US5897336A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Direct chip attach for low alpha emission interconnect system
Assignee: International Business Machines Corp
•
Filing: 1997-05-28
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Granted: 1999-04-27
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Expires: 2017-05-28
Abstract
Abstract An interconnect system that has low alpha particle emission characteristics for use in an electronic device includes a semiconductor chip that has an upper surface and spaced apart electrically resistive bumps positioned on conductive regions of the upper surface, the electrically resistive bumps are made of a composite material of a polymer and metal particles, and a substrate that has conductive regions bonded to the electrically resistive bumps in a bonding process wherein the electrically resistive bumps convert to electrically conductive bumps after the bonding process.
Inventors
- 👤 Guy Paul Brouillette
- 👤 David Hirsch Danovitch
- 👤 Michael Liehr
- 👤 William Thomas Motsiff
- 👤 Judith Marie Roldan
- 👤 Carlos Juan Sambucetti
- 👤 Ravi F. Saraf
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:46
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W42/00; H10W42/20; H10W42/25; H05; H05K; H05K3/00; H05K3/22; H05K3/24; H05K3/244; H05K3/30; H05K3/32; H05K3/321; H10W72/073; H10W72/07331; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W74/00; H10W74/10; H10W74/15; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 47
Claim 1
Independent Claim
111 words
A method of making electrical interconnections to an electronic device comprising the steps of: providing an electronic device having a plurality of conductive regions positioned on the device, depositing a plurality of electrically resistive bumps of a polymeric based composite on said conductive regions, providing a substrate having a plurality of conductive regions on a top surface, and pressing said plurality of electrically resistive bumps against said conductive regions on said substrate under a pressure and temperature for a length of time sufficient to establish an electrical connection and an adhesive bond between electrically conductive bumps which are converted from said electrically resistive bumps and the conductive regions on said substrate.
Claim 2
Independent Claim
111 words
A method of making electrical interconnections to an electronic device comprising the steps of: providing an electronic device having a plurality of conductive regions positioned on the device, depositing a plurality of electrically resistive bumps of a polymeric based composite on said conductive regions, providing a substrate having a plurality of conductive regions on a top surface, and pressing said plurality of electrically resistive bumps against said conductive regions on said substrate under a pressure and temperature for a length of time sufficient to establish an electrical connection and an adhesive bond between electrically conductive bumps which are converted from said electrically resistive bumps and the conductive regions on said substrate.
Claim 3
Dependent Claim
17 words
The method according to claim 1, wherein said conductive regions of said electronic device are bonding pads.
Claim 4
Dependent Claim
15 words
The method according to claim 1, wherein said electronic device is an integrated circuit chip.
Claim 5
Dependent Claim
22 words
The method according to claim 1, wherein the resistivity of said conductive bumps after said bonding step is less than 1000 μΩ-cm.
Claim 6
Dependent Claim
22 words
The method according to claim 1, wherein a bond formed between the electronic device and the substrate is greater than 5 MPa.
Claim 7
Dependent Claim
27 words
The method according to claim 1, wherein said substrate is made of a material selected from the group consisting of ceramic, epoxy, a semiconducting material and glass.
Claim 8
Dependent Claim
24 words
The method according to claim 1, wherein said electrically conductive regions on said substrate comprise electrically resistive bumps made up of a polymeric composite.
Claim 9
Dependent Claim
24 words
The method according to claim 1, wherein said electrically conductive regions on said substrate comprises bumps made of a thermoplastic polymer and metal particles.
Claim 10
Dependent Claim
25 words
The method according to claim 1 further comprising the step of encapsulating said conductive bumps by injecting encapsulant between said electronic device and said substrate.
Claim 11
Dependent Claim
31 words
The method according to claim 1, wherein said predetermined pressure and temperature are between about 15 psi and about 1,500 psi, and between about 150° C. and about 250° C., respectively.
Claim 12
Dependent Claim
24 words
The method according to claim 1, wherein said length of time sufficient to establish electrical connections is between about 2 and about 120 seconds.
Claim 13
Dependent Claim
21 words
The method according to claim 1, wherein said electrically resistive bumps are converted to electrically conductive bumps after said pressing step.
