US5998860A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Double sided single inline memory module
Assignee: Texas Instruments Inc
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Filing: 1997-12-19
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Granted: 1999-12-07
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Expires: 2017-12-19
Abstract
Abstract A double sided single inline memory module (20) comprising a substrate (70) having a plurality of openings (86) and first and second surfaces (92, 94), a plurality of pads (82) being integral with the substrate (70) and extending into the opening (86), a plurality of chips (50) adhered to the substrate (70) having bonding pads (120), wire bonding (80) electrically connecting at least one of the bonding pads (120) to at least one of the pads (82) and potting material (90) encapsulating the wire bonding (80) and filling the opening (86) is disclosed.
Inventors
- 👤 Boon Pew Chan
- 👤 Kian Teng Eng
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 13:50
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W90/00; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/075; H10W72/07551; H10W72/07554; H10W72/20; H10W72/29; H10W72/50; H10W72/541; H10W72/5449; H10W72/547; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/853; H10W72/865; H10W72/90; H10W72/931; H10W72/932; H10W72/941; H10W72/944; H10W72/9445; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
118 words
A single inline memory module comprising: a substrate having first and second surfaces, said substrate having a plurality of openings extending between said first and second surfaces; a plurality of chips electrically connected to said substrate, each of said chips adhered to said substrate proximate one of said openings; and wherein a first portion of said plurality of chips is adhered to said first surface of said substrate and electrically connected to said second surface of said substrate through said openings in said substrate, and a second portion of said plurality of chips is adhered to said second surface of said substrate and electrically connected to said first surface of said substrate through said openings in said substrate.
Claim 2
Dependent Claim
118 words
A single inline memory module comprising: a substrate having first and second surfaces, said substrate having a plurality of openings extending between said first and second surfaces; a plurality of chips electrically connected to said substrate, each of said chips adhered to said substrate proximate one of said openings; and wherein a first portion of said plurality of chips is adhered to said first surface of said substrate and electrically connected to said second surface of said substrate through said openings in said substrate, and a second portion of said plurality of chips is adhered to said second surface of said substrate and electrically connected to said first surface of said substrate through said openings in said substrate.
Claim 3
Dependent Claim
23 words
The single inline memory module as recited in claim 1 further comprising a plurality of tabs disposed on said first and second surfaces.
Claim 4
Dependent Claim
38 words
The single inline memory module as recited in claim 2 further including a plurality of pads disposed on said first and second surfaces, at least one of said pads electrically connected to at least one of said tabs.
Claim 5
Dependent Claim
21 words
The single inline memory module as recited in claim 3 wherein said chips each further include at least one bonding pad.
Claim 6
Dependent Claim
30 words
The single inline memory module as recited in claim 4 further including wire bonding electrically connecting at least one of said bonding pads to at least one of said pads.
Claim 7
Dependent Claim
22 words
The single inline memory module as recited in claim 5 further including potting material encapsulating said wire bonding and filling said openings.
Claim 8
Dependent Claim
17 words
The single inline memory module as recited in claim 1 further including potting material encapsulating said chips.
Claim 9
Dependent Claim
29 words
The single inline memory module as recited in claim wherein said substrate further includes a plurality of cavities and wherein said chips are adhered to said substrate said cavities.
Claim 10
Dependent Claim
20 words
The single inline memory module as recited in claim 8 further including potting material encapsulating said chips thin said cavities.
Claim 11
Dependent Claim
188 words
A single inline memory module comprising: a substrate having first and second surfaces, said substrate having a plurality of openings extending between said first and second surfaces; a plurality of tabs disposed on said first and second surfaces; a plurality of pads disposed on said first and second surfaces, at least one of said pads electrically connected to at least one of said tabs; a plurality of chips each having an operative side adhered to said substrate, each of said chips having at least one bonding pad on said operative side; wire bonding electrically connecting at least one of said bonding pads to at least one of said pads; potting material encapsulating said wire bonding and filling said openings; and wherein a first portion of said plurality of chips is adhered to said first surface of said substrate and electrically connected to said second surface of said substrate through said openings in said substrate, and a second portion of said plurality of chips is adhered to said second surface of said substrate and electrically connected to said first surface of said substrate through said openings in said substrate.
Claim 12
Dependent Claim
188 words
A single inline memory module comprising: a substrate having first and second surfaces, said substrate having a plurality of openings extending between said first and second surfaces; a plurality of tabs disposed on said first and second surfaces; a plurality of pads disposed on said first and second surfaces, at least one of said pads electrically connected to at least one of said tabs; a plurality of chips each having an operative side adhered to said substrate, each of said chips having at least one bonding pad on said operative side; wire bonding electrically connecting at least one of said bonding pads to at least one of said pads; potting material encapsulating said wire bonding and filling said openings; and wherein a first portion of said plurality of chips is adhered to said first surface of said substrate and electrically connected to said second surface of said substrate through said openings in said substrate, and a second portion of said plurality of chips is adhered to said second surface of said substrate and electrically connected to said first surface of said substrate through said openings in said substrate.
Claim 13
Dependent Claim
29 words
The single inline memory module as recited in claim 10 wherein all of said bonding pads on said operative side of said chips are facing in the same direction.
Claim 14
Dependent Claim
47 words
The single inline memory module as recited in claim 11 wherein said bonding pads on said operative side of said chips adhered to said first surface are facing in opposing direction from said bonding pads on said operative side of said chips adhered to said second surface.
Claim 15
Dependent Claim
17 words
The single inline memory module as recited in claim 10 further including potting material encapsulating said chips.
Claim 16
Dependent Claim
24 words
The single inline memory module as recited in claim 10 further including potting material sealing around the perimeter of said chips along said substrate.
Claim 17
Dependent Claim
31 words
The single inline memory module as recited in claim 10 wherein said substrate further includes a plurality of cavities and wherein said chips are adhered to said substrate in said cavities.
Claim 18
Dependent Claim
20 words
The single inline memory module as recited in claim 15 further including potting material encapsulating said chips within said cavities.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-12-06 | 2003-06-07 | 2003-12-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-12-06 | 2007-06-07 | 2007-12-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-12-06 | 2011-06-07 | 2011-12-07 | $7700.00 | Window Closed / Lapsed |