US6399425B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of encapsulating semiconductor devices utilizing a dispensing apparatus with rotating orifices
Assignee: Micron Technology Inc
•
Filing: 1998-09-02
•
Granted: 2002-06-04
•
Expires: 2018-09-02
Abstract
Abstract In one aspect, the invention includes a method of encapsulating a semiconductor device, comprising: a) providing a semiconductor device; b) providing a dispensing apparatus having a plurality of dispensing orifices proximate the semiconductor device; and c) dispensing a liquid encapsulating material through the plurality of orifices and over the semiconductor device. In another aspect, the invention includes a method of forming an electronic package, comprising: a) providing a circuit board having a circuit pattern; b) joining a plurality of semiconductor devices to the circuit board in electrical connection with the circuit pattern; c) providing a dispensing apparatus having a plurality of dispensing orifices proximate the semiconductor devices; d) simultaneously dispensing liquid encapsulating material through at least two of the plurality of orifices and over at least two of the semiconductor devices; and e) curing the liquid encapsulating material.
Inventors
- 👤 Joseph M. Brand
- 👤 Scott Gooch
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:50
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/01; H10W72/00; H10W72/01; H10W72/0198; H10W72/50; H10W72/541; H10W72/5445; H10W72/551; H10W72/552; H10W72/5522; H10W90/00; H10W90/701; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49146; Y10T29/49169; Y10T29/49171; Y10T29/49172
Claims Analysis
Total Claims: 63
Claim 1
Independent Claim
106 words
A method of encapsulating a semiconductor device, comprising: providing at least one semiconductor device; providing a dispensing apparatus having a plurality of dispensing orifices proximate the at least one semiconductor device; dispensing a first liquid encapsulating material through at least one of the plurality of orifices and over the at least one semiconductor device and dispensing a second liquid encapsulating material through at least one other of the plurality of orifices, wherein the first liquid encapsulating material is different from the second liquid encapsulating material; and wherein the plurality of dispensing orifices has rotational movement while maintaining the proximity to the at least one semiconductor device.
Claim 2
Independent Claim
106 words
A method of encapsulating a semiconductor device, comprising: providing at least one semiconductor device; providing a dispensing apparatus having a plurality of dispensing orifices proximate the at least one semiconductor device; dispensing a first liquid encapsulating material through at least one of the plurality of orifices and over the at least one semiconductor device and dispensing a second liquid encapsulating material through at least one other of the plurality of orifices, wherein the first liquid encapsulating material is different from the second liquid encapsulating material; and wherein the plurality of dispensing orifices has rotational movement while maintaining the proximity to the at least one semiconductor device.
Claim 3
Dependent Claim
20 words
The method of claim 1 wherein the first liquid encapsulating material is dispensed onto the at least one semiconductor device.
Claim 4
Dependent Claim
16 words
The method of claim 1 further comprising curing the dispensed first and second liquid encapsulating materials.
Claim 5
Dependent Claim
23 words
The method of claim 1 wherein the dispensing comprises flowing the first and second liquid encapsulating materials simultaneously through the plurality of orifices.
Claim 6
Dependent Claim
37 words
The method of claim 1 wherein the dispensing comprises moving the at least one of the orifices relative to the at least one semiconductor device while flowing the liquid encapsulating material through the at least one orifice.
Claim 7
Dependent Claim
16 words
The method of claim 5 wherein the moving comprises moving the at least one semiconductor device.
Claim 8
Dependent Claim
15 words
The method of claim 5 wherein the moving comprises moving the at least one orifice.
Claim 9
Dependent Claim
17 words
The method of claim 1 wherein the at least one semiconductor device is an integrated circuit chip.
Claim 10
Independent Claim
106 words
A method of forming an electronic package, comprising: providing a circuit board comprising a circuit pattern; joining a semiconductor device to the circuit board in electrical connection with the circuit pattern; providing a dispensing apparatus having a plurality of dispensing orifices proximate the semiconductor device; dispensing liquid encapsulating material through the plurality of orifices and onto the semiconductor device, wherein at least one orifice dispenses liquid encapsulating material only onto the semiconductor device; curing the liquid encapsulating material; and wherein the plurality of dispensing orifices has rotational movement about a vertical pivot axis spaced from the dispensing orifices while maintaining the proximity to the semiconductor device.
