US6611052B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wafer level stackable semiconductor package
Assignee: Round Rock Research LLC
•
Filing: 2001-11-16
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Granted: 2003-08-26
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Expires: 2021-11-16
Abstract
Abstract A stackable semiconductor package includes a semiconductor die, and has a chip sized peripheral outline matching that of the die. In addition to the die, the package includes stacking pads and stacking contacts on opposing sides of the die, and conductive grooves on the edges of the die in electrical communication with the stacking pads and the stacking contacts. The conductive grooves function as interlevel conductors for the package and can also function as edge contacts for the package. The configuration of the stacking pads, of the stacking contacts and of the conductive grooves permit multiple packages to be stacked and electrically interconnected to form stacked assemblies. A method for fabricating the package is if performed at the wafer level on a substrate, such as a semiconductor wafer, containing multiple dice. In addition, multiple substrates can be stacked, bonded and singulated to form stacked assemblies that include multiple stacked packages.
Inventors
- 👤 Chia Yong Poo
- 👤 Boon Suan Jeung
- 👤 Low Siu Waf
- 👤 Chan Min Yu
- 👤 Neo Yong Loo
- 👤 Chua Swee Kwang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:07
CPC Classifications
H; H10; H10W; H10W90/00; H10W20/00; H10W20/20; H10W70/00; H10W70/60; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/834; H10W72/90; H10W72/921; H10W72/922; H10W72/9223; H10W72/923; H10W72/941; H10W72/9415; H10W72/942; H10W90/20; H10W90/291; H10W90/297; H10W90/701; H10W90/721; H10W90/722
Claims Analysis
Total Claims: 47
Claim 1
Independent Claim
139 words
A semiconductor package comprising: a semiconductor die comprising a plurality of integrated circuits and having a first side, an opposing second side, and a peripheral edge; a plurality of first pads on the first side in electrical communication with the integrated circuits; a plurality of conductive grooves in the peripheral edge in electrical communication with the first pads; a plurality of second pads on the second side in electrical communication with the conductive grooves; and a plurality of first conductors on the first side in electrical communication with the first pads and the conductive grooves and a plurality of second conductors on the second side in electrical communication with the second pads and the conductive grooves; the first pads and the second pads having matching patterns and configured for bonding to a second package substantially identical to the package.
Claim 2
Dependent Claim
139 words
A semiconductor package comprising: a semiconductor die comprising a plurality of integrated circuits and having a first side, an opposing second side, and a peripheral edge; a plurality of first pads on the first side in electrical communication with the integrated circuits; a plurality of conductive grooves in the peripheral edge in electrical communication with the first pads; a plurality of second pads on the second side in electrical communication with the conductive grooves; and a plurality of first conductors on the first side in electrical communication with the first pads and the conductive grooves and a plurality of second conductors on the second side in electrical communication with the second pads and the conductive grooves; the first pads and the second pads having matching patterns and configured for bonding to a second package substantially identical to the package.
Claim 3
Dependent Claim
14 words
The package of claim 1 further comprising bumps or balls on the first pads.
Claim 4
Dependent Claim
14 words
The package of claim 1 further comprising bumps or balls on the second pads.
Claim 5
Dependent Claim
21 words
The package of claim 1 wherein the conductive grooves comprise arcuate or semicircular openings and a conductive material in the openings.
Claim 6
Dependent Claim
21 words
The package of claim 1 further comprising a plurality of collinear pairs of conductive grooves on opposing edges of the die.
Claim 7
Dependent Claim
132 words
A semiconductor package comprising: a semiconductor die comprising a plurality of integrated circuits and having a circuit side, a back side, and opposing peripheral edges; a plurality of circuit side conductors on the circuit side in electrical communication with the integrated circuits, and circuit side stacking pads on the circuit side in electrical communication with the circuit side conductors; a plurality of collinear pairs of conductive grooves in the opposing peripheral edges in electrical communication with the circuit side conductors; a plurality of back side conductors on the back side in electrical communication with the conductive grooves, and back side stacking pads on the back side in electrical communication with the back side conductors; and a plurality of contacts on the circuit side stacking pads or on the back side stacking pads.
