US6518098B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
IC package with dual heat spreaders
Assignee: Micron Technology Inc
•
Filing: 2001-08-29
•
Granted: 2003-02-11
•
Expires: 2021-08-29
Abstract
Abstract An integrated circuit device has a heat spreader attached to each of the major outer encapsulant surfaces. One or both of the heat spreaders has a pair of end posts configured for insertion into through-holes in a substrate to position and support the device during and following the outer lead solder reflow step at board assembly. The heat spreaders provide high heat dissipation and EMR shielding, and may be connected to the substrate ground to become ground planes.
Inventors
- 👤 David J. Corisis
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 18:20
CPC Classifications
H; H10; H10W; H10W42/00; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W42/20; H10W70/00; H10W70/40; H10W70/461; H10W72/00; H10W72/071; H10W72/075; H10W72/50; H10W72/531; H10W72/5366; H10W72/90; H10W72/951; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/49126; Y10T29/4913; Y10T29/49146; Y10T29/49147; Y10T29/49169; Y10T29/49171; Y10T29/49172; Y10T29/49174
Claims Analysis
Total Claims: 30
Claim 1
Independent Claim
260 words
A method for forming a semiconductor device comprising: providing a semiconductor die connected to exterior leads extending therefrom; encapsulating said semiconductor die in a material to form a package having opposing major surfaces, a peripheral edge having a register apparatus therein and a portion of said exterior leads connected to said semiconductor die projecting therefrom; forming a pair of heat spreaders, said pair of heat spreaders having at least two posts extending therefrom for contacting at least a portion of a substrate, each heat spreader of said pair of heat spreaders configured to cover a portion of said opposing major surfaces, said pair of heat spreaders providing essentially a sole structural support for at least one of said exterior leads, said pair of heat spreaders comprising register apparatus on at least one peripheral edge thereof for accurate mounting to said opposing major surfaces; attaching said pair of heat spreaders to said opposing major surfaces of said package formed by said material encapsulating said semiconductor die by aligning each of said register apparatus of said pair of heat spreaders with said register apparatus of said package to form a a recess extending into said opposing major surfaces and each said pair of heat spreaders; positioning said pair of heat spreaders so as to provide and opening between distal end portions of said pair of heat spreaders; and performing another encapsulation step for forming a final package having portions of said pair of heat spreaders therein, said exterior leads and portions of said at least two posts extending from said final package.
Claim 2
Independent Claim
260 words
A method for forming a semiconductor device comprising: providing a semiconductor die connected to exterior leads extending therefrom; encapsulating said semiconductor die in a material to form a package having opposing major surfaces, a peripheral edge having a register apparatus therein and a portion of said exterior leads connected to said semiconductor die projecting therefrom; forming a pair of heat spreaders, said pair of heat spreaders having at least two posts extending therefrom for contacting at least a portion of a substrate, each heat spreader of said pair of heat spreaders configured to cover a portion of said opposing major surfaces, said pair of heat spreaders providing essentially a sole structural support for at least one of said exterior leads, said pair of heat spreaders comprising register apparatus on at least one peripheral edge thereof for accurate mounting to said opposing major surfaces; attaching said pair of heat spreaders to said opposing major surfaces of said package formed by said material encapsulating said semiconductor die by aligning each of said register apparatus of said pair of heat spreaders with said register apparatus of said package to form a a recess extending into said opposing major surfaces and each said pair of heat spreaders; positioning said pair of heat spreaders so as to provide and opening between distal end portions of said pair of heat spreaders; and performing another encapsulation step for forming a final package having portions of said pair of heat spreaders therein, said exterior leads and portions of said at least two posts extending from said final package.
Claim 3
Dependent Claim
49 words
The method of claim 1 , further comprising: providing a substrate having at least one electrical substrate lead formed thereon; and forming substrate areas in said substrate for insertion of said a least two posts therein to align said exterior leads with said at least one electrical substrate lead.