Claim 11
Independent Claim
106 words
A method of forming an electronic package, comprising: providing a circuit board comprising a circuit pattern; joining a semiconductor device to the circuit board in electrical connection with the circuit pattern; providing a dispensing apparatus having a plurality of dispensing orifices proximate the semiconductor device; dispensing liquid encapsulating material through the plurality of orifices and onto the semiconductor device, wherein at least one orifice dispenses liquid encapsulating material only onto the semiconductor device; curing the liquid encapsulating material; and wherein the plurality of dispensing orifices has rotational movement about a vertical pivot axis spaced from the dispensing orifices while maintaining the proximity to the semiconductor device.
Claim 12
Dependent Claim
42 words
The method of claim 9 wherein the dispensing comprises dispensing liquid through only one of the orifices and onto the semiconductor device, and dispensing liquid through a remainder of the plurality of orifices and onto the circuit board proximate the semiconductor device.
Claim 13
Dependent Claim
44 words
The method of claim 9 wherein the dispensing comprises dispensing liquid through the at least one of the orifices and onto the semiconductor device, and dispensing liquid through a remainder of the plurality of orifices and onto the circuit board proximate the semiconductor device.
Claim 14
Dependent Claim
26 words
The method of claim 11 wherein the liquid dispensed through the remainder of orifices is the same as that dispensed through the at least one orifice.
Claim 15
Dependent Claim
25 words
The method of claim 11 wherein the liquid dispensed through the remainder of orifices is different than that dispensed through the at least one orifice.
Claim 16
Dependent Claim
24 words
The method of claim 11 wherein the dispensing through the remainder of orifices occurs simultaneously with the dispensing through the at least one orifice.
Claim 17
Dependent Claim
15 words
The method of claim 11 wherein the remainder of orifices comprises at least four orifices.
Claim 18
Dependent Claim
14 words
The method of claim 15 wherein the semiconductor device comprises a square-shaped lateral periphery.
Claim 19
Dependent Claim
14 words
The method of claim 9 wherein the semiconductor device is an integrated circuit chip.
Claim 20
Dependent Claim
43 words
The method of claim 9 wherein the dispensing comprises dispensing liquid through only one of the orifices and onto the semiconductor device, and dispensing liquid through a remainder of the plurality of orifices and onto the circuit board to encircle the semiconductor device.
Claim 21
Dependent Claim
14 words
The method of claim 9 wherein the vertical axis extends through the semiconductor device.
Claim 22
Independent Claim
126 words
A method of encapsulating at least two semiconductor devices, comprising: providing at least two semiconductor devices over a substrate; a providing a dispensing apparatus having at least two dispensing orifices, a first of the at least two dispensing orifices being received proximate a first of the at least two semiconductor devices and a second of the at least two dispensing orifices being received proximate a second of the at least two semiconductor devices wherein the at least two dispensing orifices has rotation about a vertical pivot axis spaced from the dispensing orifices; and simultaneously dispensing a liquid encapsulating material through the at least two orifices and over the at least two semiconductor devices wherein the dispensing apparatus is continuously spaced from the semiconductor devices and substrate.
Claim 23
Independent Claim
126 words
A method of encapsulating at least two semiconductor devices, comprising: providing at least two semiconductor devices over a substrate; a providing a dispensing apparatus having at least two dispensing orifices, a first of the at least two dispensing orifices being received proximate a first of the at least two semiconductor devices and a second of the at least two dispensing orifices being received proximate a second of the at least two semiconductor devices wherein the at least two dispensing orifices has rotation about a vertical pivot axis spaced from the dispensing orifices; and simultaneously dispensing a liquid encapsulating material through the at least two orifices and over the at least two semiconductor devices wherein the dispensing apparatus is continuously spaced from the semiconductor devices and substrate.
Claim 24
Dependent Claim
23 words
The method of claim 20 wherein the liquid encapsulating material is dispensed onto at least one of the at least two semiconductor devices.
Claim 25
Dependent Claim
21 words
The method of claim 20 wherein the liquid encapsulating material is dispensed onto both of the at least two semiconductor devices.
Claim 26
Dependent Claim
13 words
The method of claim 20 further comprising curing the dispensed liquid encapsulating material.
Claim 27
Dependent Claim
32 words
The method of claim 20 wherein the dispensing comprises moving the at least two orifices relative to the semiconductor devices while flowing the liquid encapsulating material through the at least two orifices.
Claim 28
Dependent Claim
13 words
The method of claim 20 wherein the semiconductor devices are integrated circuit chips.