Claim 8
Dependent Claim
132 words
A semiconductor package comprising: a semiconductor die comprising a plurality of integrated circuits and having a circuit side, a back side, and opposing peripheral edges; a plurality of circuit side conductors on the circuit side in electrical communication with the integrated circuits, and circuit side stacking pads on the circuit side in electrical communication with the circuit side conductors; a plurality of collinear pairs of conductive grooves in the opposing peripheral edges in electrical communication with the circuit side conductors; a plurality of back side conductors on the back side in electrical communication with the conductive grooves, and back side stacking pads on the back side in electrical communication with the back side conductors; and a plurality of contacts on the circuit side stacking pads or on the back side stacking pads.
Claim 9
Dependent Claim
33 words
The package of claim 6 wherein the contacts are on the circuit side stacking pads and comprise ball or bumps configured for bonding to a second semiconductor package substantially identical to the package.
Claim 10
Dependent Claim
26 words
The package of claim 6 further comprising a plurality of external contacts on the back side stacking pads in electrical communication with the back side conductors.
Claim 11
Dependent Claim
21 words
The package of claim 6 wherein the conductive grooves comprise arcuate or semicircular openings at least partially covered with conductive layers.
Claim 12
Dependent Claim
21 words
The package of claim 6 wherein the contacts comprise external contacts configured to electrically connect the package to a supporting substrate.
Claim 13
Dependent Claim
150 words
A semiconductor package comprising: a semiconductor die comprising a plurality of integrated circuits and having a circuit side, a back side and a peripheral edge; a plurality of stacking contacts on the circuit side in a selected pattern in electrical communication with the integrated circuits; a plurality of stacking pads on the back side in the selected pattern in electrical communication with the stacking contacts; a plurality of conductive grooves in the peripheral edge configured as interlevel conductors between the stacking contacts and the stacking pads; and a plurality of circuit side conductors on the circuit side in electrical communication with the stacking contacts and the conductive grooves and a plurality of back side conductors on the back side in electrical communication with the stacking pads and the conductive grooves; the stacking contacts configured for bonding to a second package, the stacking pads configured for bonding to a third package.
Claim 14
Dependent Claim
150 words
A semiconductor package comprising: a semiconductor die comprising a plurality of integrated circuits and having a circuit side, a back side and a peripheral edge; a plurality of stacking contacts on the circuit side in a selected pattern in electrical communication with the integrated circuits; a plurality of stacking pads on the back side in the selected pattern in electrical communication with the stacking contacts; a plurality of conductive grooves in the peripheral edge configured as interlevel conductors between the stacking contacts and the stacking pads; and a plurality of circuit side conductors on the circuit side in electrical communication with the stacking contacts and the conductive grooves and a plurality of back side conductors on the back side in electrical communication with the stacking pads and the conductive grooves; the stacking contacts configured for bonding to a second package, the stacking pads configured for bonding to a third package.
Claim 15
Dependent Claim
15 words
The package of claim 11 wherein each stacking contact comprises a bump or a ball.
Claim 16
Dependent Claim
14 words
The package of claim 11 wherein each stacking contact comprises a non-oxidizing metal layer.
Claim 17
Dependent Claim
23 words
The package of claim 11 further comprising a plurality of external contacts on the back side in electrical communication with the stacking pads.
Claim 18
Dependent Claim
150 words
A semiconductor package comprising: a semiconductor die comprising a plurality of integrated circuits and having a circuit side, a back side and a peripheral edge; a plurality of stacking pads on the circuit side in a selected pattern in electrical communication with the integrated circuits; a plurality of stacking contacts on the back side in the selected pattern in electrical communication with the stacking pads; a plurality of conductive grooves in the peripheral edge configured as interlevel conductors between the stacking pads and the stacking contacts; and a plurality of circuit side conductors on the circuit side in electrical communication with the stacking pads and the conductive grooves and a plurality of back side conductors on the back side in electrical communication with the stacking contacts and the conductive grooves; the stacking pads configured for bonding to a second package, the stacking contacts configured for bonding to a third package.
Claim 19
Dependent Claim
150 words
A semiconductor package comprising: a semiconductor die comprising a plurality of integrated circuits and having a circuit side, a back side and a peripheral edge; a plurality of stacking pads on the circuit side in a selected pattern in electrical communication with the integrated circuits; a plurality of stacking contacts on the back side in the selected pattern in electrical communication with the stacking pads; a plurality of conductive grooves in the peripheral edge configured as interlevel conductors between the stacking pads and the stacking contacts; and a plurality of circuit side conductors on the circuit side in electrical communication with the stacking pads and the conductive grooves and a plurality of back side conductors on the back side in electrical communication with the stacking contacts and the conductive grooves; the stacking pads configured for bonding to a second package, the stacking contacts configured for bonding to a third package.
