US4574331A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multi-element circuit construction
Assignee: Northrop Grumman Corp
•
Filing: 1983-05-31
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Granted: 1986-03-04
•
Expires: 2003-05-31
Abstract
Abstract A packaging construction for electronic circuit package elements, such as printed circuit boards and integrated-circuit chip packages, to obviate the need for connector cables, back-panel wiring and similar techniques. Circuit packaging elements are interconnected through an interconnection medium that includes an insulated board with opening through it, and a number of connector elements in the form of compressible wads of conductive wire. The connector elements are disposed in selected openings in the insulated board and compressed into contact with contact areas formed on the circuit package elements. Shorter lead lengths and improved circuit operating speed are the principal results of the approach. In a three-dimensional construction employing the principles of the invention, chip packages are arranged in modules, and interconnections may be made between chip packages within each module, transversely between modules, and in a third direction between layers of modules. The construction provides direct interconnections without the use of solder, connector cables or multilayer circuit boards, and makes most effective use of high-speed integrated circuitry.
Inventors
- 👤 Robert Smolley
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 17:27
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/144; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W90/00; H10W90/401; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10378
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
224 words
A three-dimensional integrated-circuit packaging construction, comprising: a plurality of integrated-circuit (IC) chip packages arrayed in parallel relationship with each other, each of said IC chip packages having input/output contact areas located on various faces of the package, and having edge contact areas; chip package interconnection means disposed between each adjacent pair of said IC chip packages, to establish desired electrical connections between the two, said IC chip packages and said chip package interconnection means together forming a first IC chip module; at least one additional IC chip module of similar construction to said first IC chip module; transverse chip module interconnection means disposed between said first and additional IC chip modules, and between any other adjacent pairs of IC chip modules, to establish selected connections between side edge contact areas of two modules, said transversely interconnected IC chip modules forming a first IC chip module layer; at least one additional IC chip module layer of similar construction to said first IC chip module layer; and chip module layer interconnection means disposed between said first and additional IC chip module layers, and between any other adjacent pairs of IC chip module layers, to establish selected connections between said IC chip module layers; whereby interconnections between IC chip packages may be made in any of three dimensions, and current path lengths within the interconnections are minimized.
Claim 2
Dependent Claim
224 words
A three-dimensional integrated-circuit packaging construction, comprising: a plurality of integrated-circuit (IC) chip packages arrayed in parallel relationship with each other, each of said IC chip packages having input/output contact areas located on various faces of the package, and having edge contact areas; chip package interconnection means disposed between each adjacent pair of said IC chip packages, to establish desired electrical connections between the two, said IC chip packages and said chip package interconnection means together forming a first IC chip module; at least one additional IC chip module of similar construction to said first IC chip module; transverse chip module interconnection means disposed between said first and additional IC chip modules, and between any other adjacent pairs of IC chip modules, to establish selected connections between side edge contact areas of two modules, said transversely interconnected IC chip modules forming a first IC chip module layer; at least one additional IC chip module layer of similar construction to said first IC chip module layer; and chip module layer interconnection means disposed between said first and additional IC chip module layers, and between any other adjacent pairs of IC chip module layers, to establish selected connections between said IC chip module layers; whereby interconnections between IC chip packages may be made in any of three dimensions, and current path lengths within the interconnections are minimized.
Claim 3
Dependent Claim
87 words
A packaging construction as set forth in claim 1, wherein said chip package interconnection means, said transverse chip module interconnection means and said chip module layer interconnection means each include: a plurality of insulated boards with openings therethrough; a plurality of connector elements disposed in selected ones of said openings to make electrical contact with contact pads on said IC chip packages; and means for applying compressive force normal to the faces of said insulated boards, to force said connector elements into contact with said contact pads.
Claim 4
Dependent Claim
39 words
A packaging construction as set forth in claim 2, wherein: each of said connector elements is a wadded strand of conductive wire that is deformed when compressed between contact areas and makes multiple electrical contacts between said contact areas.
Claim 5
Dependent Claim
79 words
A packaging construction as set forth in claim 2, wherein said chip package interconnection means, said transverse chip module interconnection means and said chip module layer interconnection means each further include: at least one two-sided circuit board located between two of said insulated boards, whereby said two-sided circuit board establishes connections between contact areas on any face of the board with contact areas in different locations on the same face or on another face or edge of the board.
Claim 6
Dependent Claim
39 words
A packaging construction as set forth in claim 4, wherein: each of said connector elements is a wadded strand of conductive wire that is deformed when compressed between contact areas and makes multiple electrical contacts between said contact areas.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-03-03 | 1989-09-02 | 1990-03-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-03-03 | 1993-09-02 | 1994-03-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-03-03 | 1997-09-02 | 1998-03-04 | $7700.00 | Window Closed / Lapsed |