Semiconductor device having radiator

Claim 2

A semiconductor device including a semiconductor chip for mounting on a base plate, comprising: a semiconductor package, for housing the semiconductor chip, having a width and having first and second main surfaces on opposite sides of the package from each other, the first main surface having a plurality of lead terminals extending a predetermined distance from the semiconductor package in the direction of said width and being in confronting relationship with the base plate, and the second main surface facing away from the base plate; and a radiator having a pillar and a plurality of disc-shaped fins extending from said pillar, a bottom end of said pillar being bonded to the second main surface of said semiconductor package, a top end of said pillar having a first hole for insertion of a handling instrument for transportation of said semiconductor package, said first hole extending into said pillar along a longitudinal direction of said pillar and opening away from the semiconductor package and the base plate, the radius of each disk-shaped fin being larger than half the width of said package and smaller than half the width of said semiconductor package plus the predetermined distance.

Claim 3

A semiconductor device having a radiator as set forth in claim 1, said device further comprising: a stud mounted on said semiconductor package, said pillar having a second hole for inserting said stud; and an adhesive agent for attaching said radiator to said semiconductor package by inserting said stud into said second hole and securing it therein with said adhesive agent.

Claim 4

A semiconductor device having a radiator as set forth in claim 2, wherein said second hole is formed in series with said first hole formed in said end opposite to said end which is bonded to said semiconductor package.

Claim 5

A radiator bondable to a semiconductor package containing a semiconductor chip, the semiconductor package having a width, having external leads extending a predetermined distance from the semiconductor package in the direction of the width, and being mounted on a base plate, comprising: a pillar having a plurality of fins extending from said pillar, a bottom end of said pillar being bondable to said semiconductor package, a top end of said pillar having a first hole for insertion of a handling instrument for transportation of said semiconductor package, the first hole extending into said pillar along a longitudinal direction of said pillar and opening away from the base plate, said fins having a diameter greater than half of the width of the semiconductor package and less than half of the width of the semiconductor package plus the predetermined distance.

Claim 6

A radiator bondable to a semiconductor package containing a semiconductor chip, the semiconductor package having a width, having external leads extending a predetermined distance from the semiconductor package in the direction of the width, and being mounted on a base plate, comprising: a pillar having a plurality of fins extending from said pillar, a bottom end of said pillar being bondable to said semiconductor package, a top end of said pillar having a first hole for insertion of a handling instrument for transportation of said semiconductor package, the first hole extending into said pillar along a longitudinal direction of said pillar and opening away from the base plate, said fins having a diameter greater than half of the width of the semiconductor package and less than half of the width of the semiconductor package plus the predetermined distance.

Claim 7

A radiator as set forth in claim 4, wherein said pillar has a second hole in the bottom end, the second hole being in series with the first hole.

Claim 8

A radiator as set forth in claim 5, further comprising: a metal base in electrical contact with the semiconductor chip; a metal plate disposable on the upper surface of the semiconductor package and in contact with said metal base; a metal stud bonded to said metal plate; and an adhesive agent for attaching said radiator to said stud by inserting said stud into the second hole and securing it therein with said adhesive agent.

Claim 9

A semiconductor device including a semiconductor chip for mounting on a base plate, comprising: a semiconductor package, for housing the semiconductor chip, having a width and having first and second main surfaces on opposite sides of the package from each other, the first main surface having a plurality of lead terminals extending a predetermined distance from the semiconductor package in the direction of said width and being in confronting relationship with the base plate, and the second main surface facing away from the base plate; and a radiator having a pillar and a plurality of disc-shaped fins extending from said pillar, a bottom end of said pillar being bonded to the second main surface of said semiconductor package, a top end of said pillar having a first hole for insertion of a probe for testing said semiconductor package, said first hole extending into said pillar along a longitudinal direction of said pillar and opening away from the semiconductor package and the base plate, the radius of each disk-shaped fin being larger than half the width of said package and smaller than half the width of said semiconductor package plus the predetermined distance.

Claim 10

A semiconductor device including a semiconductor chip for mounting on a base plate, comprising: a semiconductor package, for housing the semiconductor chip, having a width and having first and second main surfaces on opposite sides of the package from each other, the first main surface having a plurality of lead terminals extending a predetermined distance from the semiconductor package in the direction of said width and being in confronting relationship with the base plate, and the second main surface facing away from the base plate; and a radiator having a pillar and a plurality of disc-shaped fins extending from said pillar, a bottom end of said pillar being bonded to the second main surface of said semiconductor package, a top end of said pillar having a first hole for insertion of a probe for testing said semiconductor package, said first hole extending into said pillar along a longitudinal direction of said pillar and opening away from the semiconductor package and the base plate, the radius of each disk-shaped fin being larger than half the width of said package and smaller than half the width of said semiconductor package plus the predetermined distance.

