US5136365A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Anisotropic conductive adhesive and encapsulant material
Assignee: Motorola Solutions Inc
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Filing: 1990-09-27
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Granted: 1992-08-04
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Expires: 2010-09-27
Abstract
Abstract An adhesive material 220 including a fluxing agent and metal particles 240 is applied to either a substrate 200 having a metallization pattern 210 or an electrical component 230. The component 230 is positioned on the substrate 210 and heated. During the heating step, the fluxing agent promotes adhesion of the metal particles 240 to the substrate metallization pattern 210 and the component, and the adhesive material 220 is cured, to mechanically interconnect and encapsulate the substrate 210 and the component 230.
Inventors
- 👤 Robert W. Pennisi
- 👤 Marc V. Papageorge
- 👤 Glenn F. Urbish
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 19:29
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H05K3/323; H10; H10W; H10W20/00; H10W20/40; H10W70/00; H10W70/60; H10W70/62; H10W70/66; H10W70/666; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0145; H05K3/34; H05K3/3489; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/073; H10W72/07331; H10W72/07337; H10W72/07338; H10W72/20; H10W72/251; H10W72/252; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/851; H10W72/853; H10W72/856
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
68 words
An adhesive having a fluxing agent and metal particles for use in reflow soldering and interconnecting an electrical component and a substrate, comprising; a thermoset resin, a fluxing agent, a curing agent, and metal particles, said metal particles melting to form a metallurgical bond to the electrical component and the substrate during the reflow soldering, and said adhesive having the property of being anisotropically conductive after the reflow.
Claim 2
Dependent Claim
68 words
An adhesive having a fluxing agent and metal particles for use in reflow soldering and interconnecting an electrical component and a substrate, comprising; a thermoset resin, a fluxing agent, a curing agent, and metal particles, said metal particles melting to form a metallurgical bond to the electrical component and the substrate during the reflow soldering, and said adhesive having the property of being anisotropically conductive after the reflow.
Claim 3
Dependent Claim
13 words
The adhesive of claim 1 wherein the thermoset resin is epoxy or polyester.
Claim 4
Dependent Claim
23 words
The adhesive of claim 1, wherein the fluxing agent comprises a compound having the formula: ##STR2## where R is an electron withdrawing group.
Claim 5
Dependent Claim
24 words
The fluxing agent of claim 3, wherein R is selected from the group consisting of fluorine, chlorine, bromine, iodine, sulfur, hydroxyl, nitrile, and benzyl.
Claim 6
Dependent Claim
12 words
The adhesive of claim 1, wherein the fluxing agent is malic acid.
Claim 7
Dependent Claim
27 words
The adhesive of claim 1, wherein the proportion of the fluxing agent in the adhesive ranges from about 0.1 to about 16 weight % of the adhesive.
Claim 8
Dependent Claim
22 words
The adhesive of claim 1, wherein the metal is selected from the group consisting of lead, tin, indium, bismuth, antimony, and silver.
Claim 9
Dependent Claim
14 words
The adhesive of claim 7, wherein the metal particles are an alloy of solder.
Claim 10
Dependent Claim
22 words
The adhesive of claim 1, wherein the size of the metal particles is greater than 1 micron but less than 20 microns.
Claim 11
Dependent Claim
25 words
The adhesive of claim 1, wherein the proportion of the metal particles is greater than 50 but less than 85 weight % of the adhesive.
Claim 12
Dependent Claim
97 words
An electrical component assembly, comprising: an electrical component having a plurality of electrical terminations; a component carrying substrate having a plurality of electrical terminations corresponding to the terminations of the electrical component; and an anisotropically conductive adhesive material for connecting the electrical component to the substrate, comprising; an epoxy resin, a fluxing agent, a curing agent, and solder particles reflowed to form a metallurgical bond between and electrically connecting the electrical component and the substrate, said anisotropic adhesive material being disposed between and bonding the electrical component and the substrate, and having different conductivity in different directions.
Claim 13
Dependent Claim
97 words
An electrical component assembly, comprising: an electrical component having a plurality of electrical terminations; a component carrying substrate having a plurality of electrical terminations corresponding to the terminations of the electrical component; and an anisotropically conductive adhesive material for connecting the electrical component to the substrate, comprising; an epoxy resin, a fluxing agent, a curing agent, and solder particles reflowed to form a metallurgical bond between and electrically connecting the electrical component and the substrate, said anisotropic adhesive material being disposed between and bonding the electrical component and the substrate, and having different conductivity in different directions.
Claim 14
Dependent Claim
24 words
The adhesive material of claim 11, wherein the fluxing agent comprises a compound having the formula: ##STR3## where R is an electron withdrawing group.
Claim 15
Dependent Claim
24 words
The fluxing agent of claim 12, wherein R is selected from the group consisting of fluorine, chlorine, bromine, iodine, sulfur, hydroxyl, nitrile, and benzyl.
Claim 16
Dependent Claim
12 words
The fluxing agent of claim 12, wherein the compound is malic acid.
Claim 17
Dependent Claim
29 words
The adhesive material of claim 11, wherein the proportion of the fluxing agent in the adhesive ranges from about 0.1 to about 16 weight % of the adhesive material.
Claim 18
Dependent Claim
24 words
The adhesive of claim 11, wherein the solder is selected from the group consisting of lead, tin, indium, bismuth, antimony, silver, and alloys thereof.
Claim 19
Dependent Claim
22 words
The adhesive of claim 11, wherein the size of the solder particles is greater than 1 micron but less than 20 microns.
Claim 20
Dependent Claim
25 words
The adhesive of claim 11, wherein the proportion of the solder particles is greater than 50 but less than 85 weight % of the adhesive.
Claim 21
Dependent Claim
14 words
The electrical component assembly of claim 11, wherein the component is an integrated circuit.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-08-04 | 1996-02-03 | 1996-08-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-08-04 | 2000-02-03 | 2000-08-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-08-04 | 2004-02-03 | 2004-08-04 | $7700.00 | Window Closed / Lapsed |