US6939739B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit packages, ball-grid array integrated circuit packages and methods of packaging an integrated circuit
Assignee: Micron Technology Inc
•
Filing: 2004-05-06
•
Granted: 2005-09-06
•
Expires: 2024-05-06
Abstract
Abstract The present invention includes integrated circuit packages, ball-grid array integrated circuit packages and methods of packaging an integrated circuit. One aspect of the present invention provides an integrated circuit package including a substrate having opposing first and second substrate surfaces and at least one electrical connection supported by the first substrate surface and adapted to couple with circuitry external of the package; a semiconductor die including circuitry electrically coupled with the at least one electrical connection; a first die surface coupled with the second substrate surface; a second die surface; and a cover coupled with the second die surface. Another aspect of the present invention includes a method of packaging an integrated circuit including providing a semiconductor die having circuitry; providing a substrate having at least one electrical connection; electrically coupling the circuitry of the semiconductor die with the at least one electrical connection; providing a cover; and covering a surface of the semiconductor die using the cover, the covering including contacting the solid cover with the semiconductor die surface.
Inventors
- 👤 David J. Corisis
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:03
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/688; H10W70/68; H10W72/00; H10W72/071; H10W72/075; H10W72/50; H10W72/551; H10W72/851; H10W72/853; H10W72/865; H10W72/90; H10W72/951; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
73 words
A method of packaging an integrated circuit comprising: providing a semiconductor die having circuitry; providing a substrate having at least one electrical connection; electrically coupling the circuitry of the semiconductor die with the at least one electrical connection; providing an electrically insulative cover; contacting the cover with a surface of the semiconductor die; and adhering the cover and the substrate using an adhesive provided laterally outwardly of a periphery of the semiconductor die.
Claim 2
Independent Claim
73 words
A method of packaging an integrated circuit comprising: providing a semiconductor die having circuitry; providing a substrate having at least one electrical connection; electrically coupling the circuitry of the semiconductor die with the at least one electrical connection; providing an electrically insulative cover; contacting the cover with a surface of the semiconductor die; and adhering the cover and the substrate using an adhesive provided laterally outwardly of a periphery of the semiconductor die.
Claim 3
Dependent Claim
17 words
The method according to claim 1 further comprising spacing the cover from the substrate during the contacting.
Claim 4
Dependent Claim
25 words
The method according to claim 1 wherein the providing comprises providing a cover having a substantially preformed shape and the providing is before the contacting.
Claim 5
Dependent Claim
15 words
The method according to claim 1 wherein the providing comprises providing a substantially planar cover.
Claim 6
Dependent Claim
21 words
The method according to claim 1 further comprising coupling the at least one electrical connection with external circuitry following the contacting.
Claim 7
Dependent Claim
23 words
The method according to claim 1 wherein the contacting comprises contacting substantially the entire area of the semiconductor die surface with the cover.
Claim 8
Dependent Claim
19 words
The method according to claim 1 further comprising covering only one surface of the semiconductor die using the cover.
Claim 9
Dependent Claim
23 words
The method according to claim 1 wherein the providing the substrate comprises providing a ball-grid array substrate having a plurality of conductive balls.
Claim 10
Dependent Claim
32 words
The method according to claim 1 wherein the providing the substrate comprises providing a ball-grid array substrate having a plurality of conductive balls having a pitch of approximately one millimeter or less.
Claim 11
Dependent Claim
16 words
The method according to claim 1 wherein the cover is not adhered to the semiconductor die.
Claim 12
Dependent Claim
28 words
The method according to claim 1 wherein the contacting provides an integrated circuit package comprising the semiconductor die having a plurality of outwardly exposed die surfaces during operation.
Claim 13
Dependent Claim
69 words
An integrated circuit packaging method comprising: first physically coupling a semiconductor die and a substrate; electrically coupling circuitry of the semiconductor die with an electrical connection of the substrate; second physically coupling a cover with the semiconductor die; and wherein the second physically coupling provides the coupled semiconductor die and cover in an arrangement wherein a plurality of die surfaces of the semiconductor die are outwardly exposed during operation.
