US4789411A
Expired / Lapsed
US
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Conductive copper paste composition
Assignee: Tatsuta Electric Wire and Cable Co Ltd
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Filing: 1987-03-24
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Granted: 1988-12-06
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Expires: 2007-03-24
Abstract
Abstract A conductive copper paste composition is adapted to yield a highly conductive film receptive to solders without pretreatment. This conductive paste comprises a copper metal powder, a resin component including a thermosetting resin, and an assortment of additives. In use, the paste is applied to an insulation substrate to a predetermined circuit pattern and cured in situ. Soldering can then be performed directly on the cured circuit. This contributes not only to the conductivity of the circuit but dispenses with the activation treatment and electroless plating or electroplating that have heretofore been essential prior to soldering. The invention, therefore, results in a substantial curtailment of production process and a proportional economic advantage. In addition, this conductive paste can be used in such applications as electrode and through-hole connections, formation of electromagnetic and electrostatic shield layers, and so on in the manufacture and assembly of electronic components and circuits.
Inventors
- 👤 Kazumasa Eguchi
- 👤 Fumio Nakatani
- 👤 Shinichi Wakita
- 👤 Hisatoshi Murakami
- 👤 Tsunehiko Terada
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 03:29
CPC Classifications
H; H01; H01B; H01B1/00; H01B1/14; H05; H05K; H05K9/00; H05K9/0073; H05K9/0081; H05K9/0083; H01B1/20; H01B1/22; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K1/095
Claims Analysis
Total Claims: 32
Claim 1
Independent Claim
57 words
A conductive copper paste composition for application to an insulation substrate to form conductive circuit comprising a copper metal power, a resin component including a thermosetting resin, a fatty acid or a metal salt thereof assisting in the uniform dispersion of said copper metal powder into said resin component, a metal chelating agent and a soldering accelerator.
Claim 2
Dependent Claim
57 words
A conductive copper paste composition for application to an insulation substrate to form conductive circuit comprising a copper metal power, a resin component including a thermosetting resin, a fatty acid or a metal salt thereof assisting in the uniform dispersion of said copper metal powder into said resin component, a metal chelating agent and a soldering accelerator.
Claim 3
Dependent Claim
71 words
A conductive copper paste composition according to claim 1 which comprises 100 weight parts of a mixture of 85 to 95 weight percent of said copper metal powder and 15 to 5 weight percent of said resin component, 1 to 8 weight parts of said fatty acid or metal salt thereof, 1 to 50 weight parts of said metal chelating agent, and 0.1 to 2.5 weight parts of said soldering accelerator.
Claim 4
Dependent Claim
20 words
A conductive copper paste composition according to claim 1 wherein said resin component is exclusively composed of said thermosetting resin.
Claim 5
Dependent Claim
36 words
A conductive copper paste composition according to claim 1 wherein said resin component consists of 2 to 30 weight percent of a metal surface activator resin and 98 to 70 weight percent of said thermosetting resin.
Claim 6
Dependent Claim
46 words
A conductive copper paste composition according to claim 1 wherein said resin component consists of 2 to 30 weight percent of a metal surface activator resin, 5 to 50 weight percent of a granular phenolic resin and 93 to 20 weight percent of said thermosetting resin.
Claim 7
Dependent Claim
61 words
A conductive copper paste composition for application to an insulation substrate to form a conductive circuit comprising a copper metal powder, a resin component including a metal surface activator resin and a thermosetting resin, a fatty acid or a metal salt thereof assisting in the uniform dispersion of said copper metal powder into said resin component, and a metal chelating agent.
Claim 8
Dependent Claim
61 words
A conductive copper paste composition for application to an insulation substrate to form a conductive circuit comprising a copper metal powder, a resin component including a metal surface activator resin and a thermosetting resin, a fatty acid or a metal salt thereof assisting in the uniform dispersion of said copper metal powder into said resin component, and a metal chelating agent.
