US6281042B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Structure and method for a high performance electronic packaging assembly
Assignee: Micron Technology Inc
•
Filing: 1998-08-31
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Granted: 2001-08-28
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Expires: 2018-08-31
Abstract
Abstract An improved structure and method are provided for increasing the operational bandwidth between different circuit devices, e.g. logic and memory chips, without requiring changes in current CMOS processing techniques. The structure includes the use of a silicon interposer. The silicon interposer can consist of recycled rejected wafers from the front-end semiconductor processing. Micro-machined vias are formed through the silicon interposer. The micro-machined vias include electrical contacts which couple various integrated circuit devices located on the opposing surfaces of the silicon interposer.
Inventors
- 👤 Kie Y. Ahn
- 👤 Leonard Forbes
- 👤 Eugene H. Cloud
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 05:53
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W90/00; H10W72/00; H10W72/071; H10W72/075; H10W72/90; H10W72/951; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 34
Claim 1
Independent Claim
66 words
A method for forming integrated circuits, comprising: providing a silicon interposer having opposing sides; coupling a first semiconductor chip to a first side of the silicon interposer; coupling a second semiconductor chip to a second side of the silicon interposer; and coupling the first semiconductor chip to the second semiconductor chip by forming a number of micro-machined vias to create electrical connections through the silicon interposer.
Claim 2
Independent Claim
66 words
A method for forming integrated circuits, comprising: providing a silicon interposer having opposing sides; coupling a first semiconductor chip to a first side of the silicon interposer; coupling a second semiconductor chip to a second side of the silicon interposer; and coupling the first semiconductor chip to the second semiconductor chip by forming a number of micro-machined vias to create electrical connections through the silicon interposer.
Claim 3
Dependent Claim
24 words
The method of claim 1 , wherein providing the silicon interposer having opposing sides includes providing a silicon interposer formed from recycled silicon wafers.
Claim 4
Dependent Claim
29 words
The method of claim 1 , wherein coupling the first semiconductor chip to the first side of the silicon interposer includes coupling a microprocessor chip to the first side.
Claim 5
Dependent Claim
33 words
The method of claim 1 , wherein coupling the second semiconductor chip to the second side of the silicon interposer includes coupling a memory chip to the second side of the silicon interposer.
Claim 6
Dependent Claim
19 words
The method of claim 1 , further including coupling a capacitor to the second side of the silicon interposer.
Claim 7
Independent Claim
79 words
A method for forming integrated circuits, comprising: providing a silicon interposer having opposing sides; forming a number of micro-machined vias through the silicon interposer, wherein the micro-machined vias include a number of electrical connections between the opposing surfaces of the silicon interposer; coupling a logic chip to the number of micro-machined vias on a first side of the silicon interposer; and coupling a memory chip to the number of micro-machined vias on a second side of the silicon interposer.
Claim 8
Independent Claim
79 words
A method for forming integrated circuits, comprising: providing a silicon interposer having opposing sides; forming a number of micro-machined vias through the silicon interposer, wherein the micro-machined vias include a number of electrical connections between the opposing surfaces of the silicon interposer; coupling a logic chip to the number of micro-machined vias on a first side of the silicon interposer; and coupling a memory chip to the number of micro-machined vias on a second side of the silicon interposer.
Claim 9
Independent Claim
16 words
The method of claims 6 , wherein coupling the memory chip includes coupling a DRAM chip.
Claim 10
Dependent Claim
16 words
The method of claim 6 , wherein coupling the memory chip includes coupling a SRAM chip.
Claim 11
Independent Claim
17 words
The method of claims 6 , wherein coupling the memory chip includes coupling a flash EEPROM chip.
Claim 12
Dependent Claim
25 words
The method of claim 6 , wherein coupling the logic and memory chips to the number of micro-machined vias includes using a ball grid array.
Claim 13
Dependent Claim
20 words
The method of claim 6 , further including cooling the logic chip on the first side of the silicon interposer.
Claim 14
Dependent Claim
29 words
The method of claim 6 , wherein coupling the logic chip to the first side of the silicon interposer includes coupling the logic chip to an integrated circuit package.
Claim 15
Independent Claim
26 words
The method of claims 12 , wherein coupling the logic chip to the integrated circuit package includes bonding the logic chip to the integrated circuit package.
Claim 16
Independent Claim
66 words
A method for forming an electronic packaging assembly, comprising: forming a number of micro-machined vias through a silicon interposer having opposing sides; coupling a first semiconductor chip to a first side of the silicon interposer; coupling a second semiconductor chip to a second side of the silicon interposer; and electrically coupling the first semiconductor chip to the second semiconductor chip using the number of micro-machined vias.
Claim 17
Independent Claim
66 words
A method for forming an electronic packaging assembly, comprising: forming a number of micro-machined vias through a silicon interposer having opposing sides; coupling a first semiconductor chip to a first side of the silicon interposer; coupling a second semiconductor chip to a second side of the silicon interposer; and electrically coupling the first semiconductor chip to the second semiconductor chip using the number of micro-machined vias.
Claim 18
Dependent Claim
27 words
The method of claim 14 , wherein forming the number of micro-machined vias through the silicon interposer includes forming salicided connections in the number of micro-machined vias.
Claim 19
Independent Claim
88 words
A method for forming an electronic system module, comprising: forming a number of micro-machined vias through a silicon interposer having opposing sides; coupling at least one semiconductor chip to a first side of the silicon interposer; coupling at least one semiconductor chip to a second side of the silicon interposer; and electrically coupling the at least one semiconductor chip on the first side of the silicon interposer to the at least one semiconductor chip on the second side of the silicon interposer using the number of micro-machined vias.