Claim 14
Dependent Claim
69 words
An integrated circuit packaging method comprising: first physically coupling a semiconductor die and a substrate; electrically coupling circuitry of the semiconductor die with an electrical connection of the substrate; second physically coupling a cover with the semiconductor die; and wherein the second physically coupling provides the coupled semiconductor die and cover in an arrangement wherein a plurality of die surfaces of the semiconductor die are outwardly exposed during operation.
Claim 15
Dependent Claim
65 words
An integrated circuit packaging method comprising: first physically coupling a semiconductor die and a substrate; electrically coupling circuitry of the semiconductor die with an electrical connection of the substrate; second physically coupling a cover with the semiconductor die; and wherein the second physically coupling comprises coupling using an adhesive provided laterally outside a periphery of the semiconductor die and intermediate the substrate and the cover.
Claim 16
Dependent Claim
65 words
An integrated circuit packaging method comprising: first physically coupling a semiconductor die and a substrate; electrically coupling circuitry of the semiconductor die with an electrical connection of the substrate; second physically coupling a cover with the semiconductor die; and wherein the second physically coupling comprises coupling using an adhesive provided laterally outside a periphery of the semiconductor die and intermediate the substrate and the cover.
Claim 17
Independent Claim
64 words
A method of packaging an integrated circuit comprising: providing a semiconductor die having circuitry; providing a substrate having at least one electrical connection; electrically coupling the circuitry of the semiconductor die with the at least one electrical connection; providing an electrically insulative cover; contacting the cover with a surface of the semiconductor die; and wherein the cover is not adhered to the semiconductor die.
Claim 18
Independent Claim
64 words
A method of packaging an integrated circuit comprising: providing a semiconductor die having circuitry; providing a substrate having at least one electrical connection; electrically coupling the circuitry of the semiconductor die with the at least one electrical connection; providing an electrically insulative cover; contacting the cover with a surface of the semiconductor die; and wherein the cover is not adhered to the semiconductor die.
Claim 19
Independent Claim
76 words
A method of packaging an integrated circuit comprising: providing a semiconductor die having circuitry; providing a substrate having at least one electrical connection; electrically coupling the circuitry of the semiconductor die with the at least one electrical connection; providing an electrically insulative cover; contacting the cover with a surface of the semiconductor die; and wherein the contacting provides an integrated circuit package comprising the semiconductor die having a plurality of outwardly exposed die surfaces during operation.
Claim 20
Independent Claim
76 words
A method of packaging an integrated circuit comprising: providing a semiconductor die having circuitry; providing a substrate having at least one electrical connection; electrically coupling the circuitry of the semiconductor die with the at least one electrical connection; providing an electrically insulative cover; contacting the cover with a surface of the semiconductor die; and wherein the contacting provides an integrated circuit package comprising the semiconductor die having a plurality of outwardly exposed die surfaces during operation.
References Cited (Backward Citations)
US5021300A
Cited
US5559369A
Cited
US5248895A
Cited
US5289346A
Cited
US5442231A
Cited
US5359768A
Cited
US5352851A
Cited
US5300812A
Cited
US5650593A
Cited
US5972736A
Cited
US5661086A
Cited
US5677566A
Cited
US6198162B1
Cited
US5739585A
Cited
US5985697A
Cited
US5726079A
Cited
US5817535A
Cited
US5723907A
Cited
US6214641B1
Cited
US5998865A
Cited
US5857767A
Cited
US5990550A
Cited
US6507116B1
Cited
US6020637A
Cited
US6225695B1
Cited
US6107683A
Cited
US6284571B1
Cited
US5998241A
Cited
US5998860A
Cited
US6343019B1
Cited
US6249041B1
Cited
US6518098B2
Cited
US6326687B1
Cited
US6399425B1
Cited
US6008074A
Cited
US6255140B1
Cited
US6271586B1
Cited
US6048755A
Cited
US5999415A
Cited
US6498052B2
Cited
US6461894B2
Cited
US6528890B1
Cited
US6229227B1
Cited
US6215180B1
Cited
US6122171A
Cited
US6300165B2
Cited
US6586280B2
Cited
US6507114B2
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2008-09-05 | 2009-03-07 | 2009-09-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2012-09-05 | 2013-03-07 | 2013-09-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2016-09-05 | 2017-03-07 | 2017-09-06 | $7700.00 | Window Closed / Lapsed |