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EP0054597A1 Expired / Lapsed EP ⏱️ 0.0 years remaining

Cooling device for module pins

Assignee: Compagnie IBM France SAS
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Filing: 1980-12-18
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Granted: —
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Expires: 2000-12-18
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Abstract

Abstract Translated from French Dispositif pour le refroidissement des modules de circuits intégrés, comprenant des manchons (4) qui sont placés autour des broches (3) du module à refroidir (1). Chaque manchon comporte un corps cylindrique creux qui reçoit une broche et des ailettes de diffusion de la chaleur. Ces manchons servent en même temps d'entretoise entre le module et la carte sur laquelle il est enfiché. Device for cooling integrated circuit modules, comprising sleeves (4) which are placed around the pins (3) of the module to be cooled (1). Each sleeve has a hollow cylindrical body which receives a pin and heat diffusion fins. These sleeves serve at the same time as a spacer between the module and the card on which it is inserted.

Inventors

  • 👤 André Falda
  • 👤 Daniel Jacques Henri Klein

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-10-28 18:59
CPC Classifications
H; H01; H01R; H01R13/00; H01R13/46; H01R13/533; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/226; H10W40/228; H10W40/60

Claims Analysis

Total Claims: 0
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References Cited (Backward Citations)

FR1037060A Cited
FR74195E Cited
DE1157281B Cited
US3636501A Cited

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