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US5019943A
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High density chip stack having a zigzag-shaped face which accommodates connections between chips
Assignee: Unisys Corp
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Filing: 1990-02-14
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Granted: 1991-05-28
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Expires: 2010-02-14
Abstract
Abstract A high density integrated circuit module is comprised of a plurality of integrated circuit chips; each of the chips has top and bottom surfaces and thin sides; and all of the chips are arranged in a stack in which the sides of the chips form multiple faces of the stack. Also, in accordance with the invention, a selected face of the stack has a zigzag shape which exposes a portion of the top surface of each chip on that face; and, bonding pads for carrying input/output signals to/from the chips are located on the exposed top surface portion of the chips. This zigzag shape is produced by (a) providing an indentation in the side of each of the chips which lie along the selected stack face; or (b) by offsetting the sides of the chps from each other as they lie along the selected stack face; or (c) by providing respective spacers between the chips and indenting them from the chips along the selected stack face.
Inventors
- 👤 Charles J. Fassbender
- 👤 Jerry I. Tustaniwskyj
- 👤 Harshadrai Vora
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 13:06
CPC Classifications
H; H10; H10W; H10W90/00; H10D; H10D62/00; H10D62/10; H10D62/117; H10W72/00; H10W72/834; H10W90/20; H10W90/288; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
97 words
A high density integrated circuit module that is comprised of a plurality of integrated circuit chips; each of said chips having top and bottom surfaces and thin sides; and all of said chips being arranged in a stack in which the sides of said chips form multiple faces of said stack; wherein: one face of said stack has a zigzag shape which exposes a portion of the top surface of each chip on said one face; and, bonding pads, for carrying input/output signals to/from said chips, are located on the exposed top surface portions of said chips.
Claim 2
Dependent Claim
97 words
A high density integrated circuit module that is comprised of a plurality of integrated circuit chips; each of said chips having top and bottom surfaces and thin sides; and all of said chips being arranged in a stack in which the sides of said chips form multiple faces of said stack; wherein: one face of said stack has a zigzag shape which exposes a portion of the top surface of each chip on said one face; and, bonding pads, for carrying input/output signals to/from said chips, are located on the exposed top surface portions of said chips.
Claim 3
Dependent Claim
40 words
A module according to claim 1 wherein each side of said chips along said one face of said stack has an indentation which produces said zigzag shape and exposes said portion of the top surface of the next adjacent chip.
Claim 4
Dependent Claim
29 words
A module according to claim 2 wherein conductive bumps lie on and extend perpendicular to said bonding pads, and wherein said bumps terminate without touching said indented chip side.
Claim 5
Dependent Claim
51 words
A module according to claim 3 wherein an electrical insulator covers said one face of said stack except for a plurality of via holes which expose respective portions of said bumps on said one face, and patterned electrical conductors lie on said insulator and interconnect said chips through said via holes.
Claim 6
Dependent Claim
35 words
A module according to claim 3 wherein a plurality of input/output leads respectively extend from said bumps in a cantilevered fashion in a direction away from said one face without touching said indented chip's side.
Claim 7
Dependent Claim
17 words
A module according to claim 2 wherein said indentation is in the form of a flat bevel.
Claim 8
Dependent Claim
17 words
A module according to claim 2 wherein said indentation is in the form of a curved bevel.
Claim 9
Dependent Claim
17 words
A module according to claim 2 wherein said indentation is in the form of a rectangular notch.
Claim 10
Dependent Claim
41 words
A module according to claim 1 wherein each chip in said stack is offset from the next adjacent chip, along said one face, to produce said zigzag shape and expose said portion of the top surface of the next adjacent chip.
Claim 11
Dependent Claim
42 words
A module according to claim 9 wherein conductive bumps lie on and extend perpendicular to said bonding pads, and wherein a plurality of input/output leads respectively extend from said bumps in a cantilevered fashion in a direction away from said zigzag-shaped face.
Claim 12
Dependent Claim
39 words
A module according to claim 10 wherein said stack is mounted by said leads to a surface of a substrate such that the top and bottom surfaces of said chips lean and are not perpendicular to the substrate surface.
Claim 13
Dependent Claim
16 words
A module according to claim 11 wherein the amount of said lean is less than 45°.
Claim 14
Dependent Claim
43 words
A module according to claim 1 wherein respective spacers lie between said chips; and, said spacers are indented from said chips, along said one face, to produce said zigzag shape and expose said portion of the top surface of the next adjacent chip.
Claim 15
Dependent Claim
42 words
A module according to claim 13 wherein conductive bumps lie on and extend perpendicular to said bonding pads, and wherein a plurality of input/output leads respectively extend from said bumps in a cantilevered fashion in a direction away from said zigzag-shaped face.
Claim 16
Dependent Claim
35 words
A module according to claim 14 wherein said stack has a second face which lies opposite to said one face, and said spacers form cooling fins by extending beyond said chips on said second face.
Claim 17
Dependent Claim
35 words
A module according to claim 14 wherein said stack has a second face which lies perpendicular to said one face, and said spacers form cooling fins by extending beyond said chips on said second face.
Claim 18
Dependent Claim
22 words
A module according to claim 14 wherein said spacers and said chips have respective thermal expansion coefficients which are essentially the same.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-05-27 | 1994-11-26 | 1995-05-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-05-27 | 1998-11-26 | 1999-05-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-05-27 | 2002-11-26 | 2003-05-28 | $7700.00 | Window Closed / Lapsed |