Claim 4
Dependent Claim
31 words
The method of claim 2 , further comprising: inserting said at least two posts into said substrate areas; and connecting said exterior leads to said at least one electrical substrate lead.
Claim 5
Dependent Claim
21 words
The method of claim 3 , further comprising: securing said at least two posts to said substrate area with adhesive material.
Claim 6
Dependent Claim
23 words
The method of claim 1 , further comprising: electrically connecting at least one of said pair of heat spreaders to a ground bus.
Claim 7
Dependent Claim
21 words
The method of claim 5 , wherein a post of said pair of heat spreaders is connected to said ground bus.
Claim 8
Independent Claim
250 words
A method for forming a semiconductor device comprising: forming a semiconductor die having exterior leads connected thereto; encapsulating said semiconductor die with a material to form a package having two opposing major surfaces, a peripheral edge having a register apparatus therein and a portion of said exterior leads projecting therefrom; forming a pair of heat spreaders, said pair of heat spreaders having at least two through-hole posts extending therefrom for contacting a least a portion of a substrate, each heat spreader of said pair of heat spreaders configured substantially cover one of said opposing major surfaces of said package, said pair of heat spreaders comprising register apparatus on at least one peripheral edge thereof for accurate mounting to said two opposing major surfaces; attaching said pair of heat spreaders to said two opposing major surfaces of said package so as to provide essentially the sole structural support for at least one of said exterior leads, said attaching comprising aligning each of said register apparatus of said pair of heat spreaders with said register apparatus of said package to form a recess extending into said two opposing major surfaces and each of said pair of heat spreaders; positioning said pair of heat spreaders so as to provide an opening between distal end portions of said pair of heat spreaders; and encapsulating portions of said pair heat spreaders and portions of said package forming a final package, said exterior leads and said at least two through-hole posts extending from said final package.
Claim 9
Independent Claim
250 words
A method for forming a semiconductor device comprising: forming a semiconductor die having exterior leads connected thereto; encapsulating said semiconductor die with a material to form a package having two opposing major surfaces, a peripheral edge having a register apparatus therein and a portion of said exterior leads projecting therefrom; forming a pair of heat spreaders, said pair of heat spreaders having at least two through-hole posts extending therefrom for contacting a least a portion of a substrate, each heat spreader of said pair of heat spreaders configured substantially cover one of said opposing major surfaces of said package, said pair of heat spreaders comprising register apparatus on at least one peripheral edge thereof for accurate mounting to said two opposing major surfaces; attaching said pair of heat spreaders to said two opposing major surfaces of said package so as to provide essentially the sole structural support for at least one of said exterior leads, said attaching comprising aligning each of said register apparatus of said pair of heat spreaders with said register apparatus of said package to form a recess extending into said two opposing major surfaces and each of said pair of heat spreaders; positioning said pair of heat spreaders so as to provide an opening between distal end portions of said pair of heat spreaders; and encapsulating portions of said pair heat spreaders and portions of said package forming a final package, said exterior leads and said at least two through-hole posts extending from said final package.
Claim 10
Dependent Claim
48 words
The method of claim 7 , further comprising: providing said substrate having a plurality of electrical substrate leads formed thereon; and forming through-holes in said substrate for insertion of said at least two through-hole posts therein for aligning said exterior leads with said plurality of electrical substrate leads.
Claim 11
Dependent Claim
30 words
The method of claim 8 , further comprising: inserting said at least two through-holes posts into said through-holes and attaching said exterior leads to said plurality of electrical substrate leads.
Claim 12
Dependent Claim
21 words
The method of claim 8 , further comprising: securing said at least two through-hole posts in said through-holes with adhesive material.
Claim 13
Dependent Claim
23 words
The method of claim 8 , further comprising: conductivity attaching at least one of said pair of heat spreaders to a ground bus.
Claim 14
Dependent Claim
29 words
The method of claim 11 , further comprising: connecting said at least two through-hole posts of said pair of heat spreaders to said ground bus located on said substrate.