Claim 11

A radiator bondable to a semiconductor package containing a semiconductor chip, the semiconductor package having a width, having external leads extending a predetermined distance from the semiconductor package in the direction of the width, and being mounted on a base plate, comprising: a pillar having a plurality of fins extending from said pillar, a bottom end of said pillar being bondable to said semiconductor package, a top end of said pillar having a first hole for insertion of a probe for testing said semiconductor package, the first hole extending into said pillar along a longitudinal direction of said pillar and opening away from the base plate, said fins having a diameter greater than half of the width of the semiconductor package and less than half of the width of the semiconductor package plus the predetermined distance.

Claim 12

A radiator bondable to a semiconductor package containing a semiconductor chip, the semiconductor package having a width, having external leads extending a predetermined distance from the semiconductor package in the direction of the width, and being mounted on a base plate, comprising: a pillar having a plurality of fins extending from said pillar, a bottom end of said pillar being bondable to said semiconductor package, a top end of said pillar having a first hole for insertion of a probe for testing said semiconductor package, the first hole extending into said pillar along a longitudinal direction of said pillar and opening away from the base plate, said fins having a diameter greater than half of the width of the semiconductor package and less than half of the width of the semiconductor package plus the predetermined distance.

Claim 13

A radiator, bondable to an associated semiconductor package containing a semiconductor chip, for dissipating heat from said package and for facilitating mounting of said associated semiconductor package on a predetermined mounting position of a base plate, said package having first and second opposite, main surfaces defining the major lateral width dimension of the package and having lead terminals extending from said first main surface, comprising: a generally elongated pillar defining a central, longitudinal axis and having a bottom end and a top end, said bottom end being bondable to said second main surface of said package; plural heat radiating fins formed integrally with said pillar and extending laterally outwardly from said pillar relative to said central longitudinal axis at longitudinally spaced positions along said axis, the lateral outward dimension of said fins being greater than the major lateral width dimension of said package; and a hole extending longitudinally and interiorly of said pillar from said upper end thereof and defining an interior engagement surface of said pillar which is accessible for engaging said pillar and transporting said associated pillar and semiconductor package to the predetermined mounting position on the base plate.

Claim 14

A radiator, bondable to an associated semiconductor package containing a semiconductor chip, for dissipating heat from said package and for facilitating mounting of said associated semiconductor package on a predetermined mounting position of a base plate, said package having first and second opposite, main surfaces defining the major lateral width dimension of the package and having lead terminals extending from said first main surface, comprising: a generally elongated pillar defining a central, longitudinal axis and having a bottom end and a top end, said bottom end being bondable to said second main surface of said package; plural heat radiating fins formed integrally with said pillar and extending laterally outwardly from said pillar relative to said central longitudinal axis at longitudinally spaced positions along said axis, the lateral outward dimension of said fins being greater than the major lateral width dimension of said package; and a hole extending longitudinally and interiorly of said pillar from said upper end thereof and defining an interior engagement surface of said pillar which is accessible for engaging said pillar and transporting said associated pillar and semiconductor package to the predetermined mounting position on the base plate.

Claim 15

A radiator as recited in claim 9, wherein: said hole is of a predetermined longitudinal length, sufficiently less than the longitudinal length of said pillar so as not to materially affect the heat dissipation capability of said radiator.

Claim 16

Plural radiators, each as recited in claim 9, bondable to respectively associated, plural semiconductor packages of at least two different types, wherein: said longitudinally extending holes of said plural radiators have longitudinal lengths of at least two, different and predetermined amounts, respectively selected to correspond to and thereby identify, by the respective longitudinal lengths thereof, said two different types of said semiconductor packages respectively bonded thereto.

Claim 17

A radiator as recited in claim 9, wherein said semiconductor package further comprises a mounting stud of predetermined axial length secured to and extending from a central position of said main surface of said semiconductor package, and wherein there is further provided: a second hole extending longitudinally into said pillar from said lower end thereof by a distance corresponding to the axial length of said stud, for receiving said stud in telescoping relationship in the assembled relationship of said radiator and said associated semiconductor package.