Claim 29
Independent Claim
101 words
A method of encapsulating a plurality of semiconductor devices, comprising: providing a plurality of semiconductor devices over substrate; providing a dispensing apparatus having an array of dispensing orifice sets, individual sets of the array being in correspondence with individual semiconductor devices of the plurality of semiconductor devices wherein at least one dispensing orifice has rotation about a vertical pivot axis spaced from the at least one dispensing orifice; and simultaneously dispensing liquid encapsulating material through orifices of different sets, and at least a portion of the liquid encapsulating material defining a discrete portion over the semiconductor device spaced from the substrate.
Claim 30
Independent Claim
101 words
A method of encapsulating a plurality of semiconductor devices, comprising: providing a plurality of semiconductor devices over substrate; providing a dispensing apparatus having an array of dispensing orifice sets, individual sets of the array being in correspondence with individual semiconductor devices of the plurality of semiconductor devices wherein at least one dispensing orifice has rotation about a vertical pivot axis spaced from the at least one dispensing orifice; and simultaneously dispensing liquid encapsulating material through orifices of different sets, and at least a portion of the liquid encapsulating material defining a discrete portion over the semiconductor device spaced from the substrate.
Claim 31
Dependent Claim
49 words
The method of claim 26 wherein the array of dispensing orifice sets is aligned with a first array of the plurality of semiconductor devices during the dispensing, the method further comprising moving the array dispensing orifice sets to alignment with a second array of semiconductor devices after the dispensing.
Claim 32
Dependent Claim
20 words
The method of claim 26 wherein the liquid encapsulating material dispensed through each of the different sets is the same.
Claim 33
Dependent Claim
13 words
The method of claim 26 further comprising curing the dispensed liquid encapsulating material.
Claim 34
Dependent Claim
24 words
The method of claim 26 wherein the dispensing comprises moving at least some of the orifices relative to the semiconductor devices during the dispensing.
Claim 35
Dependent Claim
13 words
The method of claim 26 wherein the semiconductor devices are integrated circuit chips.
Claim 36
Dependent Claim
78 words
The method of claim 26 wherein the individual sets comprise at least one interiorly located orifice and remaining orifices peripheral to the at least one interiorly located orifice, the dispensing from an individual set comprising: dispensing a first liquid encapsulating material through the at least one interiorly located orifice and over a corresponding semiconductor device; and dispensing a second liquid encapsulating material through the remaining orifices and over a portion of the substrate proximate the corresponding semiconductor device.
Claim 37
Dependent Claim
24 words
The method of claim 32 wherein the at least one interiorly located orifice is one orifice, and wherein the remaining orifices are four orifices.
Claim 38
Dependent Claim
16 words
The method of claim 32 wherein the first and second liquid encapsulating materials are the same.
Claim 39
Dependent Claim
25 words
The method of claim 32 wherein the dispensing through said at least one interiorly located orifice occurs simultaneously with the dispensing through said remaining orifices.
Claim 40
Dependent Claim
24 words
The method of claim 32 wherein the dispensing through said at least one interiorly located orifice occurs after the dispensing through said remaining orifices.
Claim 41
Independent Claim
113 words
A method of encapsulating a plurality of semiconductor devices, comprising: providing a plurality of semiconductor devices over substrate; providing a dispensing apparatus having an array of spaced dispensing orifices, individuals of the array being in correspondence with individual semiconductor devices of the plurality of semiconductor devices wherein at least one dispensing orifice has rotation about a vertical pivot axis spaced from the at least one dispensing orifice; and simultaneously dispensing liquid encapsulating material through at least two of the spaced dispensing orifices and onto at least two of the individual semiconductor devices, at least a portion of the liquid encapsulating material defining a discrete portion over the semiconductor device spaced from the substrate.
Claim 42
Independent Claim
113 words
A method of encapsulating a plurality of semiconductor devices, comprising: providing a plurality of semiconductor devices over substrate; providing a dispensing apparatus having an array of spaced dispensing orifices, individuals of the array being in correspondence with individual semiconductor devices of the plurality of semiconductor devices wherein at least one dispensing orifice has rotation about a vertical pivot axis spaced from the at least one dispensing orifice; and simultaneously dispensing liquid encapsulating material through at least two of the spaced dispensing orifices and onto at least two of the individual semiconductor devices, at least a portion of the liquid encapsulating material defining a discrete portion over the semiconductor device spaced from the substrate.
