US3864728A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor components having bimetallic lead connected thereto
Assignee: Siemens AG
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Filing: 1973-08-27
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Granted: 1975-02-04
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Expires: 1993-08-27
Abstract
Abstract An arrangement for the bonding of semiconductor components. Semiconductor components or an integrated circuit are connected to a carrier via metallic ribbons, which are bent with respect to their longitudinal direction, the invention assuring improved bonding of the contacts and greater reliability of the finished components.
Inventors
- 👤 Hanns-Heinz Peltz
- 👤 Hubert Pretsch
- 👤 Detlev Schmitter
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 12:25
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/701; H10P; H10P72/00; H10P72/04; H10P72/0446; H10W70/00; H10W70/40; H10W70/464; H10W70/466; H10W76/00; H10W76/10; H10W76/12; H10W76/161; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/077; H10W72/20; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
211 words
In a system comprising a semiconductor body having a pair of contact pads projecting therefrom, a pair of carriers and a pair of electrically conductive connecting means, each connecting means electrically connecting a respective one of the contact pads to a respective one of the carriers, the improvement in which each of the connecting means is in the form of a bimetallic ribbon one face and 5 to 20 Mu of the thickness of which is constituted of copper and the other faCe and 4 to 8 Mu of the thickness of which is constituted of tin, the extremities of the contact pads and one of the faces of each of the carriers lie in respective spaced parallel planes, each of the ribbons having one end portion a face of which is coincident with the plane of the extremities of the contact pads and which is in contact with the extremity of a respective one of the contact pads, an opposite end portion a face of which is coincident with the plane of said faces of the carriers and which is in contact with said face of a respective one of the carriers and an intermediate portion connecting said end portions and lying in a plane oblique to said parallel planes.
Claim 2
Dependent Claim
211 words
In a system comprising a semiconductor body having a pair of contact pads projecting therefrom, a pair of carriers and a pair of electrically conductive connecting means, each connecting means electrically connecting a respective one of the contact pads to a respective one of the carriers, the improvement in which each of the connecting means is in the form of a bimetallic ribbon one face and 5 to 20 Mu of the thickness of which is constituted of copper and the other faCe and 4 to 8 Mu of the thickness of which is constituted of tin, the extremities of the contact pads and one of the faces of each of the carriers lie in respective spaced parallel planes, each of the ribbons having one end portion a face of which is coincident with the plane of the extremities of the contact pads and which is in contact with the extremity of a respective one of the contact pads, an opposite end portion a face of which is coincident with the plane of said faces of the carriers and which is in contact with said face of a respective one of the carriers and an intermediate portion connecting said end portions and lying in a plane oblique to said parallel planes.
Claim 3
Dependent Claim
28 words
In a system according to claim 1, the improvement in which the contact pads are more closely spaced than the carriers and are symmetrically positioned between the carriers.
Claim 4
Dependent Claim
26 words
In a system according to claim 2, the improvement in which the tin face of each ribbon contacts the respective contact pad and the respective carrier.
Claim 5
Dependent Claim
24 words
In a system according to claim 3, the improvement in which each ribbon is soldered to the respective contact pad and the respective carrier.
Claim 6
Dependent Claim
26 words
In a system according to claim 4, the improvement in which the copper film is 9 Mu thick and the tin film is 6 Mu thick.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-02-03 | 1978-08-05 | 1979-02-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-02-03 | 1982-08-05 | 1983-02-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-02-03 | 1986-08-05 | 1987-02-04 | $7700.00 | Window Closed / Lapsed |