Claim 15
Independent Claim
305 words
The method for forming a semiconductor device comprising: forming a semiconductor die having exterior leads connected thereto; encapsulating said semiconductor die with a material to form a package having two opposing major surfaces and a portion of said exterior leads projecting therefrom; forming register apparatus on at least one peripheral edge of said package; forming a pair of heat spreaders, said pair of heat spreaders having at least two through-hole posts extending therefrom, each heat spreader of said pair of heat spreaders configured to substantially cover one of said two opposing major surfaces of said package; forming register apparatus on said each heat spreader of said pair of heat spreaders, said register apparatus formed on at least one peripheral edge of said each heat spreader for machine positioning and attachment of said each heat spreader on one of said two opposing major surfaces of said package, said forming said register apparatus on said at least one peripheral edge of said each heat spreader comprising cutout portions of said each heat spreader of said pair of heat spreader; attaching said pair of heat spreaders to said two opposing major surfaces of said package so as to provide essentially a sole structural support for at least one of said exterior leads, wherein said attaching comprises aligning each of said register apparatus of said pair of heat spreaders with said register apparatus of said package to form a recess extending into said two opposing major surfaces and each of said pair of heat spreaders; positioning said pair of heat spreaders so as to provide an opening between distal end portions of said pair of heat spreaders; and encapsulating portions of said pair of heat spreaders and portions of said package forming a final package, said exterior leads and at least two through-hole posts extending from said final package.
Claim 16
Independent Claim
305 words
The method for forming a semiconductor device comprising: forming a semiconductor die having exterior leads connected thereto; encapsulating said semiconductor die with a material to form a package having two opposing major surfaces and a portion of said exterior leads projecting therefrom; forming register apparatus on at least one peripheral edge of said package; forming a pair of heat spreaders, said pair of heat spreaders having at least two through-hole posts extending therefrom, each heat spreader of said pair of heat spreaders configured to substantially cover one of said two opposing major surfaces of said package; forming register apparatus on said each heat spreader of said pair of heat spreaders, said register apparatus formed on at least one peripheral edge of said each heat spreader for machine positioning and attachment of said each heat spreader on one of said two opposing major surfaces of said package, said forming said register apparatus on said at least one peripheral edge of said each heat spreader comprising cutout portions of said each heat spreader of said pair of heat spreader; attaching said pair of heat spreaders to said two opposing major surfaces of said package so as to provide essentially a sole structural support for at least one of said exterior leads, wherein said attaching comprises aligning each of said register apparatus of said pair of heat spreaders with said register apparatus of said package to form a recess extending into said two opposing major surfaces and each of said pair of heat spreaders; positioning said pair of heat spreaders so as to provide an opening between distal end portions of said pair of heat spreaders; and encapsulating portions of said pair of heat spreaders and portions of said package forming a final package, said exterior leads and at least two through-hole posts extending from said final package.
Claim 17
Dependent Claim
48 words
The method of claim 13 , further comprising: providing a substrate having a plurality of electrical substrate leads formed thereon; and forming through-holes in said substrate for insertion of said at least two through-hole posts therein for aligning said exterior leads with said plurality of electrical substrate leads.
Claim 18
Dependent Claim
30 words
The method of claim 14 , further comprising: inserting said at least two through-hole posts into said through-holes and attaching said exterior leads to said plurality of electrical substrate leads.
Claim 19
Dependent Claim
20 words
The method of claim 15 , further comprising: securing at least two through-hole posts in said through-holes with adhesive material.
Claim 20
Dependent Claim
28 words
The method of claim 15 , further comprising: connecting said at least two through-hole post of said pair of heat spreaders to ground bus located on said substrate.
Claim 21
Dependent Claim
23 words
The method of claim 13 , further comprising: conductivity attaching at least one of said pair of heat spreaders to a ground bus.
