US3569607A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Resolderable connector
Assignee: International Business Machines Corp
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Filing: 1969-08-01
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Granted: 1971-03-09
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Expires: 1989-08-01
Abstract
Abstract This patent discloses a resolderable connector particularly adapted for interconnecting multilayer modules with circuit boards and the like, but not limited thereto, the multilayer modules including a monolithic ceramic body with interconnected electrical conductors bonded to the ceramic. The modules include conductive terminations on at least one of the external surfaces of the ceramic body. Connected to these external conductive terminations are cuplike receptacles having a good solder wettable interior and a poor solder wettable exterior, the cuplike receptacles being connected to the conductive terminations as by brazing, but at any rate by a means having a higher melting temperature than conventional lead-tin solder so that bringing the receptacles to a temperature to heat the solder so that they may receive pins from projecting circuit boards does not cause release of the receptacles from the ceramic body.
Inventors
- 👤 John E Martyak
- 👤 Morton D Reeber
- 👤 Charles Wurms
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 19:15
CPC Classifications
H; H01; H01R; H01R12/00; H01R12/50; H01R12/51; H01R12/55; H01R12/57; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K3/40; H05K3/4007; H05K3/4015; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09481; H05K2201/10; H05K2201/10227; H05K2201/1031; H05K2201/10613; H05K2201/10621; H05K2201/10704; H05K2201/20; H05K2201/2081; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
73 words
A device comprising a resolderable connector attached to a conductive termination on an external surface of a body, said connector comprising a cup-shaped receptacle having a refractory, solderable interior having a limited reactivity with solder and a poor solder wettable exterior, and means connecting said cup to said conductive termination, said means having a melting temperature in excess of the melting temperature of the solder composition intended for use interiorally of said receptacle.
Claim 2
Independent Claim
73 words
A device comprising a resolderable connector attached to a conductive termination on an external surface of a body, said connector comprising a cup-shaped receptacle having a refractory, solderable interior having a limited reactivity with solder and a poor solder wettable exterior, and means connecting said cup to said conductive termination, said means having a melting temperature in excess of the melting temperature of the solder composition intended for use interiorally of said receptacle.
Claim 3
Independent Claim
74 words
A device comprising a resolderable connector connected to a conductive termination on an external surface of a substrate, said connector comprising a cup-shaped receptacle composed of at least two materials, the first of said materials being on the interior of said receptacle, said first material exhibiting solder wettable characteristics while being free of appreciable dissolution in solder and said second material exhibiting poor solder wettable characteristics; and means connecting said receptacle to said substrate.
Claim 4
Independent Claim
74 words
A device comprising a resolderable connector connected to a conductive termination on an external surface of a substrate, said connector comprising a cup-shaped receptacle composed of at least two materials, the first of said materials being on the interior of said receptacle, said first material exhibiting solder wettable characteristics while being free of appreciable dissolution in solder and said second material exhibiting poor solder wettable characteristics; and means connecting said receptacle to said substrate.
Claim 5
Dependent Claim
53 words
A device in accordance with claim 2 including solder in said receptacle and wherein said means connecting said receptacle tO said substrate has a melting temperature in excess of that of the solder in said receptacle; said receptacle being connected to said termination with its'' open portion facing away from said external surface.
Claim 6
Dependent Claim
15 words
A device in accordance with claim 3 wherein said solder is of a lead-tin composition.
Claim 7
Dependent Claim
13 words
A device in accordance with claim 2 wherein said first material is nickel.
Claim 8
Dependent Claim
28 words
A device in accordance with claim 2 wherein said second material comprises an alloy of nickel, cobalt and iron treated to render the surface thereof poorly solder wettable.
Claim 9
Dependent Claim
34 words
A device in accordance with claim 2 wherein said first material is nickel and said second material comprises an alloy of nickel, cobalt and iron treated to render the surface thereof poorly solder wettable.
Claim 10
Dependent Claim
49 words
A device in accordance with claim 2 including solder in said receptacle a pin disposed in said receptacle and soldered thereto, said pin having at least the portion thereof in said receptacle composed of a refractory solderable material exhibiting solder wettable characteristics while having a limited reactivity with solder.
Claim 11
Dependent Claim
23 words
A device in accordance with claim 8 wherein at least said portion of said pin disposed in said receptacle is composed of nickel.