Claim 20
Independent Claim
88 words
A method for forming an electronic system module, comprising: forming a number of micro-machined vias through a silicon interposer having opposing sides; coupling at least one semiconductor chip to a first side of the silicon interposer; coupling at least one semiconductor chip to a second side of the silicon interposer; and electrically coupling the at least one semiconductor chip on the first side of the silicon interposer to the at least one semiconductor chip on the second side of the silicon interposer using the number of micro-machined vias.
Claim 21
Dependent Claim
36 words
The method of claim 16 , wherein forming a number of micro-machined vias through a silicon interposer having opposing sides includes forming the number of micro-machined vias through a silicon interposer formed from recycled silicon wafers.
Claim 22
Dependent Claim
30 words
The method of claim 16 , wherein coupling at least one semiconductor chip to a first side of the silicon interposer includes coupling a microprocessor chip to the first side.
Claim 23
Dependent Claim
34 words
The method of claim 16 , wherein coupling at least one semiconductor chip to a second side of the silicon interposer includes coupling a memory chip to the second side of the silicon interposer.
Claim 24
Dependent Claim
22 words
The method of claim 16 , wherein the method further includes coupling a capacitor to the second side of the silicon interposer.
Claim 25
Independent Claim
109 words
A method for forming an electronic system module, comprising: forming a number of micro-machined vias through a silicon interposer having opposing sides, wherein the number of micro-machined vias includes a number of salicided electrical connections; coupling a number of semiconductor chips to a first side of the silicon interposer; coupling a number of semiconductor chips to a second side of the silicon interposer; and electrically coupling the at least one of the number of semiconductor chips on the first side of the silicon interposer to at least one of the number of semiconductor chips on the second side of the silicon interposer using the number of salicided electrical connections.
Claim 26
Independent Claim
109 words
A method for forming an electronic system module, comprising: forming a number of micro-machined vias through a silicon interposer having opposing sides, wherein the number of micro-machined vias includes a number of salicided electrical connections; coupling a number of semiconductor chips to a first side of the silicon interposer; coupling a number of semiconductor chips to a second side of the silicon interposer; and electrically coupling the at least one of the number of semiconductor chips on the first side of the silicon interposer to at least one of the number of semiconductor chips on the second side of the silicon interposer using the number of salicided electrical connections.
Claim 27
Dependent Claim
36 words
The method of claim 21 , wherein forming a number of micro-machined vias through a silicon interposer having opposing sides includes forming the number of micro-machined vias through a silicon interposer formed from recycled silicon wafers.
Claim 28
Dependent Claim
36 words
The method of claim 21 , wherein coupling a number of semiconductor chips to a first side of the silicon interposer includes coupling at least one active circuit to the first side of the silicon interposer.
Claim 29
Dependent Claim
36 words
The method of claim 21 , wherein coupling a number of semiconductor chips to a second side of the silicon interposer includes coupling at least one passive circuit to the second side of the silicon interposer.
Claim 30
Dependent Claim
22 words
The method of claim 21 , wherein the method further includes coupling a capacitor to the second side of the silicon interposer.
Claim 31
Independent Claim
109 words
A method for forming an electronic system module, comprising: forming a number of micro-machined vias through a silicon interposer having opposing sides, wherein forming the number of micro-machined vias through the silicon interposer includes forming salicided connections in the number of micro-machined vias; coupling at least one semiconductor chip to a first side of the silicon interposer; coupling at least one semiconductor chip to a second side of the silicon interposer; and electrically coupling the at least one semiconductor chip on the first side of the silicon interposer to the at least one semiconductor chip on the second side of the silicon interposer using the number of micro-machined vias.
Claim 32
Independent Claim
109 words
A method for forming an electronic system module, comprising: forming a number of micro-machined vias through a silicon interposer having opposing sides, wherein forming the number of micro-machined vias through the silicon interposer includes forming salicided connections in the number of micro-machined vias; coupling at least one semiconductor chip to a first side of the silicon interposer; coupling at least one semiconductor chip to a second side of the silicon interposer; and electrically coupling the at least one semiconductor chip on the first side of the silicon interposer to the at least one semiconductor chip on the second side of the silicon interposer using the number of micro-machined vias.
Claim 33
Independent Claim
109 words
A method for forming an electronic system module, comprising: forming a number of micro-machined vias through a silicon interposer having opposing sides, wherein the number of micro-machined vias includes a number of salicided electrical connections; coupling at least one active circuit to a first side of the silicon interposer; coupling at least one passive circuit to a second side of the silicon interposer; and electrically coupling the at least one of the number of semiconductor chips on the first side of the silicon interposer to at least one of the number of semiconductor chips on the second side of the silicon interposer using the number of salicided electrical connections.
Claim 34
Independent Claim
109 words
A method for forming an electronic system module, comprising: forming a number of micro-machined vias through a silicon interposer having opposing sides, wherein the number of micro-machined vias includes a number of salicided electrical connections; coupling at least one active circuit to a first side of the silicon interposer; coupling at least one passive circuit to a second side of the silicon interposer; and electrically coupling the at least one of the number of semiconductor chips on the first side of the silicon interposer to at least one of the number of semiconductor chips on the second side of the silicon interposer using the number of salicided electrical connections.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-08-27 | 2005-02-26 | 2005-08-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-08-27 | 2009-02-26 | 2009-08-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-08-27 | 2013-02-26 | 2013-08-28 | $7700.00 | Window Closed / Lapsed |