Claim 22
Independent Claim
290 words
The method for forming a semiconductor device comprising: forming a semiconductor die having exterior leads connected thereto; encapsulating said semiconductor die with a material to form a package having two opposing major surfaces and four minor edge surfaces connecting said two opposing major surfaces, said package having a portion of said exterior leads projecting from one of said four minor edge surfaces, said four minor edge surfaces having no heat dissipating structures thereon; forming register apparatus on at least one peripheral edge of said package; forming a pair of heat spreaders, said pair of heat spreaders having at least two through-hole posts extending therefrom for contacting at least a portion of a substrate, each heat spreader of said pair of heat spreaders configures to substantially cover one of said opposing major surfaces of said package; forming register apparatus on each heat spreader of said pair of heat spreaders, said register apparatus formed on at least one peripheral edge of said each heat spreader; attaching said pair of heat spreaders to said two opposing major surfaces of said package so as to provide essentially a sole structural support for at least one of said exterior leads, wherein said attaching comprises aligning each of said register apparatus of said pair of heat spreaders with said register apparatus of said package to form a recess extending into said two opposing major surfaces and each of said pair of heat spreaders; positioning said heat spreaders so as to provide an opening between distal end portions of said pair of heat spreaders; and encapsulating portions of said pair of heat spreaders and portions of said package forming a final package, said exterior leads and said at least two through-hole posts extending from said final package.
Claim 23
Independent Claim
290 words
The method for forming a semiconductor device comprising: forming a semiconductor die having exterior leads connected thereto; encapsulating said semiconductor die with a material to form a package having two opposing major surfaces and four minor edge surfaces connecting said two opposing major surfaces, said package having a portion of said exterior leads projecting from one of said four minor edge surfaces, said four minor edge surfaces having no heat dissipating structures thereon; forming register apparatus on at least one peripheral edge of said package; forming a pair of heat spreaders, said pair of heat spreaders having at least two through-hole posts extending therefrom for contacting at least a portion of a substrate, each heat spreader of said pair of heat spreaders configures to substantially cover one of said opposing major surfaces of said package; forming register apparatus on each heat spreader of said pair of heat spreaders, said register apparatus formed on at least one peripheral edge of said each heat spreader; attaching said pair of heat spreaders to said two opposing major surfaces of said package so as to provide essentially a sole structural support for at least one of said exterior leads, wherein said attaching comprises aligning each of said register apparatus of said pair of heat spreaders with said register apparatus of said package to form a recess extending into said two opposing major surfaces and each of said pair of heat spreaders; positioning said heat spreaders so as to provide an opening between distal end portions of said pair of heat spreaders; and encapsulating portions of said pair of heat spreaders and portions of said package forming a final package, said exterior leads and said at least two through-hole posts extending from said final package.
Claim 24
Dependent Claim
48 words
The method of claim 19 , further comprising: providing a substrate having a plurality of electrical substrate leads formed thereon; and forming through-holes in said substrate for insertion of said at least two through-hole posts therein for aligning said exterior leads with said plurality of electrical substrate leads.
Claim 25
Dependent Claim
30 words
The method of claim 20 , further comprising: inserting aid at least two through-hole posts into said through-holes and attaching said exterior leads to said plurality of electrical substrate leads.
Claim 26
Dependent Claim
21 words
The method of claim 21 , further comprising: securing said at least two through-hole posts in said through-holes with adhesive material.
Claim 27
Dependent Claim
26 words
The method of claim 21 , further comprising: connecting a through-hole post of said pair of heat spreaders to a ground bus located on said substrate.
Claim 28
Dependent Claim
23 words
The method of claim 19 , further comprising: conductivity attaching at least one of said pair of heat spreaders to a ground bus.
Claim 29
Dependent Claim
50 words
The method of claim 19 , wherein said forming register apparatus on at least one peripheral edge of said heat spreader of said pair of heat spreaders is for machine positioning and attachment of each pair of heat spreader on one of said two opposing major surfaces of said package.
Claim 30
Dependent Claim
34 words
The method of claim 25 , wherein said forming register apparatus on at least one peripheral edge of said heat spreader comprises cutout portions of each heat spreader of said pair of heat spreaders.
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 2006-02-10 | 2006-08-12 | 2007-02-11 | $2000.00 | Window Closed / Lapsed |
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