US5508228A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same
Assignee: Rateze Remote Mgmt LLC
•
Filing: 1994-02-14
•
Granted: 1996-04-16
•
Expires: 2014-02-14
Abstract
Abstract Compliant electrically connection bumps for an adhesive flip chip integrated circuit device and various methods for forming the bumps include the steps of forming polymer bumps on a substrate or an integrated circuit die and coating the polymer bumps with a metallization layer. The polymer bump forming step includes the steps of coating a polymer material on a substrate, curing the polymer and the etching the bump pattern from the polymer material. The overcoating step includes electrolessly plating a ductile metal such as gold on the polymer bump.
Inventors
- 👤 Ernest R. Nolan
- 👤 Diana C. Duane
- 👤 Todd H. Herder
- 👤 Thomas A. Bishop
- 👤 Kimcuc T. Tran
- 👤 Robert W. Froehlich
- 👤 Randy L. German
- 👤 Richard D. Nelson
- 👤 Chung J. Lee
- 👤 Mark R. Breen
- 👤 Kathryn V. Keswick
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 20:17
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/20; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W90/00; H10W90/701; H10W70/00; H10W70/01; H10W70/05; H10W72/01; H10W72/012; H10W72/01231; H10W72/01251; H10W72/01255; H10W72/019; H10W72/071; H10W72/075; H10W72/251; H10W72/253; H10W72/29; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/59; H10W72/851; H10W72/853; H10W72/856; H10W72/90; H10W72/921; H10W72/926; H10W72/931; H10W72/932; H10W72/951; H10W72/952; Y; Y10; Y10S; Y10S438/00; Y10S438/903
Claims Analysis
Total Claims: 39
Claim 1
Independent Claim
135 words
A method for forming an electrically conductive compliant bump on a base having an electrical connector for compressively and compliantly connecting the electrical connector to an electrical connection point for an adhesive flip chip integrated circuit device, the method comprising the steps of: forming a compressible polymer bump on a position of the electrical connector; defining an area including the polymer bump on which to plate a ductile and compliant metal for covering the polymer bump and forming an electrical connection to the electrical connector; and plating a ductile and compliant metal layer over the polymer bump and a portion of the electrical connector to form a compressive and compliant electrical connection that is connectable between the electrical connector and the electrical connection point through compression and adhesion of an adhesive flip chip integrated circuit.
Claim 2
Independent Claim
135 words
A method for forming an electrically conductive compliant bump on a base having an electrical connector for compressively and compliantly connecting the electrical connector to an electrical connection point for an adhesive flip chip integrated circuit device, the method comprising the steps of: forming a compressible polymer bump on a position of the electrical connector; defining an area including the polymer bump on which to plate a ductile and compliant metal for covering the polymer bump and forming an electrical connection to the electrical connector; and plating a ductile and compliant metal layer over the polymer bump and a portion of the electrical connector to form a compressive and compliant electrical connection that is connectable between the electrical connector and the electrical connection point through compression and adhesion of an adhesive flip chip integrated circuit.
Claim 3
Dependent Claim
21 words
The method of claim 1, further comprising the step of forming the electrically conductive compliant bump on an integrated circuit wafer.
Claim 4
Dependent Claim
24 words
The method of claim 2, wherein the polymer bump forming step comprises the step of forming the polymer bump using a dry etch process.
Claim 5
Dependent Claim
59 words
The method of claim 3, further comprising the steps of: depositing the ductile metal over the integrated circuit wafer; forming a photoresist layer over the integrated circuit wafer for defining an area of the ductile metal layer covering the polymer bump and a portion of the ductile metal layer; and removing the remaining portion of the ductile metal layer.
Claim 6
Dependent Claim
115 words
The method of claim 3, wherein said defining step further comprises the steps of: forming a thin conductive metal layer over the polymer bump and the integrated circuit wafer; and forming a photoresist layer over the thin conductive metal layer, the photoresist layer defining an area for exposing that portion of the thin conductive metal covering the polymer bump and at a portion of the electrical connector; and said plating step further comprises the step of plating the ductile metal over the defined area; and further comprising the steps removing the photoresist layer to expose the remaining portion of the thin conductive metal layer; and removing the remaining portion of the thin conductive metal layer.