Claim 12
Dependent Claim
100 words
In an electronic circuit comprising a monolithic ceramic body and interconnected electrical conductors bonded to said ceramic, portions of said conductors being disposed in different layers; conductive terminations from a plurality of said conductors disposed on an external surface of said ceramic body, and an improved reusable solder connector; said improved connector comprising: a cup-shaped receptacle having a refractory solderable interior and a poor solderable wettable exterior, and means connecting a plurality of said receptacles respectively to a plurality of said conductive terminations; said receptacles being connected to said terminations with their open portions facing away from said external surface.
Claim 13
Dependent Claim
100 words
In an electronic circuit comprising a monolithic ceramic body and interconnected electrical conductors bonded to said ceramic, portions of said conductors being disposed in different layers; conductive terminations from a plurality of said conductors disposed on an external surface of said ceramic body, and an improved reusable solder connector; said improved connector comprising: a cup-shaped receptacle having a refractory solderable interior and a poor solderable wettable exterior, and means connecting a plurality of said receptacles respectively to a plurality of said conductive terminations; said receptacles being connected to said terminations with their open portions facing away from said external surface.
Claim 14
Dependent Claim
49 words
In an electronic circuit in accordance with claim 10 including solder in said receptacles, and wherein said means connecting a plurality of said receptacles to a plurality of said conductive terminations has a melting temperature in excess of that of the solder intended for use interiorly of said receptacles.
Claim 15
Dependent Claim
92 words
A circuit module comprising a monolithic circuit structure and interconnected electrical conductors, conductive terminations from a plurality of said conductors disposed on an external surface of said monolithic circuit structure, and resolderable solder connectors attached to at least one of said terminations; each of said connectors comprising a cup-shaped receptacle having a metal interior with limited reactivity with solder and being solder wettable, and an exterior composed of a different material and being poorly wettable by solder, and means connecting a plurality of said receptacles respectively to a plurality of said terminations.
Claim 16
Dependent Claim
92 words
A circuit module comprising a monolithic circuit structure and interconnected electrical conductors, conductive terminations from a plurality of said conductors disposed on an external surface of said monolithic circuit structure, and resolderable solder connectors attached to at least one of said terminations; each of said connectors comprising a cup-shaped receptacle having a metal interior with limited reactivity with solder and being solder wettable, and an exterior composed of a different material and being poorly wettable by solder, and means connecting a plurality of said receptacles respectively to a plurality of said terminations.
Claim 17
Dependent Claim
23 words
A circuit module in accordance with claim 12 wherein said module is comprised of a plurality of layers forming a monolithic ceramic body.
Claim 18
Dependent Claim
18 words
A circuit module in accordance with claim 12 wherein said cup-shaped receptacles are composed of a laminate material.
Claim 19
Dependent Claim
30 words
A circuit module in accordance with claim 12 including solder in at least some of said receptacles and means in said module for heating said receptacles to melt said solder.
Claim 20
Dependent Claim
66 words
A circuit module in accordance with claim 12 including solder in at least some of said receptacles and including an adjacent substrate having a plurality of spaced conductive projections extending from one surface thereof, said spacing between said projections being substantially the same as the spacing between said receptacles, said projections being solder wettable and connected to said metal interior of said receptacles by said solder.
Claim 21
Dependent Claim
18 words
A circuit module in accordance with claim 16 wherein said projections have at least a refractory solderable portion.
Claim 22
Dependent Claim
28 words
A circuit module in accordance with claim 17 wherein said projectionS comprise pins having at least a portion thereof adjacent said substrate composed of a nonsolder wettable material.
Claim 23
Dependent Claim
20 words
A circuit module in accordance with claim 12 wherein said metal interior having a limited reactivity with solder is nickel.
Claim 24
Dependent Claim
32 words
A circuit module in accordance with claim 12 wherein said exterior metal of said receptacles comprises an alloy of nickel, cobalt and iron treated to render the surface thereof poorly solder wettable.
References Cited (Backward Citations)
US3214827A
Cited
US3205298A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-03-08 | 1974-09-07 | 1975-03-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-03-08 | 1978-09-07 | 1979-03-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-03-08 | 1982-09-07 | 1983-03-09 | $7700.00 | Window Closed / Lapsed |