Claim 20
Dependent Claim
15 words
The package of claim 15 wherein each stacking contact comprises a bump or a ball.
Claim 21
Dependent Claim
15 words
The package of claim 15 wherein each stacking contact comprises a bump or a ball.
Claim 22
Dependent Claim
23 words
The package of claim 15 further comprising a plurality of external contacts on the back side in electrical communication with the stacking contacts.
Claim 23
Dependent Claim
121 words
A semiconductor package comprising: a semiconductor die comprising a plurality of integrated circuits and having a first side, an opposing second side, and opposing peripheral edges; a plurality of first conductors on the first side in electrical communication with the integrated circuits; a plurality of pairs of collinear conductive grooves in the peripheral edges in electrical communication with the first conductors; and a plurality of second conductors on the second side in electrical communication with the conductive grooves; a plurality of stacking contacts on the first side in electrical communication with the first conductors and having a selected pattern; and a plurality of stacking pads on the second side in electrical communication with the second conductors and having the selected pattern.
Claim 24
Dependent Claim
121 words
A semiconductor package comprising: a semiconductor die comprising a plurality of integrated circuits and having a first side, an opposing second side, and opposing peripheral edges; a plurality of first conductors on the first side in electrical communication with the integrated circuits; a plurality of pairs of collinear conductive grooves in the peripheral edges in electrical communication with the first conductors; and a plurality of second conductors on the second side in electrical communication with the conductive grooves; a plurality of stacking contacts on the first side in electrical communication with the first conductors and having a selected pattern; and a plurality of stacking pads on the second side in electrical communication with the second conductors and having the selected pattern.
Claim 25
Dependent Claim
22 words
The package of claim 19 wherein the stacking contacts are configured for bonding to a second package substantially identical to the package.
Claim 26
Dependent Claim
20 words
The package of claim 19 further comprising a plurality of external contacts on the second side on the stacking contacts.
Claim 27
Dependent Claim
15 words
The package of claim 19 wherein the stacking contacts comprise external contacts for the package.
Claim 28
Dependent Claim
122 words
A semiconductor package comprising: a semiconductor die comprising a plurality of integrated circuits and having a circuit side, an opposing back side, and a peripheral edge; a plurality of circuit side conductors on the circuit side in electrical communication with the integrated circuits; a plurality of conductive grooves in the peripheral edge in electrical communication with the circuit side conductors; a plurality of back side conductors on the back side in electrical communication with the conductive grooves; a plurality of stacking pads on the circuit side in electrical communication with the circuit side conductors and having a selected pattern; and a plurality of stacking contacts on the back side in electrical communication with the back side conductors and having the selected pattern.
Claim 29
Dependent Claim
122 words
A semiconductor package comprising: a semiconductor die comprising a plurality of integrated circuits and having a circuit side, an opposing back side, and a peripheral edge; a plurality of circuit side conductors on the circuit side in electrical communication with the integrated circuits; a plurality of conductive grooves in the peripheral edge in electrical communication with the circuit side conductors; a plurality of back side conductors on the back side in electrical communication with the conductive grooves; a plurality of stacking pads on the circuit side in electrical communication with the circuit side conductors and having a selected pattern; and a plurality of stacking contacts on the back side in electrical communication with the back side conductors and having the selected pattern.
Claim 30
Dependent Claim
22 words
The package of claim 23 wherein the stacking contacts are configured for bonding to a second package substantially identical to the package.
Claim 31
Dependent Claim
15 words
The package of claim 23 wherein the stacking contacts comprise external contacts for the package.
Claim 32
Dependent Claim
20 words
The package of claim 23 wherein the conductive grooves are configured as collinear pairs on opposing edges of the die.
Claim 33
Dependent Claim
141 words
A stacked semiconductor assembly comprising: a first semiconductor package comprising a plurality of integrated circuits and having a first side, an opposing second side, and a peripheral edge; a plurality of first pads on the first side in electrical communication with the integrated circuits; a plurality of conductive grooves in the peripheral edge in electrical communication with the first pads; a plurality of second pads on the second side in electrical communication with the conductive grooves; a plurality of first conductors on the first side in electrical communication with the first pads and the conductive grooves and a plurality of second conductors on the second side in electrical communication with the second pads and the conductive grooves; and a second package substantially identical to the package, stacked on the package and bonded to the first pads or to the second pads.
