOL SO THAT THE WIRE CARRIED IN THE GROOVE THEREOF WILL BE URGED INTO CONTACT WITH THE SEMICONDUCTOR, FIRST BOTTOMING MEANS TO LIMIT THE LOWERMOST POSITION OF SAID BONDING TOOL AT A FIRST LOCATION OF THE SEMICONDUCTOR, SECOND BOTTOMING MEANS TO LIMIT THE LOWERMOST POSITION OF SAID BONDING TOOL AT A SECOND LO-
Claim 2
Dependent Claim 114 words
A BONDING INSTRUMENT FOR THERMOCOMPRESSIVELY SECURING LEAD WIRE TO SEMICONDUCTOR DEVICES COMPRISING A FRAME, A BONDING HEAD VERTICALLY RECIPROCABLE IN SAID FRAME, A BONDING TOOL MOUNTED IN SAID BONDING HEAD AND HAVING A GROOVE AT THE BOTTOM SURFACE FOR CARRYING THE WIRE TO BE BONDED, DISPENSING MEANS DELIVERING WIRE TO THE GROOVE IN SAID BONDING TOOL, MEANS TO DEPRESS SAID BONDING TOOL SO THAT THE WIRE CARRIED IN THE GROOVE THEREOF WILL BE URGED INTO CONTACT WITH THE SEMICONDUCTOR, FIRST BOTTOMING MEANS TO LIMIT THE LOWERMOST POSITION OF SAID BONDING TOOL AT A FIRST LOCATION OF THE SEMICONDUCTOR, SECOND BOTTOMING MEANS TO LIMIT THE LOWERMOST POSITION OF SAID BONDING TOOL AT A SECOND LO-

References Cited (Backward Citations)

US3125906A Cited
US2111471A Cited
US2707823A Cited
US3051026A Cited
US3046006A Cited
US3101635A Cited
US3149510A Cited
US3083595A Cited
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US3116655A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1968-11-08 1969-05-10 1969-11-09 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1972-11-08 1973-05-10 1973-11-09 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1976-11-08 1977-05-10 1977-11-09 $7700.00 Window Closed / Lapsed

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