US6498052B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Circuit, method of adhering an integrated circuit device to a substrate, and method of forming a circuit
Assignee: Round Rock Research LLC
•
Filing: 2001-10-09
•
Granted: 2002-12-24
•
Expires: 2021-10-09
Abstract
Abstract The present invention includes circuits, methods of adhering an integrated circuit device to a substrate, and methods of forming a circuit. According to one aspect of the present invention, a method of forming a circuit includes: providing an integrated circuit device having an outer surface and a plurality of conductive bumps upon the outer surface; providing a substrate having a plurality of bond pads which correspond to respective ones of the conductive bumps; providing an electrically insulative adhesive over at least a portion of the outer surface of the integrated circuit device; and coupling the integrated circuit device and the substrate following the providing the adhesive, the coupling connecting the outer surface of the integrated circuit device with the substrate and forming a plurality of electrical interconnections comprising the conductive bumps and the bond pads.
Inventors
- 👤 Joseph M. Brand
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:59
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/012; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/073; H10W72/20; H10W72/251
Claims Analysis
Total Claims: 53
Claim 1
Independent Claim
106 words
A method of adhering an integrated circuit device to a substrate comprising: providing an integrated circuit device having a plurality of conductive bumps and an electrically insulative adhesive upon at least a portion of an outer surface of the integrated circuit device; after the providing, bringing a substrate to which the integrated circuit device is to be bonded and the integrated circuit device into proximity with one another; and after the bringing, bonding the outer surface of the integrated circuit device to the substrate using the electrically insulative adhesive with at least some of the conductive bumps being in electrical communication with circuitry of the substrate.
Claim 2
Independent Claim
106 words
A method of adhering an integrated circuit device to a substrate comprising: providing an integrated circuit device having a plurality of conductive bumps and an electrically insulative adhesive upon at least a portion of an outer surface of the integrated circuit device; after the providing, bringing a substrate to which the integrated circuit device is to be bonded and the integrated circuit device into proximity with one another; and after the bringing, bonding the outer surface of the integrated circuit device to the substrate using the electrically insulative adhesive with at least some of the conductive bumps being in electrical communication with circuitry of the substrate.
Claim 3
Dependent Claim
18 words
The method according to claim 1 wherein the bringing comprises moving the integrated circuit device towards the substrate.
Claim 4
Dependent Claim
18 words
The method according to claim 1 wherein the bringing comprises moving the substrate towards the integrated circuit device.
Claim 5
Dependent Claim
26 words
The method according to claim 1 wherein the adhesive as provided on the integrated circuit device comprises a plurality of adhesive fillets about the conductive bumps.
Claim 6
Dependent Claim
22 words
The method according to claim 1 wherein the providing comprises providing the integrated circuit device having a plurality of exposed conductive bumps.
Claim 7
Dependent Claim
22 words
The method according to claim 1 further comprising electrically coupling the conductive bumps with a plurality of bond pads upon the substrate.
Claim 8
Dependent Claim
30 words
The method according to claim 1 wherein the bonding defines a buffer volume intermediate the integrated circuit device and the substrate having a greater volume of void space than adhesive.
Claim 9
Dependent Claim
14 words
The method according to claim 1 wherein the providing comprises providing a flip chip.
Claim 10
Dependent Claim
16 words
The method according to claim 1 wherein the adhesive contacts the conductive bumps following the bonding.
Claim 11
Independent Claim
106 words
A method of forming a circuit comprising: providing an integrated circuit device having an outer surface and a plurality of conductive bumps upon the outer surface; providing a substrate having a plurality of bond pads which correspond to respective ones of the conductive bumps; providing an electrically insulative adhesive over at least a portion of the outer surface of the integrated circuit device; and coupling the integrated circuit device and the substrate following the providing the adhesive, the coupling connecting the outer surface of the integrated circuit device with the substrate and forming a plurality of electrical interconnections comprising the conductive bumps and the bond pads.
Claim 12
Independent Claim
106 words
A method of forming a circuit comprising: providing an integrated circuit device having an outer surface and a plurality of conductive bumps upon the outer surface; providing a substrate having a plurality of bond pads which correspond to respective ones of the conductive bumps; providing an electrically insulative adhesive over at least a portion of the outer surface of the integrated circuit device; and coupling the integrated circuit device and the substrate following the providing the adhesive, the coupling connecting the outer surface of the integrated circuit device with the substrate and forming a plurality of electrical interconnections comprising the conductive bumps and the bond pads.