Claim 9
Dependent Claim
62 words
A conductive copper paste composition according to claim 6 which comprises 100 weight parts of a mixture of 85 to 95 weight percent of said copper metal powder and 15 to 5 weight percent of said resin component, 1 to 8 weight parts of said fatty acid or metal salt thereof, and 1 to 50 weight parts of said metal chelating agent.
Claim 10
Dependent Claim
36 words
A conductive copper paste composition according to claim 6 wherein said resin component consists of 2 to 30 weight percent of said metal surface activator resin and 98 to 70 weight percent of said thermosetting resin.
Claim 11
Dependent Claim
44 words
A conductive copper paste composition according to claim 6 wherein said resin component consists of 2 to 30 weight percent of p-tert-butylphenol resin, 2 to 30 weight percent of said metal surface activator resin and 96 to 40 weight percent of said thermosetting resin.
Claim 12
Dependent Claim
26 words
A conductive copper paste composition according to claim 1, wherein said copper metal powder has a particle diameter in the range of 1 to 100 μm.
Claim 13
Dependent Claim
26 words
A conductive copper paste composition according to claim 1, wherein said copper metal powder has a particle diameter in the range of 1 to 30 μm.
Claim 14
Dependent Claim
26 words
A conductive copper paste composition according to claim 6, wherein said copper metal powder has a particle diameter in the range of 1 to 100 μm.
Claim 15
Dependent Claim
26 words
A conductive copper paste composition according to claim 6, wherein said copper metal powder has a particle diameter in the range of 1 to 30 μm.
Claim 16
Dependent Claim
31 words
A conductive copper paste composition according to claim 1, wherein said thermosetting resin is selected from the group consisting of phenolic resins, acrylic resins, epoxy resins, polyester resins and xylene resins.
Claim 17
Dependent Claim
31 words
A conductive copper paste composition according to claim 6, wherein said thermosetting resin is selected from the group consisting of phenolic resins, acrylic resins, epoxy resins, polyester resins and xylene resins.
Claim 18
Dependent Claim
39 words
A conductive copper paste composition according to claim 1, wherein said fatty acid is selected from the group consisting of saturated fatty acids containing 16 to 20 carbon atoms and unsaturated fatty acids containing 16 to 18 carbon atoms.
Claim 19
Dependent Claim
39 words
A conductive copper paste composition according to claim 6, wherein said fatty acid is selected from the group consisting of saturated fatty acids containing 16 to 20 carbon atoms and unsaturated fatty acids containing 16 to 18 carbon atoms.
Claim 20
Dependent Claim
37 words
A conductive copper paste composition according to claim 1, wherein said metal chelating agent is an aliphatic amine for inhibiting oxidation of the copper metal powder to maintain conductivity and improving receptivity of the composition to solders.
Claim 21
Dependent Claim
37 words
A conductive copper paste composition according to claim 6, wherein said metal chelating agent is an aliphatic amine for inhibiting oxidation of the copper metal powder to maintain conductivity and improving receptivity of the composition to solders.
Claim 22
Dependent Claim
28 words
A conductive copper paste composition according to claim 1, wherein said soldering accelerator is selected from the group consisting of hydroxydicarboxylic acids, aminodicarboxylic acids and metal salts thereof.
Claim 23
Dependent Claim
41 words
A conductive copper paste composition according to claim 6, wherein said metal surface activator resin is selected from the group consisting of activated rosin, partially hydrogenated rosin, completely hydrogenated rosin, esterified rosin, maleated rosin, disproportionated rosin, polymerized rosin and mixtures thereof.
Claim 24
Dependent Claim
46 words
A conductive copper paste composition according to claim 1, wherein said resin component consists of 93 to 20 weight percent of said thermosetting resin, 2 to 30 weight percent of a metal surface activator resin and 5 to 50 weight percent of a ganular phenolic resin.