Claim 43
Independent Claim
118 words
A method of forming an electronic package, comprising: providing a circuit board comprising a circuit pattern; joining a plurality of semiconductor devices to the circuit board in electrical connection with the circuit pattern; providing a dispensing apparatus having a plurality of dispensing orifices proximate the semiconductor devices wherein the plurality of dispensing orifices has rotational movement about a vertical pivot axis spaced from the plurality of dispensing orifices; simultaneously dispensing liquid encapsulating material through at least two of the plurality of orifices and over at least two of the semiconductor devices, at least a portion of the liquid encapsulating material defining a discrete portion over the semiconductor device spaced from the substrate; and curing the liquid encapsulating material.
Claim 44
Independent Claim
118 words
A method of forming an electronic package, comprising: providing a circuit board comprising a circuit pattern; joining a plurality of semiconductor devices to the circuit board in electrical connection with the circuit pattern; providing a dispensing apparatus having a plurality of dispensing orifices proximate the semiconductor devices wherein the plurality of dispensing orifices has rotational movement about a vertical pivot axis spaced from the plurality of dispensing orifices; simultaneously dispensing liquid encapsulating material through at least two of the plurality of orifices and over at least two of the semiconductor devices, at least a portion of the liquid encapsulating material defining a discrete portion over the semiconductor device spaced from the substrate; and curing the liquid encapsulating material.
Claim 45
Dependent Claim
19 words
The method of claim 38 wherein the dispensing comprises dispensing the liquid onto the at least two semiconductor devices.
Claim 46
Dependent Claim
58 words
The method of claim 38 wherein the dispensing comprises: dispensing a first liquid encapsulating material through the at least two orifices and over the at least two semiconductor devices; and dispensing a second liquid encapsulating material through a remainder of the plurality of orifices and onto portions of the circuit board proximate the at least two semiconductor devices.
Claim 47
Dependent Claim
26 words
The method of claim 40 wherein the liquid dispensed through the remainder of orifices is the same as that dispensed through the at least two orifices.
Claim 48
Dependent Claim
24 words
The method of claim 40 wherein the dispensing through the remainder of orifices occurs simultaneously with the dispensing through the at least two orifices.
Claim 49
Dependent Claim
23 words
The method of claim 40 wherein the dispensing through the remainder of orifices occurs before the dispensing through the at least two orifices.
Claim 50
Dependent Claim
14 words
The method of claim 38 wherein the semiconductor device is an integrated circuit chip.
Claim 51
Independent Claim
200 words
A method of forming an electronic package, comprising: providing a circuit board comprising a circuit pattern; joining a plurality of semiconductor devices to the circuit board in electrical connection with the circuit pattern, the semiconductor devices being arranged in a plurality of arrays; providing a dispensing apparatus having a plurality of dispensing orifices proximate some of the semiconductor devices, the dispensing orifices being arranged in a single array of orifice sets which is aligned with a single of the semiconductor device arrays wherein at least one dispensing orifice has rotational movement about a vertical pivot axis spaced from the at least one dispensing orifice; simultaneously dispensing liquid encapsulating material through the array of orifice sets and over the single array of semiconductor devices wherein at least a portion of the liquid encapsulating material defines a discrete portion over the semiconductor device spaced from the substrate; moving the orifice sets to align with another of the semiconductor device arrays; and simultaneously dispensing liquid encapsulating material through the array of orifice sets and over the other array of semiconductor devices wherein at least a portion of the liquid encapsulating material defines a discrete portion over the semiconductor device spaced from the substrate.
Claim 52
Independent Claim
200 words
A method of forming an electronic package, comprising: providing a circuit board comprising a circuit pattern; joining a plurality of semiconductor devices to the circuit board in electrical connection with the circuit pattern, the semiconductor devices being arranged in a plurality of arrays; providing a dispensing apparatus having a plurality of dispensing orifices proximate some of the semiconductor devices, the dispensing orifices being arranged in a single array of orifice sets which is aligned with a single of the semiconductor device arrays wherein at least one dispensing orifice has rotational movement about a vertical pivot axis spaced from the at least one dispensing orifice; simultaneously dispensing liquid encapsulating material through the array of orifice sets and over the single array of semiconductor devices wherein at least a portion of the liquid encapsulating material defines a discrete portion over the semiconductor device spaced from the substrate; moving the orifice sets to align with another of the semiconductor device arrays; and simultaneously dispensing liquid encapsulating material through the array of orifice sets and over the other array of semiconductor devices wherein at least a portion of the liquid encapsulating material defines a discrete portion over the semiconductor device spaced from the substrate.