Claim 7
Dependent Claim
39 words
The method of claim 3, wherein said defining step comprises the step of catalyzing said polymer bump to form a catalyzed polymer bump, and further wherein said plating step comprises the step of electrolessly plating said catalyzed polymer bump.
Claim 8
Dependent Claim
36 words
The method of claim 3, wherein said polymer bump comprises a polymer material having a pre-mixed catalyst, and further wherein said plating step comprises the step of electrolessly plating said polymer bump having said pre-mixed catalyst.
Claim 9
Dependent Claim
24 words
The method of claim 2, wherein the polymer bump forming step comprises the step of forming the polymer bump using a wet etch process.
Claim 10
Dependent Claim
59 words
The method of claim 8, further comprising the steps of: depositing the ductile metal over the integrated circuit wafer; forming a photoresist layer over the integrated circuit wafer for defining an area of the ductile metal layer covering the polymer bump and a portion of the ductile metal layer; and removing the remaining portion of the ductile metal layer.
Claim 11
Dependent Claim
117 words
The method of claim 8, wherein said defining step further comprises the steps of: forming a thin conductive metal layer over the polymer bump and the integrated circuit wafer; and forming a photoresist layer over the thin conductive metal layer, the photoresist layer defining an area for exposing that portion of the thin conductive metal covering the polymer bump and at least a portion of the electrical connector; and said plating step further comprises the step of plating the ductile metal over the defined area; and further comprising the steps of: removing the photoresist layer to expose the remaining portion of the thin conductive metal layer; and removing the remaining portion of the thin conductive metal layer.
Claim 12
Dependent Claim
39 words
The method of claim 8, wherein said defining step comprises the step of catalyzing said polymer bump to form a catalyzed polymer bump, and further wherein said plating step comprises the step of electrolessly plating said catalyzed polymer bump.
Claim 13
Dependent Claim
36 words
The method of claim 8, wherein said polymer bump comprises a polymer material having a pre-mixed catalyst, and further wherein said plating step comprises the step of electrolessly plating said polymer bump having said pre-mixed catalyst.
Claim 14
Dependent Claim
23 words
The method of claim 2, wherein the polymer bump forming step comprises the step of forming the polymer bump from a photoimageable polymer.
Claim 15
Dependent Claim
59 words
The method of claim 13, further comprising the steps of: depositing the ductile metal over the integrated circuit wafer; forming a photoresist layer over the integrated circuit wafer for defining an area of the ductile metal layer covering the polymer bump and a portion of the ductile metal layer; and removing the remaining portion of the ductile metal layer.
Claim 16
Dependent Claim
116 words
The method of claim 13, wherein said defining step further comprises the steps of: forming a thin conductive metal layer over the polymer bump and the integrated circuit wafer; and forming a photoresist layer over the thin conductive metal layer, the photoresist layer defining an area for exposing that portion of the thin conductive metal covering the polymer bump and at a portion of the electrical connector; and said plating step further comprises the step of plating the ductile metal over the defined area; and further comprising the steps of: removing the photoresist layer to expose the remaining portion of the thin conductive metal layer; and removing the remaining portion of the thin conductive metal layer.
Claim 17
Dependent Claim
39 words
The method of claim 13, wherein said defining step comprises the step of catalyzing said polymer bump to form a catalyzed polymer bump, and further wherein said plating step comprises the step of electrolessly plating said catalyzed polymer bump.
Claim 18
Dependent Claim
36 words
The method of claim 13, wherein said polymer bump comprises a polymer material having a pre-mixed catalyst, and further wherein said plating step comprises the step of electrolessly plating said polymer bump having said pre-mixed catalyst.
Claim 19
Dependent Claim
19 words
The method of claim 1, further comprising the step of forming the electrically conductive compliant bump on a substrate.
Claim 20
Dependent Claim
24 words
The method of claim 18, wherein the polymer bump forming step comprises the step of forming the polymer bump using a dry etch process.
