Low temperature cure having single component conductive adhesive

Claim 1

An electrically conductive adherent film forming adhesive which is rapidly curable thermally from a flowable liquid form to an adherent and coherent solid at temperatures below about 120° C. and with a specific resistivity of less than about 0.001 ohm-cm. and comprising a uniform mixture with the following formulation: ______________________________________ Component Percent Range by Weight ______________________________________ (a) A liquid base epoxy resin 24.9% to 14.9% selected from the group consisting by weight total; of bisphenol A--diglycidyl ether diepoxide, gycloaliphatic diepoxide and epoxy novalacs, (b) A sole hardening component 1.0% to 4.0% by weight for said liquid epoxy base resin, of epoxy resin; said hardening component consisting essentially of the tertiary amine salt of trifluoromethane sulfonic acid having the structural formula B.CF.sub.3 SO.sub.3 H wherein "B" represents the radical NR'R"R'"H, and wherein "R'R", and R'"" each represent lower alkyl groups having up to six carbon atoms and being free of other hardening components (c) Metallic silver 75-85% by weight. having a size of from between about 1 micron and 20 microns ______________________________________