Claim 14
Independent Claim
132 words
A method for making electrical interconnections to an electronic device comprising the steps of: providing an electronic device having a plurality of conductive regions positioned on the device, depositing a plurality of electrically resistive bumps of a polymeric based composite on said conductive regions, said plurality of electrically resistive bumps having a resistivity more than 1000 μΩ-cm, providing a substrate having a plurality of conductive regions on a top surface, and pressing said plurality of electrically resistive bumps against said conductive regions on said substrate under a pressure and temperature for a length of time sufficient to establish an electrical connection and an adhesive bond between electrically conductive bumps having a resistivity of less than 1000 μΩ-cm which are converted from said electrically resistive bumps and the conductive regions on said substrate.
Claim 15
Independent Claim
132 words
A method for making electrical interconnections to an electronic device comprising the steps of: providing an electronic device having a plurality of conductive regions positioned on the device, depositing a plurality of electrically resistive bumps of a polymeric based composite on said conductive regions, said plurality of electrically resistive bumps having a resistivity more than 1000 μΩ-cm, providing a substrate having a plurality of conductive regions on a top surface, and pressing said plurality of electrically resistive bumps against said conductive regions on said substrate under a pressure and temperature for a length of time sufficient to establish an electrical connection and an adhesive bond between electrically conductive bumps having a resistivity of less than 1000 μΩ-cm which are converted from said electrically resistive bumps and the conductive regions on said substrate.
Claim 16
Dependent Claim
23 words
The method according to claim 13, wherein an adhesive bond formed between the electronic device and the substrate is greater than 5 MPa.
Claim 17
Dependent Claim
27 words
The method according to claim 13, wherein said substrate is made of a material selected from the group consisting of ceramic, epoxy, a semiconducting material and glass.
Claim 18
Dependent Claim
24 words
The method according to claim 13, wherein said electrically conductive regions on said substrate comprise electrically resistive bumps made up of a polymeric composite.
Claim 19
Dependent Claim
24 words
The method according to claim 13, wherein said electrically conductive regions on said substrate comprises bumps made of a thermoplastic polymer and metal particles.
Claim 20
Dependent Claim
25 words
The method according to claim 13 further comprising the step of encapsulating said conductive bumps by injecting encapsulant between said electronic device and said substrate.
Claim 21
Dependent Claim
30 words
The method according to claim 13, wherein said pressure and temperature are between about 15 psi and about 1,500 psi, and between about 150° C. and about 250° C., respectively.
Claim 22
Dependent Claim
24 words
The method according to claim 13, wherein said length of time sufficient to establish electrical connections is between about 2 and about 120 seconds.
Claim 23
Independent Claim
129 words
A method of making electrical interconnections to an electronic device comprising the steps of: providing an electronic device having a plurality of conductive regions positioned on the device, depositing a plurality of electrically resistive bumps of a polymeric based composite on said conductive regions, providing a substrate having a plurality of conductive regions on a top surface, and pressing said plurality of electrically resistive bumps against said conductive regions on said substrate under a pressure of between about 15 psi and about 1500 psi and a temperature between about 150° C. and about 250° C. for a length of time sufficient to establish an electrical connection and an adhesive bond between electrically conductive bumps which are converted from said electrically resistive bumps and the conductive regions on said substrate.
Claim 24
Independent Claim
129 words
A method of making electrical interconnections to an electronic device comprising the steps of: providing an electronic device having a plurality of conductive regions positioned on the device, depositing a plurality of electrically resistive bumps of a polymeric based composite on said conductive regions, providing a substrate having a plurality of conductive regions on a top surface, and pressing said plurality of electrically resistive bumps against said conductive regions on said substrate under a pressure of between about 15 psi and about 1500 psi and a temperature between about 150° C. and about 250° C. for a length of time sufficient to establish an electrical connection and an adhesive bond between electrically conductive bumps which are converted from said electrically resistive bumps and the conductive regions on said substrate.
Claim 25
Dependent Claim
17 words
The method according to claim 21, wherein said conductive regions of said electronic device are bonding pads.
Claim 26
Dependent Claim
15 words
The method according to claim 21, wherein said electronic device is an integrated circuit chip.
Claim 27
Dependent Claim
22 words
The method according to claim 21, wherein the resistivity of said conductive bumps after said bonding step is less than 1000 μΩ-c.
Claim 28
Dependent Claim
23 words
The method according to claim 21, wherein an adhesive bond formed between the electronic device and the substrate is greater than 5 MPa.
Claim 29
Dependent Claim
27 words
The method according to claim 21, wherein said substrate is made of a material selected from the group consisting of ceramic, epoxy, a semiconducting material and glass.