Claim 21
Dependent Claim
59 words
The method of claim 19, further comprising the steps of: depositing the ductile metal over the integrated circuit wafer; forming a photoresist layer over the integrated circuit wafer for defining an area of the ductile metal layer covering the polymer bump and a portion of the ductile metal layer; and removing the remaining portion of the ductile metal layer.
Claim 22
Dependent Claim
116 words
The method of claim 19, wherein said defining step further comprises the steps of: forming a thin conductive metal layer over the polymer bump and the integrated circuit wafer; and forming a photoresist layer over the thin conductive metal layer, the photoresist layer defining an area for exposing that portion of the thin conductive metal covering the polymer bump and at least a portion of the electrical connector; and said plating step further comprises the step of plating the ductile metal over the defined area; and further comprising the steps removing the photoresist layer to expose the remaining portion of the thin conductive metal layer; and removing the remaining portion of the thin conductive metal layer.
Claim 23
Dependent Claim
39 words
The method of claim 19, wherein said defining step comprises the step of catalyzing said polymer bump to form a catalyzed polymer bump, and further wherein said plating step comprises the step of electrolessly plating said catalyzed polymer bump.
Claim 24
Dependent Claim
36 words
The method of claim 19, wherein said polymer bump comprises a polymer material having a pre-mixed catalyst, and further wherein said plating step comprises the step of electrolessly plating said polymer bump having said pre-mixed catalyst.
Claim 25
Dependent Claim
24 words
The method of claim 18, wherein the polymer bump forming step comprises the step of forming the polymer bump using a wet etch process.
Claim 26
Dependent Claim
59 words
The method of claim 24, further comprising the steps of: depositing the ductile metal over the integrated circuit wafer; forming a photoresist layer over the integrated circuit wafer for defining an area of the ductile metal layer covering the polymer bump and a portion of the ductile metal layer; and removing the remaining portion of the ductile metal layer.
Claim 27
Dependent Claim
117 words
The method of claim 24, wherein said defining step further comprises the steps of: forming a thin conductive metal layer over the polymer bump and the integrated circuit wafer; and forming a photoresist layer over the thin conductive metal layer, the photoresist layer defining an area for exposing that portion of the thin conductive metal covering the polymer bump and at least a portion of the electrical connector; and said plating step further comprises the step of plating the ductile metal over the defined area; and further comprising the steps of: removing the photoresist layer to expose the remaining portion of the thin conductive metal layer; and removing the remaining portion of the thin conductive metal layer.
Claim 28
Dependent Claim
39 words
The method of claim 24, wherein said defining step comprises the step of catalyzing said polymer bump to form a catalyzed polymer bump, and further wherein said plating step comprises the step of electrolessly plating said catalyzed polymer bump.
Claim 29
Dependent Claim
36 words
The method of claim 24, wherein said polymer bump comprises a polymer material having a pre-mixed catalyst, and further wherein said plating step comprises the step of electrolessly plating said polymer bump having said pre-mixed catalyst.
Claim 30
Dependent Claim
23 words
The method of claim 18, wherein the polymer bump forming step comprises the step of forming the polymer bump from a photoimageable polymer.
Claim 31
Dependent Claim
59 words
The method of claim 29, further comprising the steps of: depositing the ductile metal over the integrated circuit wafer; forming a photoresist layer over the integrated circuit wafer for defining an area of the ductile metal layer covering the polymer bump and a portion of the ductile metal layer; and removing the remaining portion of the ductile metal layer.
Claim 32
Dependent Claim
117 words
The method of claim 29, wherein said defining step further comprises the steps of: forming a thin conductive metal layer over the polymer bump and the integrated circuit wafer; and forming a photoresist layer over the thin conductive metal layer, the photoresist layer defining an area for exposing that portion of the thin conductive metal covering the polymer bump and at least a portion of the electrical connector; and said plating step further comprises the step of plating the ductile metal over the defined area; and further comprising the steps of: removing the photoresist layer to expose the remaining portion of the thin conductive metal layer; and removing the remaining portion of the thin conductive metal layer.