Claim 34
Dependent Claim
141 words
A stacked semiconductor assembly comprising: a first semiconductor package comprising a plurality of integrated circuits and having a first side, an opposing second side, and a peripheral edge; a plurality of first pads on the first side in electrical communication with the integrated circuits; a plurality of conductive grooves in the peripheral edge in electrical communication with the first pads; a plurality of second pads on the second side in electrical communication with the conductive grooves; a plurality of first conductors on the first side in electrical communication with the first pads and the conductive grooves and a plurality of second conductors on the second side in electrical communication with the second pads and the conductive grooves; and a second package substantially identical to the package, stacked on the package and bonded to the first pads or to the second pads.
Claim 35
Dependent Claim
18 words
The assembly of claim 27 further comprising an adhesive polymer layer bonding the package to the second package.
Claim 36
Dependent Claim
19 words
The assembly of claim 27 further comprising an anisotropic conductive adhesive layer bonding the package to the second package.
Claim 37
Dependent Claim
30 words
The assembly of claim 27 further comprising a plurality of external contacts on the second pads and a supporting substrate having a plurality of electrodes bonded to the external contacts.
Claim 38
Dependent Claim
23 words
The assembly of claim 27 further comprising a supporting substrate and an anisotropic conductive adhesive layer bonding the package to the supporting substrate.
Claim 39
Dependent Claim
15 words
The assembly of claim 27 wherein each first pad includes a bump or a ball.
Claim 40
Dependent Claim
15 words
The assembly of claim 27 wherein each second pad includes a bump or a ball.
Claim 41
Dependent Claim
21 words
The assembly of claim 27 wherein the conductive grooves comprise arcuate or semicircular openings and a conductive material in the openings.
Claim 42
Dependent Claim
42 words
The assembly of claim 27 further comprising a plurality of circuit side conductors on the first surface in electrical communication with the first pads and a plurality of back side conductors on the second surface in electrical communication with the second pads.
Claim 43
Dependent Claim
166 words
A stacked semiconductor assembly comprising: a first package and a second package each package comprising: a semiconductor die comprising a plurality of integrated circuits and having a circuit side, a back side and a peripheral edge; a plurality of stacking pads on the first side in a selected pattern in electrical communication with the integrated circuits; a plurality of stacking contacts on the second side in the selected pattern in electrical communication with the stacking pads; a plurality of conductive grooves in the peripheral edge configured as interlevel conductors between the stacking pads and the stacking contacts; and a plurality of circuit side conductors on the circuit side in electrical communication with the stacking pads and the conductive grooves and a plurality of back side conductors on the back side in electrical communication with the stacking contacts and the conductive grooves; the first package stacked to the second package with the stacking contacts on the first package bonded to the stacking pads on the second package.
Claim 44
Dependent Claim
166 words
A stacked semiconductor assembly comprising: a first package and a second package each package comprising: a semiconductor die comprising a plurality of integrated circuits and having a circuit side, a back side and a peripheral edge; a plurality of stacking pads on the first side in a selected pattern in electrical communication with the integrated circuits; a plurality of stacking contacts on the second side in the selected pattern in electrical communication with the stacking pads; a plurality of conductive grooves in the peripheral edge configured as interlevel conductors between the stacking pads and the stacking contacts; and a plurality of circuit side conductors on the circuit side in electrical communication with the stacking pads and the conductive grooves and a plurality of back side conductors on the back side in electrical communication with the stacking contacts and the conductive grooves; the first package stacked to the second package with the stacking contacts on the first package bonded to the stacking pads on the second package.
Claim 45
Dependent Claim
19 words
The assembly of claim 36 further comprising a polymer adhesive layer bonding the first package to the second package.
Claim 46
Dependent Claim
20 words
The assembly of claim 36 further comprising a conductive polymer adhesive layer bonding the first package to the second package.
Claim 47
Dependent Claim
18 words
The assembly of claim 36 wherein the conductive grooves comprise collinear pairs on opposing edges of the die.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-08-25 | 2007-02-24 | 2007-08-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-08-25 | 2011-02-24 | 2011-08-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-08-25 | 2015-02-24 | 2015-08-26 | $7700.00 | Window Closed / Lapsed |