Patent US6885101B2 successfully refreshed from Google Patents.
US6885101B2
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US
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Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
Assignee: Micron Technology Inc
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Filing: 2002-08-29
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Granted: 2005-04-26
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Expires: 2022-08-29
Abstract
Abstract Methods for packaging microelectronic devices, microelectronic workpieces having packaged dies, and microelectronic devices. One aspect of the invention is directed toward a microelectronic workpiece comprising a substrate having a device side and a backside. In one embodiment, the microelectronic workpiece further includes a plurality of dies formed on the device side of the substrate, a dielectric layer over the dies, and a plurality of bond-pads on the dielectric layer. The dies have integrated circuitry and a plurality of bond-pads electrically coupled to the integrated circuitry. The ball-pads are arranged in ball-pad arrays over corresponding dies on the substrate. The ball-pads of one array, for example, are electrically coupled to the bond-pads of the corresponding die. The microelectronic workpiece of this embodiment further includes a protective film over the dielectric layer. In one embodiment, the workpiece further includes solder balls attached to corresponding ball-pads, and the protective film covers the dielectric layer in between the solder balls. The solder balls in this embodiment also have exposed contact sites such that the protective film can cover side portions of the solder balls but not a top surface of the solder balls.
Inventors
- 👤 Farrah J. Storli
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 05:08
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/129; H10W20/00; H10W20/40; H10W20/49; H10W72/00; H10W72/01; H10W72/012; H10W72/0198; H10W72/20; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W70/654; H10W70/655; H10W72/013; H10W72/01331; H10W72/251; H10W72/90; H10W72/921; H10W72/922; H10W72/9223; H10W72/923; H10W72/941; H10W72/9415; H10W72/942; H10W72/944; H10W72/9445; H10W72/951; H10W72/952
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
138 words
A microelectronic workpiece for manufacturing a plurality of microelectronic devices, comprising: a substrate; a plurality of dies formed on the substrate, the dies having integrated circuitry and a plurality of bond-pads electrically coupled to the integrated circuitry; a redistribution layer having a first dielectric layer over the dies, a second dielectric layer over the first dielectric layer, ball-pads arranged in ball-pad arrays corresponding to the dies, and traces coupling the bond-pads of a die to the ball-pads of a corresponding ball-pad array; solder balls on the ball-pads, wherein the solder balls project from the ball-pads by a ball height; and a protective coating over the second dielectric layer and between the solder balls, the protective coating being a preformed film having a thickness less than the ball height and an outer surface formed by a removable backing member.
Claim 2
Dependent Claim
138 words
A microelectronic workpiece for manufacturing a plurality of microelectronic devices, comprising: a substrate; a plurality of dies formed on the substrate, the dies having integrated circuitry and a plurality of bond-pads electrically coupled to the integrated circuitry; a redistribution layer having a first dielectric layer over the dies, a second dielectric layer over the first dielectric layer, ball-pads arranged in ball-pad arrays corresponding to the dies, and traces coupling the bond-pads of a die to the ball-pads of a corresponding ball-pad array; solder balls on the ball-pads, wherein the solder balls project from the ball-pads by a ball height; and a protective coating over the second dielectric layer and between the solder balls, the protective coating being a preformed film having a thickness less than the ball height and an outer surface formed by a removable backing member.
Claim 3
Dependent Claim
24 words
The device of claim 1 wherein the protective coating comprises a material that is deformable at a temperature of 60° F. to 100° F.
Claim 4
Dependent Claim
38 words
The device of claim 1 wherein the protective coating comprises a material that is deformable at a temperature of approximately 60° C. to 90° C., and curable to a non-deformable state at approximately 140° C. to 180° C.
Claim 5
Dependent Claim
12 words
The device of claim 1 wherein the protective coating comprises an epoxy.
Claim 6
Dependent Claim
41 words
The device of claim 1 wherein the solder balls have a diameter and the protective coating has a thickness approximately 10% to 95% of the solder ball diameter such that a portion of the solder balls projects beyond the protective coating.
Claim 7
Dependent Claim
25 words
The device of claim 1 wherein the protective coating has a plurality of openings over the ball-pads and the solder-balls are positioned in the openings.
Claim 8
Dependent Claim
13 words
The device of claim 1 wherein the integrated circuitry comprises a memory circuit.
Claim 9
Dependent Claim
132 words
A semiconductor workpiece for fabricating a plurality of semiconductor devices, comprising: a wafer having a substrate composed of a semiconductor material; a plurality of dies having integrated circuitry in the substrate and a plurality of bond-pads electrically coupled to the integrated circuitry; a redistribution layer having a first dielectric layer over the dies, a second dielectric layer over the first dielectric layer, ball-pads arranged in ball-pad arrays corresponding to the dies, and traces coupling the bond-pads of a die to the ball-pads of a corresponding ball-pad array; solder balls on the ball-pads; and a cover on the second dielectric layer and between the solder balls, wherein the solder balls have contact sites exposed through the cover, the cover being a preformed film pressed onto the second dielectric layer from a backing member.
Claim 10
Dependent Claim
132 words
A semiconductor workpiece for fabricating a plurality of semiconductor devices, comprising: a wafer having a substrate composed of a semiconductor material; a plurality of dies having integrated circuitry in the substrate and a plurality of bond-pads electrically coupled to the integrated circuitry; a redistribution layer having a first dielectric layer over the dies, a second dielectric layer over the first dielectric layer, ball-pads arranged in ball-pad arrays corresponding to the dies, and traces coupling the bond-pads of a die to the ball-pads of a corresponding ball-pad array; solder balls on the ball-pads; and a cover on the second dielectric layer and between the solder balls, wherein the solder balls have contact sites exposed through the cover, the cover being a preformed film pressed onto the second dielectric layer from a backing member.
Claim 11
Dependent Claim
23 words
The device of claim 8 wherein the cover comprises a material that is deformable at a temperature of 60° F. to 100° F.
Claim 12
Dependent Claim
37 words
The device of claim 8 wherein the cover comprises a material that is deformable at a temperature of approximately 60° C. to 90° C., and curable to a non-deformable state at approximately 140° C. to 180° C.
Claim 13
Dependent Claim
11 words
The device of claim 8 wherein the cover comprises an epoxy.
Claim 14
Dependent Claim
40 words
The device of claim 8 wherein the solder balls have a diameter and the cover has a thickness approximately 10% to 95% of the solder ball diameter such that a portion of the solder balls projects beyond the protective coating.
Claim 15
Dependent Claim
24 words
The device of claim 8 wherein the cover has a plurality of openings over the ball-pads and the solder-balls are positioned in the openings.
Claim 16
Dependent Claim
13 words
The device of claim 8 wherein the integrated circuitry comprises a memory circuit.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 2008-04-25 | 2008-10-25 | 2009-04-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2012-04-25 | 2012-10-25 | 2013-04-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2016-04-25 | 2016-10-25 | 2017-04-26 | $7700.00 | Window Closed / Lapsed |