Claim 33
Dependent Claim
39 words
The method of claim 29, wherein said defining step comprises the step of catalyzing said polymer bump to form a catalyzed polymer bump, and further wherein said plating step comprises the step of electrolessly plating said catalyzed polymer bump.
Claim 34
Dependent Claim
36 words
The method of claim 29, wherein said polymer bump comprises a polymer material having a pre-mixed catalyst, and further wherein said plating step comprises the step of electrolessly plating said polymer bump having said pre-mixed catalyst.
Claim 35
Dependent Claim
29 words
The method of claim 1, further comprising the step of plating a second metal layer over said ductile metal layer for strengthening a portion of said ductile metal layer.
Claim 36
Independent Claim
251 words
A method for forming an electrically conductive compliant bump on a base having at least one electrical connection for connecting to the compliant bump for an adhesive flip chip integrated circuit device, the method comprising the steps of: forming a compressible polymer bump over said electrical connection; electrolessly plating a thin conductive metal layer on the base and the polymer bump, said thin conductive metal layer in electrical contact with the at least one electrical connection and protecting the at least one electrical connection; forming a photoresist mask layer on the thin conductive metal layer, said photoresist mask having an opening of a size corresponding to the surface area of the compliant bump; electrolytically plating a ductile and compliant metal layer over the surface area defined by the photoresist mask to form an electrically conductive metallization layer comprising the ductile and compliant metal layer and a portion of the thin conductive metal layer over the polymer bump and a portion of the electrical connection; removing the photoresist mask to expose the remaining portion of the thin conductive metal layer; removing the remaining portion of the thin conductive metal layer to form a compliant bump that is electrically conductive with the at least one electrical connection and that is compliant according to the compliant properties of the polymer bump and metallization layer; such that the compliant bump is connectable between the at least one electrical connection and an electrical connection point through compression and adhesion of an adhesive flip chip integrated circuit.
Claim 37
Independent Claim
251 words
A method for forming an electrically conductive compliant bump on a base having at least one electrical connection for connecting to the compliant bump for an adhesive flip chip integrated circuit device, the method comprising the steps of: forming a compressible polymer bump over said electrical connection; electrolessly plating a thin conductive metal layer on the base and the polymer bump, said thin conductive metal layer in electrical contact with the at least one electrical connection and protecting the at least one electrical connection; forming a photoresist mask layer on the thin conductive metal layer, said photoresist mask having an opening of a size corresponding to the surface area of the compliant bump; electrolytically plating a ductile and compliant metal layer over the surface area defined by the photoresist mask to form an electrically conductive metallization layer comprising the ductile and compliant metal layer and a portion of the thin conductive metal layer over the polymer bump and a portion of the electrical connection; removing the photoresist mask to expose the remaining portion of the thin conductive metal layer; removing the remaining portion of the thin conductive metal layer to form a compliant bump that is electrically conductive with the at least one electrical connection and that is compliant according to the compliant properties of the polymer bump and metallization layer; such that the compliant bump is connectable between the at least one electrical connection and an electrical connection point through compression and adhesion of an adhesive flip chip integrated circuit.
Claim 38
Dependent Claim
22 words
The method of claim 35, further comprising the step of forming the electrically conductive compliant bump on an integrated circuit bond pad.
Claim 39
Dependent Claim
19 words
The method of claim 35, further comprising the step of forming the electrically conductive compliant bump on a substrate.
References Cited (Backward Citations)
US5223321A
Cited
US4696885A
Cited
US4692791A
Cited
US4640499A
Cited
US4682829A
Cited
US4693770A
Cited
US4716058A
Cited
US4740700A
Cited
US4859189A
Cited
US5223454A
Cited
US4848639A
Cited
US5208186A
Cited
US5071787A
Cited
US5074947A
Cited
US5196371A
Cited
US5189502A
Cited
US5187020A
Cited
US5290732A
Cited
US5246880A
Cited
US5284797A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-04-16 | 1999-10-16 | 2000-04-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-04-16 | 2003-10-16 | 2004-04-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-04-16 | 2007-10-16 | 2008-04-16 | $7700.00 | Window Closed / Lapsed |