US5128746A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Adhesive and encapsulant material with fluxing properties
Assignee: Motorola Solutions Inc
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Filing: 1990-09-27
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Granted: 1992-07-07
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Expires: 2010-09-27
Abstract
Abstract An adhesive material 120 including a fluxing agent is applied to either a substrate 100 having a metallization pattern 110 or a solder bumped electrical component 130. The component 130 is positioned on the substrate 110 and the solder bump 140 is reflowed. During the reflow step, the fluxing agent promotes adhesion of the solder 140 to the substrate metallization pattern 110, and the adhesive material 120 is cured to mechanically interconnect and encapsulate the substrate 110 to the component 130.
Inventors
- 👤 Robert W. Pennisi
- 👤 Marc V. Papageorge
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 15:04
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/303; H05K3/305; B; B23; B23K; B23K35/00; B23K35/22; B23K35/36; B23K35/3612; B23K35/3613; H10; H10W; H10W72/00; H10W72/30; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0145; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10674; H05K2201/10734; H05K2201/10954; H05K2201/10977; H05K2203/00; H05K2203/11; H05K2203/1189; H05K3/32; H05K3/34; H05K3/3489; H10W72/071; H10W72/072; H10W72/073; H10W72/20; H10W72/241; H10W72/851; H10W72/853; H10W72/856; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
88 words
A thermally curable adhesive having a fluxing agent for use in reflow soldering an electrical component and a substrate, comprising an adhesive that removes oxide coatings from the electrical component or the substrate and at least partially cures when heated to soldering temperatures, said adhesive consisting essentially of a thermoset resin, a fluxing agent in an amount sufficient to remove said oxide coatings from said component or said substrate, and a curing agent that reacts with and cures the thermoset resin when the thermally curable adhesive is heated.
Claim 2
Dependent Claim
88 words
A thermally curable adhesive having a fluxing agent for use in reflow soldering an electrical component and a substrate, comprising an adhesive that removes oxide coatings from the electrical component or the substrate and at least partially cures when heated to soldering temperatures, said adhesive consisting essentially of a thermoset resin, a fluxing agent in an amount sufficient to remove said oxide coatings from said component or said substrate, and a curing agent that reacts with and cures the thermoset resin when the thermally curable adhesive is heated.
Claim 3
Dependent Claim
13 words
The adhesive of claim 1, wherein the thermoset resin is epoxy or polyester.
Claim 4
Dependent Claim
23 words
The adhesive of claim 1, wherein the fluxing agent comprises a compound having the formula: ##STR2## where R is an electron withdrawing group.
Claim 5
Dependent Claim
24 words
The fluxing agent of claim 3, wherein R is selected from the group consisting of fluorine, chlorine, bromine, iodine, sulfur, hydroxyl, nitrile, and benzyl.
Claim 6
Dependent Claim
12 words
The adhesive of claim 1, wherein the fluxing agent is malic acid.
Claim 7
Dependent Claim
27 words
The adhesive of claim 1, wherein the proportion of the fluxing agent in the adhesive ranges from about 0.1 to about 16 weight % of the adhesive.
Claim 8
Dependent Claim
136 words
An electrical component assembly, comprising; an electrical component having a plurality of electrical terminations, each termination including a solder bump, a component carrying substrate having a plurality of electrical terminations corresponding to the terminations of the electrical component, a thermally curable adhesive material that removes oxide coatings from the component plurality of electrical terminations and the substrate plurality of electrical terminations when heated to soldering temperatures, comprising; an epoxy resin, a curing agent that reacts with and cures the epoxy resin when the thermally curable adhesive is heated, and a fluxing agent in an amount sufficient to remove said oxide coatings from said component terminations or said substrate terminations, the adhesive material disposed between and bonding the electrical component and the substrate, the solder bump being reflowed and electrically connecting the electrical component to the substrate.
Claim 9
Dependent Claim
136 words
An electrical component assembly, comprising; an electrical component having a plurality of electrical terminations, each termination including a solder bump, a component carrying substrate having a plurality of electrical terminations corresponding to the terminations of the electrical component, a thermally curable adhesive material that removes oxide coatings from the component plurality of electrical terminations and the substrate plurality of electrical terminations when heated to soldering temperatures, comprising; an epoxy resin, a curing agent that reacts with and cures the epoxy resin when the thermally curable adhesive is heated, and a fluxing agent in an amount sufficient to remove said oxide coatings from said component terminations or said substrate terminations, the adhesive material disposed between and bonding the electrical component and the substrate, the solder bump being reflowed and electrically connecting the electrical component to the substrate.
Claim 10
Dependent Claim
25 words
The electrical component assembly of claim 7, wherein the fluxing agent comprises a compound having the formula: ##STR3## where R is an electron withdrawing group.
Claim 11
Dependent Claim
24 words
The fluxing agent of claim 8, wherein R is selected from the group consisting of fluorine, chlorine, bromine, iodine, sulfur, hydroxyl, nitrile, and benzyl.
Claim 12
Dependent Claim
12 words
The fluxing agent of claim 8, wherein the compound is malic acid.
Claim 13
Dependent Claim
30 words
The electrical component assembly of claim 7, wherein the proportion of the fluxing agent in the adhesive ranges from about 0.1 to about 16 weight % of the adhesive material.
Claim 14
Dependent Claim
14 words
The electrical component assembly of claim 7, wherein the component is an integrated circuit.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-07-07 | 1996-01-06 | 1996-07-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-07-07 | 2000-01-06 | 2000-07-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-07-07 | 2004-01-06 | 2004-07-07 | $7700.00 | Window Closed / Lapsed |