Claim 30
Dependent Claim
24 words
The method according to claim 21 wherein said electrically conductive regions on said substrate comprise electrically resistive bumps made up of a polymeric composite.
Claim 31
Dependent Claim
24 words
The method according to claim 21, wherein said electrically conductive regions on said substrate comprises bumps made of a thermoplastic polymer and metal particles.
Claim 32
Dependent Claim
25 words
The method according to claim 21 further comprising the step of encapsulating said conductive bumps by injecting encapsulant between said electronic device and said substrate.
Claim 33
Dependent Claim
24 words
The method according to claim 21, wherein said length of time sufficient to establish electrical connections is between about 2 and about 120 seconds.
Claim 34
Dependent Claim
21 words
The method according to claim 21, wherein said electrically resistive bumps are converted to electrically conductive bumps after said pressing step.
Claim 35
Independent Claim
143 words
A method of making electrical interconnections to an electronic device comprising the steps of: providing an electronic device having a plurality of conductive regions positioned on the device, depositing a plurality of electrically resistive bumps of a polymeric based composite containing at least 10 weight percent solvent on said conductive regions, drying said plurality of electrically resistive bumps at a temperature between about 20° C. and about 120° C. for evaporating solvent contained in said bumps, providing a substrate having a plurality of conductive regions on a top surface, and pressing said plurality of electrically resistive bumps against said conductive regions on said substrate under a pressure and temperature for a length of time sufficient to establish an electrical connection and an adhesive bond between electrically conductive bumps which are converted from said electrically resistive bumps and the conductive regions on said substrate.
Claim 36
Independent Claim
143 words
A method of making electrical interconnections to an electronic device comprising the steps of: providing an electronic device having a plurality of conductive regions positioned on the device, depositing a plurality of electrically resistive bumps of a polymeric based composite containing at least 10 weight percent solvent on said conductive regions, drying said plurality of electrically resistive bumps at a temperature between about 20° C. and about 120° C. for evaporating solvent contained in said bumps, providing a substrate having a plurality of conductive regions on a top surface, and pressing said plurality of electrically resistive bumps against said conductive regions on said substrate under a pressure and temperature for a length of time sufficient to establish an electrical connection and an adhesive bond between electrically conductive bumps which are converted from said electrically resistive bumps and the conductive regions on said substrate.
Claim 37
Dependent Claim
27 words
The method according to claim 32, wherein said substrate is made of a material selected from the group consisting of ceramic, epoxy, a semiconducting material and glass.
Claim 38
Dependent Claim
24 words
The method according to claim 32, wherein said electrically conductive regions on said substrate comprise electrically resistive bumps made up of a polymeric composite.
Claim 39
Dependent Claim
24 words
The method according to claim 32, wherein said electrically conductive regions on said substrate comprises bumps made of a thermoplastic polymer and metal particles.
Claim 40
Dependent Claim
25 words
The method according to claim 32 further comprising the step of encapsulating said conductive bumps by injecting encapsulant between said electronic device and said substrate.
Claim 41
Dependent Claim
31 words
The method according to claim 32, wherein said predetermined pressure and temperature are between about 15 psi and about 1,500 psi, and between about 150° C. and about 250° C., respectively.
Claim 42
Dependent Claim
24 words
The method according to claim 32, wherein said length of time sufficient to establish electrical connections is between about 2 and about 120 seconds.
Claim 43
Dependent Claim
21 words
The method according to claim 32, wherein said electrically resistive bumps are converted to electrically conductive bumps after said pressing step.
Claim 44
Dependent Claim
17 words
The method according to claim 32, wherein said conductive regions of said electronic device are bonding pads.
Claim 45
Dependent Claim
15 words
The method according to claim 32, wherein said electronic device is an integrated circuit chip.
Claim 46
Dependent Claim
22 words
The method according to claim 32, wherein the resistivity of said conductive bumps after said bonding step is less than 1000 μΩ-cm.
Claim 47
Dependent Claim
22 words
The method according to claim 32, wherein a bond formed between the electronic device and the substrate is greater than 5 MPa.
References Cited (Backward Citations)
US4426657A
Cited
US4487638A
Cited
US4931852A
Cited
US5196371A
Cited
US5508561A
Cited
US5508228A
Cited
US5468995A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 7.5 Years (Year 8) | 2006-04-26 | 2006-10-26 | 2007-04-27 | $3760.00 | Window Closed / Lapsed |
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