US6300165B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ball grid substrate for lead-on-chip semiconductor package
Assignee: Touch Future Technology Ltd
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Filing: 2001-01-18
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Granted: 2001-10-09
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Expires: 2021-01-18
Abstract
Abstract A package substrate suitable for use with a ball grid array according to the invention includes an electrically and thermally conductive heat sink having a top surface and a bottom surface, the heat sink having a slot formed therethrough which opens onto the top and bottom surfaces. A dielectric layer is formed on the bottom surface of the heat sink proximate the slot, preferably directly thereon without an intervening adhesive layer. A circuit is selectively formed in a circuit pattern on the dielectric layer. An electrically resistive soldermask is disposed on the dielectric layer and the circuit, which soldermask has openings therethrough which expose bond pads of the circuit. Such a substrate according to the invention permits the integrated circuit die to be mounted over the slot in the manner of a lead-on-chip package, but provides bond pads to which solder balls can be mounted in order to form a ball grid array.
Inventors
- 👤 Abram M. Castro
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:56
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W90/00; H10W90/701; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W72/00; H10W72/01; H10W72/0198; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337; H10W72/07338; H10W72/07351; H10W72/07352; H10W72/075; H10W72/07551; H10W72/07554; H10W72/20; H10W72/29; H10W72/30; H10W72/321; H10W72/50; H10W72/541; H10W72/547; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/59; H10W72/851; H10W72/853; H10W72/865; H10W72/90; H10W72/951; H10W72/952; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
102 words
A method for manufacturing a substrate package, comprising the steps of: treating a bottom surface of a heat sink with an adhesion promoter; forming a dielectric layer directly on the treated bottom surface of the heat sink; forming a circuit pattern on the dielectric layer; forming an electrically resistive soldermask over the dielectric layer and circuit; exposing wire bonding pads and ball pads on the circuit by selectively removing portions of the soldermask; and forming a widthwise slot through the heat sink at a location adjacent the wire bonding pads, which slot opens onto top and bottom surfaces of the heat sink.
Claim 2
Independent Claim
102 words
A method for manufacturing a substrate package, comprising the steps of: treating a bottom surface of a heat sink with an adhesion promoter; forming a dielectric layer directly on the treated bottom surface of the heat sink; forming a circuit pattern on the dielectric layer; forming an electrically resistive soldermask over the dielectric layer and circuit; exposing wire bonding pads and ball pads on the circuit by selectively removing portions of the soldermask; and forming a widthwise slot through the heat sink at a location adjacent the wire bonding pads, which slot opens onto top and bottom surfaces of the heat sink.
Claim 3
Dependent Claim
50 words
The method of claim 1 , further comprising: cutting an adhesive sheet into a preform which has an opening therein of the same shape as the slot; and applying the preform to the top surface of the heat sink so that the preform opening is in alignment wit the slot.
Claim 4
Dependent Claim
16 words
The method of claim 2 , further conprising shipping the substrate package to an end user.
Claim 5
Dependent Claim
22 words
The method of claim 1 , further comprising exposing an edge of the bottom surface of the heat sink adjacent the slot.
Claim 6
Dependent Claim
94 words
The method of claim 1 , further comprising: applying an adhesive to the top surface of the heat sink around the slot; mounting an integrated circuit die to the top surface of the heat sink by means of the adhesive, such that wire bond pads on the die are exposed in the slot; bonding electrically conductive wires to the wire bond pads on the die and to the wire bond pads of the circuit adjacent the slot; covering the wires and the die with an encapsulant; and bonding solder balls to the ball pads.
Claim 7
Dependent Claim
35 words
The method of claim 1 , further comprising: forming a via through the dielectric layer; filling the via with a heat conducting material; and forming an access opening through the soldermask over the filled via.
Claim 8
Dependent Claim
129 words
The method of claim 1 , further comprising: forming a via through the dielectric layer; filling the via with a heat conducting material; forming an access opening through the soldermask over the filled via; applying an adhesive to the top surface of the heat sink around the slot; mounting an integrated circuit die to the top surface of the heat sink by means of the adhesive, such that wire bond pads on the die are exposed in the slot; bonding electrically conductive wires to the wire bond pads on the die and to the wire bond pads of the circuit adjacent the slot; covering the wires and the die with an encapsulant; bonding solder balls to the ball pads; and bonding solder balls to the filled heat conductive via.
Claim 9
Dependent Claim
124 words
The method of claim 4 , further comprising: applying an adhesive to the top surface of the heat sink around the slot; mounting an integrated circuit die to the top surface of the heat sink by means of the adhesive, such that wire bond pads on the die are exposed in the slot; bonding electrically conductive wires to the wire bond pads on the die and to the wire bond pads of the circuit adjacent the slot; bonding an electrically conductive wire to a ground wire bond pad on the die and to the exposed edge on the bottom surface of the heat sink adjacent the slot; covering the wires and the die with an encapsulant; and bonding solder balls to the ball pads.
