US6528890B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Circuit, method of adhering an integrated circuit device to a substrate, and method of forming a circuit
Assignee: Round Rock Research LLC
•
Filing: 2000-07-14
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Granted: 2003-03-04
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Expires: 2020-07-14
Abstract
Abstract The present invention includes circuits, methods of adhering an integrated circuit device to a substrate, and methods of forming a circuit. According to one aspect of the present invention, a method of forming a circuit includes: providing an integrated circuit device having an outer surface and a plurality of conductive bumps upon the outer surface; providing a substrate having a plurality of bond pads which correspond to respective ones of the conductive bumps; providing an electrically insulative adhesive over at least a portion of the outer surface of the integrated circuit device; and coupling the integrated circuit device and the substrate following the providing the adhesive, the coupling connecting the outer surface of the integrated circuit device with the substrate and forming a plurality of electrical interconnections comprising the conductive bumps and the bond pads.
Inventors
- 👤 Joseph M. Brand
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 15:06
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/012; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/073; H10W72/20; H10W72/251
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
99 words
A circuit comprising: an integrated circuit device having an outer surface and a plurality of conductive bumps upon the outer surface; a substrate having an outer surface having a plurality of bond pads electrically coupled with the conductive bumps of the integrated circuit device in opposing relation, the outer surface of the integrated circuit device and the outer surface of the substrate defining a buffer volume therebetween; and an adhesive bonding the outer surface of the integrated circuit device and the outer surface of the substrate together, the buffer volume having a greater volume of void space than adhesive.
Claim 2
Dependent Claim
99 words
A circuit comprising: an integrated circuit device having an outer surface and a plurality of conductive bumps upon the outer surface; a substrate having an outer surface having a plurality of bond pads electrically coupled with the conductive bumps of the integrated circuit device in opposing relation, the outer surface of the integrated circuit device and the outer surface of the substrate defining a buffer volume therebetween; and an adhesive bonding the outer surface of the integrated circuit device and the outer surface of the substrate together, the buffer volume having a greater volume of void space than adhesive.
Claim 3
Dependent Claim
26 words
The circuit according to claim 1 wherein the adhesive comprises a plurality of discrete adhesive fillets provided about the electrically coupled conductive bumps and bond pads.
Claim 4
Dependent Claim
12 words
The circuit according to claim 1 wherein the adhesive is electrically insulative.
Claim 5
Dependent Claim
15 words
The circuit according to claim 1 wherein the integrated circuit device comprises a flip chip.
Claim 6
Dependent Claim
16 words
The circuit according to claim 1 wherein the adhesive contacts the conductive bumps and bond pads.
Claim 7
Dependent Claim
104 words
A circuit comprising: an integrated circuit device having an outer surface and a plurality of conductive bumps upon the outer surface; a substrate having an outer surface having a plurality of bond pads electrically coupled with the conductive bumps of the integrated circuit device in opposing relation; and a plurality of discrete adhesive fillets provided about an entirety of the outwardly exposed surfaces of the coupled conductive bumps of the integrated circuit device and the corresponding bond pads of the substrate; wherein the adhesive fillets are configured to bond the outer surface of the integrated circuit device and the outer surface of the substrate.
Claim 8
Dependent Claim
104 words
A circuit comprising: an integrated circuit device having an outer surface and a plurality of conductive bumps upon the outer surface; a substrate having an outer surface having a plurality of bond pads electrically coupled with the conductive bumps of the integrated circuit device in opposing relation; and a plurality of discrete adhesive fillets provided about an entirety of the outwardly exposed surfaces of the coupled conductive bumps of the integrated circuit device and the corresponding bond pads of the substrate; wherein the adhesive fillets are configured to bond the outer surface of the integrated circuit device and the outer surface of the substrate.
Claim 9
Dependent Claim
13 words
The circuit according to claim 6 wherein the adhesive fillets are electrically insulative.
Claim 10
Dependent Claim
15 words
The circuit according to claim 6 wherein the integrated circuit device comprises a flip chip.
Claim 11
Dependent Claim
18 words
The circuit according to claim 6 wherein the adhesive fillets contact the coupled conductive bumps and bond pads.
Claim 12
Dependent Claim
41 words
The circuit according to claim 6 wherein the outer surface of the integrated circuit device and the outer surface of the substrate define a buffer volume therebetween having a greater volume of void space than a volume of the adhesive fillets.
Claim 13
Dependent Claim
88 words
A circuit comprising: an integrated circuit device having an outer surface and a plurality of conductive bumps upon the outer surface; a substrate having an outer surface having a plurality of bond pads electrically coupled with the conductive bumps of the integrated circuit device in opposing relation; and a plurality of discrete adhesive fillets provided about an entirety of the outwardly exposed surfaces of the coupled conductive bumps of the integrated circuit device and the corresponding bond pads of the substrate; wherein the adhesive fillets are electrically insulative.
Claim 14
Dependent Claim
88 words
A circuit comprising: an integrated circuit device having an outer surface and a plurality of conductive bumps upon the outer surface; a substrate having an outer surface having a plurality of bond pads electrically coupled with the conductive bumps of the integrated circuit device in opposing relation; and a plurality of discrete adhesive fillets provided about an entirety of the outwardly exposed surfaces of the coupled conductive bumps of the integrated circuit device and the corresponding bond pads of the substrate; wherein the adhesive fillets are electrically insulative.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-03-03 | 2006-09-02 | 2007-03-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-03-03 | 2010-09-02 | 2011-03-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-03-03 | 2014-09-02 | 2015-03-04 | $7700.00 | Window Closed / Lapsed |