EP0079238A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Semiconductor devices provided with heat-dissipating means
Assignee: Fujitsu Ltd
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Filing: 1982-11-09
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Granted: —
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Expires: 2002-11-09
Abstract
Abstract A semiconductor device includes a radiator (33) fixed on a package (20), said package including a projection (30) formed on its surface, and said radiator (33) comprising a recess (31) for receiving said projection. The projection is fixed within the recess by resin. Such a fixing system can improve bonding of the radiator, to the package, and thermal efficiency.
Inventors
- 👤 Hideji Aoki
- 👤 Masahiro Sugimoto
- 👤 Tetsushi Wakabayashi
- 👤 Kiyoshi Muratake
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-24 13:44
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
59 words
A semiconductor device (20) having a heat-dissipation body (33) fixed adjacent to an external surface portion of the housing of the device, characterised in that the housing is provided with a projection (30) projecting from the said external surface portion, and the said heat-dissipation body (33) is formed with a recess (31) in which the said projection is accommodated.
Claim 2
Dependent Claim
59 words
A semiconductor device (20) having a heat-dissipation body (33) fixed adjacent to an external surface portion of the housing of the device, characterised in that the housing is provided with a projection (30) projecting from the said external surface portion, and the said heat-dissipation body (33) is formed with a recess (31) in which the said projection is accommodated.
Claim 3
Dependent Claim
23 words
A device as claimed in claim 1, wherein the heat-dissipation body is adhesively bonded to the said housing by means of a resin.
Claim 4
Dependent Claim
17 words
A device as claimed in claim 1 or 2, wherein the projection (30) is a rod-like member.
Claim 5
Dependent Claim
25 words
A device as claimed in claim 1, 2 or 3, wherein said heat-dissipation body comprises a support portion (32) bearing a plurality of fins (34).
Claim 6
Independent Claim
25 words
A device as claimed in any preceding claim, wherein the said recess has a mouth which is wider than an interior region of the recess.
Claim 7
Dependent Claim
25 words
A device as claimed in claim 5, wherein the said recess has an outer portion which tapers from the mouth towards the said interior region.
Claim 8
Independent Claim
42 words
A device as claimed in any one of claims 1 to 4, wherein the said recess is bounded at its mouth by a rounded edge of the heat-dissipation body so that the mouth is wider than an interior region of the recess.
Claim 9
Independent Claim
51 words
A device as claimed in any preceding claim, wherein the projection is bonded to the said external surface portion by soldering the projection having been formed with a groove, for limiting a fillet of the solder, extending around an end portion of the projection that is adjacent to the said housing.
Claim 10
Dependent Claim
28 words
A device as claimed in claim 8, wherein the said external surface portion is formed with a groove surrounding the said projection for limiting the fillet of solder.
Claim 11
Independent Claim
26 words
A device as claimed in any preceding claim wherein a clearance exists around the said projection within the said recess, which clearance is filled with resin.
References Cited (Backward Citations)
No citation records indexed.
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