High density semiconductor package

Claim 2

A semiconductor integrated circuit, comprising: first and second lead frames each having a plurality of leads; first and second semiconductor chips each having a plurality of electrical interface points; the first and second semiconductor chips each being affixed on the first and second lead frames, respectively, wherein each of the electrical interface points for each of the semiconductor chips is electrically connected to a corresponding one of the leads on the respective lead frame; the respective semiconductor chips and lead frames being stacked together and oriented such that the first and second semiconductor chips are positioned side by side and sandwiched between the first and the second lead frames; and a non-conductive material encapsulating the semiconductor chips and a portion of the lead frames, wherein the remaining portion of the leads of the lead frame protrudes from the non-conductive material.

Claim 3

The device according to claim 1, wherein the non-conductive material is a plastic molded around the semiconductor chips and a portion of the lead frames.

Claim 4

The device according to claim 1, wherein the electrical interface points are bonding pads and further comprising a plurality of bonding wires, wherein each of the plurality of boding wires electrically connects one lead of the plurality of leads to a corresponding one of the bonding pads.

Claim 5

The device according to claim 1, wherein the electrical interface points are bonding pads with each bonding pad covered with a layer of conductive material to form a bump that allows for the direct attachment of each bonding pad to a corresponding one of the leads.

Claim 6

The device according to claim 1, wherein the lead frames are positioned together and oriented such that the protruding leads of both of the lead frames are pointed in the same direction.

Claim 7

The device according to claim 1, wherein the lead frames are positioned together and oriented such that the protruding leads of one of the lead frames are pointed in the opposite direction from the protruding leads of the other of the lead frames.

Claim 8

The device according to claim 1, wherein the device forms a thin package, the package having mounting posts on one side of the package for vertical mounting of the package on a printed circuit board.

Claim 9

A semiconductor integrated circuit device, comprising: a first lead frame having a plurality of leads; a first semiconductor chip having a first and second surface, the first surface of the first semiconductor chip having a plurality of electrical interface points and being affixed on the first lend frame, wherein each of the electrical interface points of the first semiconductor chip is electrically connected to a corresponding lead of the first lead frame; a second lead frame having a plurality of leads; a second semiconductor chip having a first and second surface, the first surface of the second semiconductor chip having a plurality of electrical interface points and being affixed to the second lead frame, wherein each of the electrical interface points of the second semiconductor chip is electrically connected to a corresponding one of the leads of the second lead frame; the respective semiconductor chips and lead frames being stacked together and oriented such that the second surfaces of the first and second semiconductor chips are facing each other and the semiconductor chips are sandwiched between the first and the second lead frames; a chip separator material being interposed between the second surfaces of the first and second semiconductor chips; and a non-conductive material encapsulating the semiconductor chips and a portion of the leads of the lead frames, wherein the remaining portions of the leads of the lead frames protrude from the non-conductive material.

Claim 10

A semiconductor integrated circuit device, comprising: a first lead frame having a plurality of leads; a first semiconductor chip having a first and second surface, the first surface of the first semiconductor chip having a plurality of electrical interface points and being affixed on the first lend frame, wherein each of the electrical interface points of the first semiconductor chip is electrically connected to a corresponding lead of the first lead frame; a second lead frame having a plurality of leads; a second semiconductor chip having a first and second surface, the first surface of the second semiconductor chip having a plurality of electrical interface points and being affixed to the second lead frame, wherein each of the electrical interface points of the second semiconductor chip is electrically connected to a corresponding one of the leads of the second lead frame; the respective semiconductor chips and lead frames being stacked together and oriented such that the second surfaces of the first and second semiconductor chips are facing each other and the semiconductor chips are sandwiched between the first and the second lead frames; a chip separator material being interposed between the second surfaces of the first and second semiconductor chips; and a non-conductive material encapsulating the semiconductor chips and a portion of the leads of the lead frames, wherein the remaining portions of the leads of the lead frames protrude from the non-conductive material.

Claim 11

The device according to claim 8, wherein the non-conductive material is a plastic molded around the semiconductor chips and a portion of the lead frames.

Claim 12

The device according to claim 8, wherein the electrical interface points are bonding pads and further comprising a plurality of bonding wires, wherein each of the plurality of bonding wires electrically connects one lead of the plurality of leads to a corresponding one of the bonding pads.

Claim 13

The device according to claim 8, wherein the electrical interface points are bonding pads with each bonding pad covered with a layer of conductive material to form a bump that allows for the direct attachment of each bonding pad to a corresponding one of the leads.

Claim 14

The device according to claim 8, wherein the lead frames are positioned together and oriented such that the protruding leads of the first and second lead frames are pointed in the same direction.

Claim 15

The device according to claim 8, wherein the lead frames are positioned together and oriented such that the protruding leads of first lead frame are pointed in the opposite direction from the protruding leads of the second lead frame.

Claim 16

The device according to claim 8, wherein the device forms a thin package, the package having mounting posts on one side of the package for vertical mounting of the package on a printed circuit board.