Claim 10
Dependent Claim
42 words
The method of claim 6 , wherein the circuit pattern is formed from a conductive metal, comprising filling the via during the step of forming a circuit pattern on the dielectric layer with the same metal used to form the circuit pattern.
Claim 11
Independent Claim
101 words
A method for manufacturing a substrate package, comprising the steps of: treating a bottom surface of a heat sink with an adhesion promoter; forming a dielectric layer directly on the treated bottom surface of the heat sink; forming a circuit pattern on the dielectric layer; forming an electrically resistive soldermask over the circuit; exposing wire bonding pads and ball pads on the circuit by removing portions of the soldermask; forming a slot through the heat sink adjacent the wire bonding pads, which slot opens onto top and bottom surfaces of the heat sink; and forming a via through the dielectric layer.
Claim 12
Independent Claim
101 words
A method for manufacturing a substrate package, comprising the steps of: treating a bottom surface of a heat sink with an adhesion promoter; forming a dielectric layer directly on the treated bottom surface of the heat sink; forming a circuit pattern on the dielectric layer; forming an electrically resistive soldermask over the circuit; exposing wire bonding pads and ball pads on the circuit by removing portions of the soldermask; forming a slot through the heat sink adjacent the wire bonding pads, which slot opens onto top and bottom surfaces of the heat sink; and forming a via through the dielectric layer.
Claim 13
Dependent Claim
15 words
The process of claim 10 further comprising filling the via with a heat conducting material.
Claim 14
Dependent Claim
50 words
The method of claim 11 , further comprising: cutting an adhesive sheet into a preform which has an opening therein of the same shape as the slot; and applying the preform to the top surface of the heat sink so that the preform opening is in alignment with the slot.
Claim 15
Dependent Claim
22 words
The method of claim 11 , further comprising exposing an edge of the bottom surface of the heat sink adjacent the slot.
Claim 16
Dependent Claim
94 words
The method of claim 11 , further comprising: applying an adhesive to the top surface of the heat sink around the slot; mounting an integrated circuit die to the top surface of the heat sink by means of the adhesive, such that wire bond pads on the die are exposed in the slot; bonding electrically conductive wires to the wire bond pads on the die and to the wire bond pads of the circuit adjacent the slot; covering the wires and the die with an encapsulant; and bonding solder balls to the ball pads.
Claim 17
Dependent Claim
19 words
The method of claim 11 , further comprising: forming an access opening through the soldermask over the filled via.
Claim 18
Independent Claim
152 words
A method for manufacturing a substrate package, comprising the steps of: forming a dielectric layer directly on a bottom surface of a heat sink; forming a circuit pattern on the dielectric layer; forming an electrically resistive soldermask over the circuit; exposing wire bonding pads and ball pads on the circuit by removing portions of the soldermask; forming a slot through the heat sink adjacent the wire bonding pads, which slot opens onto top and bottom surfaces of the heat sink; forming a via through the dielectric layer; forming an opening through the soldermask adjacent the via; mounting an integrated circuit die to the top surface of the heat sink by means of an adhesive, such that wire bond pads on the die are exposed in the slot; and bonding electrically conductive wires to the wire bond pads on the die and to the wire bond pads of the circuit adjacent the slot.
Claim 19
Independent Claim
152 words
A method for manufacturing a substrate package, comprising the steps of: forming a dielectric layer directly on a bottom surface of a heat sink; forming a circuit pattern on the dielectric layer; forming an electrically resistive soldermask over the circuit; exposing wire bonding pads and ball pads on the circuit by removing portions of the soldermask; forming a slot through the heat sink adjacent the wire bonding pads, which slot opens onto top and bottom surfaces of the heat sink; forming a via through the dielectric layer; forming an opening through the soldermask adjacent the via; mounting an integrated circuit die to the top surface of the heat sink by means of an adhesive, such that wire bond pads on the die are exposed in the slot; and bonding electrically conductive wires to the wire bond pads on the die and to the wire bond pads of the circuit adjacent the slot.
Claim 20
Dependent Claim
33 words
The method of claim 16 further comprising: covering the wires and the die with an encapsulant; bonding solder balls to the ball pads; and bonding solder balls to the filled heat conductive via.
Claim 21
Dependent Claim
124 words
The method of claim 17 , further comprising: applying an adhesive to the top surface of the heat sink around the slot; mounting an integrated circuit die to the top surface of the heat sink by means of the adhesive, such that wire bond pads on the die are exposed in the slot; bonding electrically conductive wires to the wire bond pads on the die and to the wire bond pads of the circuit adjacent the slot; bonding an electrically conductive wire to a ground wire bond pad on the die and to the exposed edge on the bottom surface of the heat sink adjacent the slot; covering the wires and the die with an encapsulant; and bonding solder balls to the ball pads.
Claim 22
Dependent Claim
16 words
The method of claim 18 , further comprising shipping the substrate package to an end user.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-10-08 | 2005-04-09 | 2005-10-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-10-08 | 2009-04-09 | 2009-10-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-10-08 | 2013-04-09 | 2013-10-09 | $7700.00 | Window Closed / Lapsed |