Claim 13
Dependent Claim
23 words
The method according to claim 10 wherein the providing an adhesive comprises providing a plurality of discrete adhesive fillets about the conductive bumps.
Claim 14
Dependent Claim
27 words
The method according to claim 10 wherein the providing the adhesive comprises providing the adhesive having a thickness approximately equal to a height of the conductive bumps.
Claim 15
Dependent Claim
30 words
The method according to claim 10 wherein the coupling defines a buffer volume intermediate the integrated circuit device and the substrate having a greater volume of void space than adhesive.
Claim 16
Dependent Claim
26 words
The method according to claim 10 wherein the providing the adhesive comprises providing the adhesive over substantially the entire outer surface of the integrated circuit device.
Claim 17
Dependent Claim
20 words
The method according to claim 14 further comprising removing portions of the adhesive proximate the conductive bumps before the coupling.
Claim 18
Dependent Claim
15 words
The method according to claim 15 wherein the removing comprises etching some of the adhesive.
Claim 19
Dependent Claim
15 words
The method according to claim 10 further comprising exposing the conductive bumps before the coupling.
Claim 20
Dependent Claim
33 words
The method according to claim 10 further comprising: forming a mask over the conductive bumps before the providing the adhesive; and removing the mask from the conductive bumps following the providing the adhesive.
Claim 21
Dependent Claim
18 words
The method according to claim 10 wherein the providing the integrated circuit device comprises providing a flip chip.
Claim 22
Dependent Claim
16 words
The method according to claim 10 wherein the adhesive contacts the electrical interconnections following the coupling.
Claim 23
Independent Claim
144 words
A method of forming a circuit comprising: providing an integrated circuit device having an outer surface and a plurality of conductive bumps upon the outer surface; providing a substrate having an outer surface and a plurality of bond pads upon the outer surface which correspond to respective ones of the conductive bumps; providing an electrically insulative adhesive over at least one of the outer surface of the integrated circuit device and the outer surface of the substrate, the providing the adhesive leaving at least one of the conductive bumps and bond pads outwardly exposed; and coupling the integrated circuit device and the substrate following the providing the adhesive, the coupling connecting the outer surface of the integrated circuit device with the outer surface of the substrate using the adhesive and forming a plurality of electrical interconnections comprising the conductive bumps and the bond pads.
Claim 24
Independent Claim
144 words
A method of forming a circuit comprising: providing an integrated circuit device having an outer surface and a plurality of conductive bumps upon the outer surface; providing a substrate having an outer surface and a plurality of bond pads upon the outer surface which correspond to respective ones of the conductive bumps; providing an electrically insulative adhesive over at least one of the outer surface of the integrated circuit device and the outer surface of the substrate, the providing the adhesive leaving at least one of the conductive bumps and bond pads outwardly exposed; and coupling the integrated circuit device and the substrate following the providing the adhesive, the coupling connecting the outer surface of the integrated circuit device with the outer surface of the substrate using the adhesive and forming a plurality of electrical interconnections comprising the conductive bumps and the bond pads.
Claim 25
Dependent Claim
13 words
The method according to claim 21 further comprising removing some of the adhesive.
Claim 26
Dependent Claim
37 words
The method according to claim 21 further comprising: forming a mask over at least one of the conductive bumps and the bond pads before the providing the adhesive; and removing the mask following the providing the adhesive.
Claim 27
Dependent Claim
18 words
The method according to claim 21 wherein the providing the integrated circuit device comprises providing a flip chip.
Claim 28
Dependent Claim
16 words
The method according to claim 21 wherein the adhesive contacts the electrical interconnections following the coupling.
Claim 29
Independent Claim
138 words
A method of forming a circuit comprising: providing an integrated circuit device having an outer surface and a plurality of conductive bumps upon the outer surface; providing a substrate having an outer surface and a plurality of bond pads upon the outer surface which correspond to respective ones of the conductive bumps; providing an adhesive over at least one of the outer surface of the integrated circuit device and the outer surface of the substrate; removing adhesive aligned with at least one of the conductive bumps and the bond pads; and coupling the integrated circuit device and the substrate following the removing, the coupling connecting the outer surface of the integrated circuit device with the outer surface of the substrate using the adhesive and forming a plurality of electrical interconnections comprising the conductive bumps and the bond pads.
