Module for integrated circuits

Claim 1

In an integrated circuit, in combination: a metal foil having a solid portion of generally rectangular configuration with a limited seat-forming area along one major edge of the rectangle and a plurality of transverse tongues integrally projecting from the opposite major edge thereof; a semiconductive chip bearing integrated circuitry and resting on said seat-forming area; an array of mutually disconnected conductor strips connected to respective terminals of said chip and disposed opposite said tongues substantially parallel to the latter; an elongate body of synthetic resin encasing said chip, part of said conductor strips and part of said metal foil while leaving free ends of said tongues and of said conductor strips projecting from opposite longitudinal edges of said body; and a heat-dissipating metallic member extending over substantially the entire length of said body while being closely juxtaposed and in contact substantially throughout said length with an exposed part of said metal foil, including said tongues, adjacent one of said opposite longitudinal edges.