Fine wire manipulator and bonding instrument for transistors

Claim 1

A BONDING INSTRUMENT FOR SECURING FINE LEAD WIRE INTERMEDIATE A CRYSTAL WAFER AND TERMINAL POSTS ON TRANSISTOR HEADERS COMPRISING A FRAME, A TRANSISTOR HOLDER ROTATABLE ABOUT A VERTICAL AXIS IN SAID FRAME, SLIDER MEANS FOR HORIZONTALLY ADJUSTING SAID HOLDER ALONG X- AND YAXES SIMULTANEOUSLY TO REGISTER THE VERTICAL AXIS THEREOF WITH THE CENTER OF THE WAFER, A WIRE HOLDER FOR DISPENSING THE LEAD WIRE, MANIPULATING MEANS IN SAID FRAME SUPPORTING SAID WIRE HOLDER FOR HORIZONTALLY POSITIONING THE WIRE ABOVE THE WAFER ALONG X- AND Y- AXES SIMULTANEOUSLY, LEVER MEANS COUPLED WITH SAID MANIPULATING MEANS TO DEPRESS SAID WIRE HOLDER VERTICALLY SO THAT THE LEAD WIRE WILL BE URGED INTO CONTACT WITH THE WAFER, A BONDING HAMMER FOR APPLYING A PREDETERMINED FORCE AGAINST THE WIRE IN CONTACT WITH THE WAFER, A SECOND MANIPULATING MEANS IN SAID FRAME FOR HORIZONTALLY POSITIONING SAID HAMMER ABOVE THE WIRE IN CONTACT WITH THE WAFER ALONG X- AND Y- AXES SIMULTANEOUSLY, LEVER MEANS COUPLED WITH SAID SECOND MANIPULATING MEANS TO DEPRESS SAID HAMMER INTO ABUTMENT WITH THE POSITIONED WIRE, AND HEATING MEANS IN SAID TRANSISTOR HOLDER FOR ELEVATING THE TEMPERATURE OF THE TRANSISTOR HEADER WHEREBY THE LEAD WIRE WILL BE BONDED TO THE WAFER THERMO-COMPRESSIVELY WHEN THE HAMMER FORCE IS APPLIED.