Claim 30
Independent Claim
138 words
A method of forming a circuit comprising: providing an integrated circuit device having an outer surface and a plurality of conductive bumps upon the outer surface; providing a substrate having an outer surface and a plurality of bond pads upon the outer surface which correspond to respective ones of the conductive bumps; providing an adhesive over at least one of the outer surface of the integrated circuit device and the outer surface of the substrate; removing adhesive aligned with at least one of the conductive bumps and the bond pads; and coupling the integrated circuit device and the substrate following the removing, the coupling connecting the outer surface of the integrated circuit device with the outer surface of the substrate using the adhesive and forming a plurality of electrical interconnections comprising the conductive bumps and the bond pads.
Claim 31
Dependent Claim
24 words
The method according to claim 26 wherein the removing comprises etching adhesive proximate at least one of the conductive bumps and the bond pads.
Claim 32
Dependent Claim
21 words
The method according to claim 26 wherein the removing exposes at least one of the conductive bumps and the bond pads.
Claim 33
Dependent Claim
35 words
The method according to claim 26 wherein the providing the adhesive comprises forming a layer of adhesive having a thickness approximately equal to the height of one of the conductive bumps and the bond pads.
Claim 34
Dependent Claim
18 words
The method according to claim 26 wherein the providing the integrated circuit device comprises providing a flip chip.
Claim 35
Dependent Claim
16 words
The method according to claim 26 wherein the adhesive contacts the electrical interconnections following the coupling.
Claim 36
Dependent Claim
17 words
The method according to claim 26 wherein the providing the adhesive comprises providing an electrically insulative adhesive.
Claim 37
Independent Claim
139 words
A method of forming a circuit comprising: providing an integrated circuit device having an outer surface and a plurality of conductive bumps upon the outer surface; providing a substrate having an outer surface and a plurality of bond pads which correspond to respective ones of the conductive bumps; forming a mask over at least one of the conductive bumps and the bond pads; providing an adhesive over at least one of the outer surface of the integrated circuit device and the outer surface of the substrate following the forming; and coupling the integrated circuit device and the substrate following the providing the adhesive, the coupling connecting the outer surface of the integrated circuit device with the outer surface of the substrate using the adhesive and forming a plurality of electrical interconnections comprising the conductive bumps and the bond pads.
Claim 38
Independent Claim
139 words
A method of forming a circuit comprising: providing an integrated circuit device having an outer surface and a plurality of conductive bumps upon the outer surface; providing a substrate having an outer surface and a plurality of bond pads which correspond to respective ones of the conductive bumps; forming a mask over at least one of the conductive bumps and the bond pads; providing an adhesive over at least one of the outer surface of the integrated circuit device and the outer surface of the substrate following the forming; and coupling the integrated circuit device and the substrate following the providing the adhesive, the coupling connecting the outer surface of the integrated circuit device with the outer surface of the substrate using the adhesive and forming a plurality of electrical interconnections comprising the conductive bumps and the bond pads.
Claim 39
Dependent Claim
14 words
The method according to claim 33 further comprising removing the mask before the coupling.
Claim 40
Dependent Claim
23 words
The method according to claim 34 wherein the removing the mask exposes at least one of the conductive bumps and the bond pads.
Claim 41
Dependent Claim
35 words
The method according to claim 33 wherein the providing the adhesive comprises forming a layer of adhesive having a thickness approximately equal to the height of one of the conductive bumps and the bond pads.
Claim 42
Dependent Claim
18 words
The method according to claim 33 wherein the providing the integrated circuit device comprises providing a flip chip.
Claim 43
Dependent Claim
16 words
The method according to claim 33 wherein the adhesive contacts the electrical interconnections following the coupling.
Claim 44
Dependent Claim
16 words
The method according to claim 33 wherein the providing the adhesive comprises p electrically insulative adhesive.