Claim 25
Dependent Claim
95 words
a conductive copper paste composition for application to an insulation substrate to form a conductive circuit comprising a copper metal powder, a resin component including a thermosetting resin for dispersing the copper metal powder therein, a fatty acid or metal salt of a fatty acid component for assisting in uniformly dispersing said copper metal powder in said resin component, a metal chelating agent for inhibiting oxidation of said copper metal powder to maintain conductivity and improving receptivity of the composition to solders, and a soldering accelerator for further improving receptivity of the composition to solders.
Claim 26
Dependent Claim
95 words
a conductive copper paste composition for application to an insulation substrate to form a conductive circuit comprising a copper metal powder, a resin component including a thermosetting resin for dispersing the copper metal powder therein, a fatty acid or metal salt of a fatty acid component for assisting in uniformly dispersing said copper metal powder in said resin component, a metal chelating agent for inhibiting oxidation of said copper metal powder to maintain conductivity and improving receptivity of the composition to solders, and a soldering accelerator for further improving receptivity of the composition to solders.
Claim 27
Dependent Claim
88 words
A conductive copper paste composition for application to an insulation circuit to form a conductive circuit comprising a copper metal powder, a resin component including a metal surface activator resin and a thermosetting resin for dispersing the copper metal powder therein, a fatty acid or metal salt of a fatty acid for assisting in uniformly dispersing said copper metal powder in said resin component, and a metal chelating agent for inhibiting oxidation of said copper metal powder to maintain conductivity and improving receptivety of the composition to solders.
Claim 28
Dependent Claim
88 words
A conductive copper paste composition for application to an insulation circuit to form a conductive circuit comprising a copper metal powder, a resin component including a metal surface activator resin and a thermosetting resin for dispersing the copper metal powder therein, a fatty acid or metal salt of a fatty acid for assisting in uniformly dispersing said copper metal powder in said resin component, and a metal chelating agent for inhibiting oxidation of said copper metal powder to maintain conductivity and improving receptivety of the composition to solders.
Claim 29
Dependent Claim
83 words
A cured film forming a conductive circuit on an insulation substrate comprising a copper metal powder dispersed in a resin component including a thermosetting resin, a fatty acid or metal salt thereof assisting in the uniform dispersion of of said copper metal powder in said resin component, a metal chelating agent for inhibiting oxidation of said copper metal powder to maintain conductivity and improving receptivity of the film to solders, and a soldering accelerator for further improving receptivity of the film to solders.
Claim 30
Dependent Claim
83 words
A cured film forming a conductive circuit on an insulation substrate comprising a copper metal powder dispersed in a resin component including a thermosetting resin, a fatty acid or metal salt thereof assisting in the uniform dispersion of of said copper metal powder in said resin component, a metal chelating agent for inhibiting oxidation of said copper metal powder to maintain conductivity and improving receptivity of the film to solders, and a soldering accelerator for further improving receptivity of the film to solders.
Claim 31
Dependent Claim
76 words
A cured film forming a conductive circuit on an insulation substrate comprising a copper metal powder dispersed in a resin component including a metal surface activator resin and a thermosetting resin, a fatty acid or metal salt thereof assisting in the uniform disperson of said copper metal powder in said resin component, and a metal chelating agent for inhibiting oxidation of said copper metal powder to maintain conductivity and improving receptivity of the film to solders.
Claim 32
Dependent Claim
76 words
A cured film forming a conductive circuit on an insulation substrate comprising a copper metal powder dispersed in a resin component including a metal surface activator resin and a thermosetting resin, a fatty acid or metal salt thereof assisting in the uniform disperson of said copper metal powder in said resin component, and a metal chelating agent for inhibiting oxidation of said copper metal powder to maintain conductivity and improving receptivity of the film to solders.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-12-06 | 1992-06-06 | 1992-12-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-12-06 | 1996-06-06 | 1996-12-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-12-06 | 2000-06-06 | 2000-12-06 | $7700.00 | Window Closed / Lapsed |