US5726079A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thermally enhanced flip chip package and method of forming
Assignee: GlobalFoundries Inc
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Filing: 1996-09-17
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Granted: 1998-03-10
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Expires: 2016-09-17
Abstract
Abstract A thermally conductive planar member is in thermally conductive communication with a flip chip encapsulated within a dielectric material that surrounds portions of the thermally conductive planar member, the flip-chip, and a predefined portion of a substrate member. The present invention provides a flip chip package having pick-and-place capability without the thermal resistance disadvantage of capped chip packages.
Inventors
- 👤 Eric Arthur Johnson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 21:15
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/20; H10W72/851; H10W72/874; H10W72/877; H10W74/15; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734; H10W90/736
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
220 words
A method of forming a flip chip package, comprising: providing a substrate member having a plurality of electrical contacts disposed thereon; providing a flip chip having a plurality of electrical contacts disposed on a lower surface, a planar upper surface, and a plurality of edge surfaces extending between said lower and said upper surfaces; connecting the electrical contacts of said flip chip with selected ones of the electrical contacts on said substrate; providing a thermally conductive planar member having a plurality of peripherally disposed edge surfaces; placing said thermally conductive planar member in thermally conductive communication with said upper surface of the flip chip; placing said thermally conductive planar member, said flip chip, and said substrate member in a mold cavity wherein a predefined portion of said substrate member cooperates with said mold cavity to define a sealable cavity; injecting a moldable dielectric material into said sealable cavity; curing said moldable dielectric material and thereby forming a sealed rigid dielectric covering about the edge surfaces of said thermally conductive planar member, the edge surfaces of said flip chip, and said predefined portion of said substrate member and forming an encapsulated flip chip package comprising said thermally conductive planar member, said flip chip, and said predefined portion of said substrate member; and removing said flip chip package from said sealed covering.
Claim 2
Independent Claim
220 words
A method of forming a flip chip package, comprising: providing a substrate member having a plurality of electrical contacts disposed thereon; providing a flip chip having a plurality of electrical contacts disposed on a lower surface, a planar upper surface, and a plurality of edge surfaces extending between said lower and said upper surfaces; connecting the electrical contacts of said flip chip with selected ones of the electrical contacts on said substrate; providing a thermally conductive planar member having a plurality of peripherally disposed edge surfaces; placing said thermally conductive planar member in thermally conductive communication with said upper surface of the flip chip; placing said thermally conductive planar member, said flip chip, and said substrate member in a mold cavity wherein a predefined portion of said substrate member cooperates with said mold cavity to define a sealable cavity; injecting a moldable dielectric material into said sealable cavity; curing said moldable dielectric material and thereby forming a sealed rigid dielectric covering about the edge surfaces of said thermally conductive planar member, the edge surfaces of said flip chip, and said predefined portion of said substrate member and forming an encapsulated flip chip package comprising said thermally conductive planar member, said flip chip, and said predefined portion of said substrate member; and removing said flip chip package from said sealed covering.
Claim 3
Dependent Claim
74 words
A method of forming a flip chip package, as set forth in claim 1, wherein said mold cavity has a first selected height and said thermally conductive planar member has a thickness selected so that when mounted on the upper planar surface of the flip chip, said planar member extends a second selected height above said substrate member, said second selected height being substantially equal to the first selected height of said mold cavity.
Claim 4
Dependent Claim
48 words
A method of forming a flip chip package, as set forth in claim 1, wherein placing said thermally conductive planar member on said upper surface of the flip chip includes bonding said planar member to the upper surface of the flip chip with a thermally conductive adhesive material.
References Cited (Backward Citations)
US5289346A
Cited
US5359768A
Cited
US5405809A
Cited
US5490324A
Cited
US5410451A
Cited
US5471027A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-03-09 | 2001-09-08 | 2002-03-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-03-09 | 2005-09-08 | 2006-03-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-03-09 | 2009-09-08 | 2010-03-10 | $7700.00 | Window Closed / Lapsed |