Claim 45
Independent Claim
118 words
A method of forming a circuit comprising: providing an integrated circuit device having an outer surface and a plurality of conductive bumps upon the outer surface; providing a substrate having an outer surface and a plurality of bond pads which correspond to respective ones of the conductive bumps; forming a plurality of adhesive fillets at least partially about at least one of the conductive bumps and the bond pads; and coupling the integrated circuit device and the substrate following the forming, the coupling connecting the outer surface of the integrated circuit device with the outer surface of the substrate using the adhesive fillets and forming a plurality of electrical interconnections comprising the conductive bumps and the bond pads.
Claim 46
Independent Claim
118 words
A method of forming a circuit comprising: providing an integrated circuit device having an outer surface and a plurality of conductive bumps upon the outer surface; providing a substrate having an outer surface and a plurality of bond pads which correspond to respective ones of the conductive bumps; forming a plurality of adhesive fillets at least partially about at least one of the conductive bumps and the bond pads; and coupling the integrated circuit device and the substrate following the forming, the coupling connecting the outer surface of the integrated circuit device with the outer surface of the substrate using the adhesive fillets and forming a plurality of electrical interconnections comprising the conductive bumps and the bond pads.
Claim 47
Dependent Claim
34 words
The method according to claim 40 wherein the forming comprises forming the adhesive fillets individually having a height less than at least one of the height of the conductive bumps and the bond pads.
Claim 48
Dependent Claim
23 words
The method according to claim 40 wherein the forming comprises: forming a layer of adhesive; and etching some of the layer of adhesive.
Claim 49
Dependent Claim
18 words
The method according to claim 40 wherein the providing the integrated circuit device comprises providing a flip chip.
Claim 50
Dependent Claim
17 words
The method according to claim 40 wherein the adhesive fillets contact the electrical interconnections following the coupling.
Claim 51
Dependent Claim
18 words
The method according to claim 40 wherein the forming the adhesive fillets comprises forming electrically insulative adhesive fillets.
Claim 52
Independent Claim
153 words
A method of forming a circuit comprising: providing a flip chip having an outer surface and a plurality of conductive bumps configured to extend from the outer surface; providing a substrate having an outer surface and a plurality of bond pads which correspond to respective ones of the conductive bumps; providing an electrically insulative adhesive over substantially the entire outer surface and the conductive bumps of the flip chip; exposing the conductive bumps after the providing the adhesive; aligning the conductive bumps of the flip chip with the corresponding bond pads of the substrate; coupling the flip chip and the substrate after the exposing; bonding the outer surface of the flip chip and the outer surface of the substrate using the electrically insulative adhesive, the bonding comprising heating the adhesive following the coupling; and forming a plurality of electrical interconnections comprising the conductive bumps and the bond pads, the forming following the coupling.
Claim 53
Independent Claim
153 words
A method of forming a circuit comprising: providing a flip chip having an outer surface and a plurality of conductive bumps configured to extend from the outer surface; providing a substrate having an outer surface and a plurality of bond pads which correspond to respective ones of the conductive bumps; providing an electrically insulative adhesive over substantially the entire outer surface and the conductive bumps of the flip chip; exposing the conductive bumps after the providing the adhesive; aligning the conductive bumps of the flip chip with the corresponding bond pads of the substrate; coupling the flip chip and the substrate after the exposing; bonding the outer surface of the flip chip and the outer surface of the substrate using the electrically insulative adhesive, the bonding comprising heating the adhesive following the coupling; and forming a plurality of electrical interconnections comprising the conductive bumps and the bond pads, the forming following the coupling.
References Cited (Backward Citations)
US4732446A
Cited
US4835859A
Cited
US4984358A
Cited
US5019943A
Cited
US5496775A
Cited
US6077725A
Cited
US5578696A
Cited
US5930597A
Cited
US5930599A
Cited
US5952725A
Cited
US6103551A
Cited
US5834339A
Cited
US6061248A
Cited
US6011694A
Cited
US5897336A
Cited
US5956605A
Cited
US5726391A
Cited
US6002172A
Cited
US5872400A
Cited
US6222738B1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-12-23 | 2006-06-24 | 2006-12-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-12-23 | 2010-06-24 | 2010-12-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-12-23 | 2014-06-24 | 2014-12-24 | $7700.00 | Window Closed / Lapsed |