US5578696A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Heat resistant adhesive film, an adhesion structure, and method of adhesion
Assignee: Nitto Denko Corp
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Filing: 1994-04-06
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Granted: 1996-11-26
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Expires: 2014-04-06
Abstract
Abstract A heat-resistant adhesive film, an adhesion structure obtained using the same, and an adhesion method using the same are disclosed, the film comprising a polyisoimide resin containing at least 40 mol % of an isoimide unit represented by formula (I): ##STR1## wherein R 1 represents a tetravalent aromatic or aliphatic residue; R 2 represents a divalent aromatic or aliphatic residue; and the arrow represents a bond replaceable on isomerization, in the molecule thereof. The isoimide unit of the polyisoimide resin is easily converted to an imide unit on heating, e.g., hot pressing with an adherend, to provide a cover-lay film or a single-sided or double-sided base for printed circuit boards having excellent adhesion, heat resistance, dimensional precision, and workability.
Inventors
- 👤 Amane Mochizuki
- 👤 Kazumi Higashi
- 👤 Masako Maeda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 15:22
CPC Classifications
C; C08; C08G; C08G73/00; C08G73/06; C08G73/10; C08G73/1089; C09; C09J; C09J179/00; C09J179/04; C09J179/08; H; H05; H05K; H05K3/00; H05K3/38; H05K3/386; Y; Y10; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31678; Y10T428/31681; Y10T428/31721
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
55 words
A heat-resistant adhesive film comprising a polyisoimide resin containing at least 40 mol % of an isoimide unit represented by formula (I): ##STR3## wherein R 1 represents a tetravalent aromatic or aliphatic residue; R 2 represents a divalent aromatic or aliphatic residue; and the arrows represents a bond replaceable on isomerization, in the molecule thereof.
Claim 2
Dependent Claim
55 words
A heat-resistant adhesive film comprising a polyisoimide resin containing at least 40 mol % of an isoimide unit represented by formula (I): ##STR3## wherein R 1 represents a tetravalent aromatic or aliphatic residue; R 2 represents a divalent aromatic or aliphatic residue; and the arrows represents a bond replaceable on isomerization, in the molecule thereof.
Claim 3
Dependent Claim
75 words
A heat-resistant adhesive film comprising a polyimide resin obtained by heating a heat-resistant adhesive film comprising a polyisoimide resin containing, in the molecule thereof, at least 40 mol % of an isoimide unit represented by formula (I): ##STR4## wherein R 1 represents a tetravalent aromatic or aliphatic residue; R 2 represents a divalent aromatic or aliphatic residue; and the arrows represents a bond replaceable on isomerization, to convert said isoimide unit to an imide unit.
Claim 4
Dependent Claim
75 words
A heat-resistant adhesive film comprising a polyimide resin obtained by heating a heat-resistant adhesive film comprising a polyisoimide resin containing, in the molecule thereof, at least 40 mol % of an isoimide unit represented by formula (I): ##STR4## wherein R 1 represents a tetravalent aromatic or aliphatic residue; R 2 represents a divalent aromatic or aliphatic residue; and the arrows represents a bond replaceable on isomerization, to convert said isoimide unit to an imide unit.
Claim 5
Dependent Claim
65 words
A heat-resistant adhesive film comprising a support having formed thereon a heat-resistant adhesive film comprising a polyisoimide resin containing at least 40 mol % of an isoimide unit represented by formula (I): ##STR5## wherein R 1 represents a tetravalent aromatic or aliphatic residue; R 2 represents a divalent aromatic or aliphatic residue; and the arrows represents a bond replaceable on isomerization, in the molecule thereof.
Claim 6
Dependent Claim
65 words
A heat-resistant adhesive film comprising a support having formed thereon a heat-resistant adhesive film comprising a polyisoimide resin containing at least 40 mol % of an isoimide unit represented by formula (I): ##STR5## wherein R 1 represents a tetravalent aromatic or aliphatic residue; R 2 represents a divalent aromatic or aliphatic residue; and the arrows represents a bond replaceable on isomerization, in the molecule thereof.
Claim 7
Dependent Claim
16 words
A heat-resistant adhesive film as claimed in claim 3, wherein said support is a flexible support.
Claim 8
Dependent Claim
20 words
A heat-resistant adhesive film as claimed in claim 3, wherein said support is a plastic film or a metal foil.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-11-26 | 2000-05-27 | 2000-11-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-11-26 | 2004-05-27 | 2004-11-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-11-26 | 2008-05-27 | 2008-11-26 | $7700.00 | Window Closed / Lapsed |