Claim 53
Dependent Claim
13 words
The method of claim 45 wherein the individual orifice sets comprise five orifices.
Claim 54
Dependent Claim
77 words
The method of claim 45 wherein the individual orifice sets comprise at least two orifices, and wherein the dispensing from an individual orifice set comprises: dispensing a first liquid encapsulating material through one of the at least two orifices and over an individual of the plurality of semiconductor devices; and dispensing a second liquid encapsulating material through a second of the at least two orifices and over portions of the circuit board proximate the individual semiconductor device.
Claim 55
Dependent Claim
16 words
The method of claim 47 wherein the first and second liquid encapsulating materials are the same.
Claim 56
Dependent Claim
15 words
The method of claim 47 wherein the first and second liquid encapsulating materials are different.
Claim 57
Dependent Claim
16 words
The method of claim 47 wherein the first and second liquid encapsulating materials are dispensed simultaneously.
Claim 58
Dependent Claim
78 words
The method of claim 45 wherein the orifice sets comprise at least one interiorly located orifice and remaining peripherally located orifices, and wherein the dispensing from an individual orifice set comprises: dispensing a first liquid encapsulating material through said at least one interiorly located orifice and onto an individual of the plurality of semiconductor devices; and dispensing a second liquid encapsulating material through said remaining orifices and onto portions of the circuit board proximate the individual semiconductor device.
Claim 59
Dependent Claim
71 words
The method of claim 45 wherein the orifice sets comprise five orifices, and wherein the dispensing from an individual orifice set comprises: dispensing a first liquid encapsulating material through one of the five orifices and onto an individual of the plurality of semiconductor devices; and dispensing a second liquid encapsulating material through a remaining four of the five orifices and onto portions of the circuit board proximate the individual semiconductor device.
Claim 60
Dependent Claim
16 words
The method of claim 52 wherein the first and second liquid encapsulating materials are the same.
Claim 61
Dependent Claim
16 words
The method of claim 52 wherein the first and second liquid encapsulating materials are dispensed simultaneously.
Claim 62
Independent Claim
198 words
A method of forming an electronic package, comprising: providing a circuit board comprising a circuit pattern; joining a plurality of semiconductor devices to the circuit board in electrical connection with the circuit pattern, the semiconductor devices being arranged in a plurality of arrays; providing a dispensing apparatus having a plurality of spaced dispensing orifices proximate some of the semiconductor devices, the spaced dispensing orifices being arranged in a single array which is aligned with a single of the semiconductor device arrays wherein at least one dispensing orifice has rotational movement about a vertical pivot axis spaced from the at least one dispensing orifice; simultaneously dispensing liquid encapsulating material through the array of orifices and over the single array of semiconductor devices wherein at least a portion of the liquid encapsulating material defines a discrete portion over the circuit board spaced from the semiconductor devices; moving the orifices to align with another of the semiconductor device arrays; and simultaneously dispensing liquid encapsulating material through the array of orifices and over the other array of semiconductor devices wherein at least a portion of the liquid encapsulating material defines a discrete portion over the circuit board spaced from the semiconductor devices.
Claim 63
Independent Claim
198 words
A method of forming an electronic package, comprising: providing a circuit board comprising a circuit pattern; joining a plurality of semiconductor devices to the circuit board in electrical connection with the circuit pattern, the semiconductor devices being arranged in a plurality of arrays; providing a dispensing apparatus having a plurality of spaced dispensing orifices proximate some of the semiconductor devices, the spaced dispensing orifices being arranged in a single array which is aligned with a single of the semiconductor device arrays wherein at least one dispensing orifice has rotational movement about a vertical pivot axis spaced from the at least one dispensing orifice; simultaneously dispensing liquid encapsulating material through the array of orifices and over the single array of semiconductor devices wherein at least a portion of the liquid encapsulating material defines a discrete portion over the circuit board spaced from the semiconductor devices; moving the orifices to align with another of the semiconductor device arrays; and simultaneously dispensing liquid encapsulating material through the array of orifices and over the other array of semiconductor devices wherein at least a portion of the liquid encapsulating material defines a discrete portion over the circuit board spaced from the semiconductor devices.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 2005-06-03 | 2005-12-03 | 2006-06-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-06-03 | 2009-12-03 | 2010-06-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-06-03 | 2013-12-03 | 2014-06-04 | $7700.00 | Window Closed / Lapsed |