Semiconductor integrated circuit device having mirror image circuit bars bonded on opposite sides of a lead frame

Claim 2

A semiconductor integrated circuit device comprising: a pair of semiconductor circuit bars having active faces and having a plurality of spaced apart second level bonding pads, a plurality of spaced apart second level bonding lands and second level leads interconnecting said second level pads and second level lands formed on said active faces of said bars, the layout of said second level bonding lands on each of said bars being the same while the layout of said second level bonding pads on each of said bars are mirror images of one another such that juxtaposing said active faces of said pair of bars aligns corresponding ones of said second level bonding pads; and a lead frame having a plurality of pins and having a plurality of frame bonding pads interconnected with corresponding respective pins, said lead frame being sandwiched between said active faces of said pair of bars with said frame pads being bonded to corresponding second level bonding pads of said pair of bars.

Claim 3

The device of claim 1, in which the area of said second level bonding pads is at least 400 square mils.

Claim 4

The device of claim 1, in which said second level pads and leads are formed of a layer of chromium under a layer of copper under a layer of gold.

Claim 5

The device of claim 1, in which said pair of bars are each DRAMs and the second level bonding pads on a first of said pair of bars corresponding to the second bar Data-in and Data-out pads are dummy pads and the second level bonding pads on said second bar corresponding to the first bar Data-in and Data-out pads are dummy pads.

Claim 6

The device of claim 1, in which said pair of bars are each DRAMs and one of said bars having a dummy pad for a second level bonding pad corresponding to the row address strobe pad on the other bar, the other of said bars having a dummy pad for a second level bonding pad corresponding to the row address strobe pad on the one bar and the Data-in pads on each of said bars are in common as are the Data-out pads on each of said bars.

Claim 7

The device of claim 1 in which said second level pads, leads and lands are made of metal.

Claim 8

A semiconductor circuit bar adapted to be bonded to one side of a lead frame that has a similar semiconductor circuit bar bonded to the other side of said lead frame, said lead frame having a plurality of pins and having a plurality of frame bonding pads interconnected with corresponding respective pins, said semiconductor circuit bar comprising: A. an active face; B. plural spaced apart bar bonding pads on said active face arranged identical to corresponding ones of plural bar bonding pads on a similar active face of said similar semiconductor circuit bar; C. plural spaced apart second level bonding lands overlying and contacting corresponding ones of said bar bonding pads; D. plural spaced apart second level bonding pads on said active face, said second level bonding pads adapted to be bonded to desired ones of said frame bonding pads, and being arranged in a mirror image to corresponding ones of plural spaced apart second level bonding pads on said similar active face of said similar semiconductor circuit bar; and E. plural second level leads on said active face interconnecting corresponding ones of said second level bonding lands and second level bonding pads, said second level leads being arranged different from corresponding ones of plural second level leads interconnecting, at least partly, said plural bar bonding pads on said similar active face and said second level bonding pads on said similar active face.

Claim 9

A semiconductor circuit bar adapted to be bonded to one side of a lead frame that has a similar semiconductor circuit bar bonded to the other side of said lead frame, said lead frame having a plurality of pins and having a plurality of frame bonding pads interconnected with corresponding respective pins, said semiconductor circuit bar comprising: A. an active face; B. plural spaced apart bar bonding pads on said active face arranged identical to corresponding ones of plural bar bonding pads on a similar active face of said similar semiconductor circuit bar; C. plural spaced apart second level bonding lands overlying and contacting corresponding ones of said bar bonding pads; D. plural spaced apart second level bonding pads on said active face, said second level bonding pads adapted to be bonded to desired ones of said frame bonding pads, and being arranged in a mirror image to corresponding ones of plural spaced apart second level bonding pads on said similar active face of said similar semiconductor circuit bar; and E. plural second level leads on said active face interconnecting corresponding ones of said second level bonding lands and second level bonding pads, said second level leads being arranged different from corresponding ones of plural second level leads interconnecting, at least partly, said plural bar bonding pads on said similar active face and said second level bonding pads on said similar active face.

Claim 10

The circuit bar of claim 7 in which the area of said second level bonding pads on said active face is at least 400 square mils.

Claim 11

The circuit bar of claim 7 in which at least said second level pads and leads are formed of a layer of chromium under a layer of copper under a layer of gold.

Claim 12

The circuit bar of claim 7 in which said circuit bar and said similar circuit bar are DRAMS and said second level bonding pads on said active face including dummy pads arranged in a mirror image to the Data-in and Data-out second level bonding pads on said similar active face.

Claim 13

The circuit bar of claim 7 in which said circuit bar and said similar circuit bar are DRAMS and said second level bonding pads on said active face include a dummy pad arranged in a mirror image to a row address strobe second level bonding pad on said similar active face.

Claim 14

The circuit bar of claim 7 in which said second level pads, leads and lands on said active face are made of metal.

Claim 15

The circuit bar of claim 7 in which said circuit bar is a 256K DRAM and said second level bonding pads on said active face are adapted to be bonded to said frame bonding pads in a configuration of a 256K×2 memory device.

Claim 16

The circuit bar of claim 7 in which said circuit bar is a 256K DRAM and said second level bonding pads on said active face are adapted to be bonded to said frame bonding pads in a configuration of a 512K×1 memory device.

Claim 17

The circuit bar of claim 7 in which said circuit bar is a 1 megabit DRAM and said second level bonding pads on said active face are adapted to be bonded to said frame bonding pads in a configuration of a 1 megabit×2 memory device.

Claim 18

The circuit bar of claim 7 in which said circuit bar is a 1 megabit DRAM and said second level bonding pads on said active face are adapted to be bonded to said frame bonding pads in a configuration of a 2 megabit×1 memory device.

Claim 19

A semiconductor integrated circuit device comprising: A. a lead frame having a plurality of pins and having a plurality of frame bonding pads interconnected with corresponding respective pins, the frame bonding pads being capable of bonding on opposed sides of said lead frame; B. at least one pair of semiconductor integrated circuit bars, each circuit bar having bonding pads arranged in mirror image of one another and the pair of circuit bars being bonded on opposed sides of said lead frame by said bonding pads of each circuit bar being bonded to corresponding frame bonding pads; and C. encapsulation material surrounding said circuit bars, frame bonding pads, and at least a part of each of said pins.

Claim 20

A semiconductor integrated circuit device comprising: A. a lead frame having a plurality of pins and having a plurality of frame bonding pads interconnected with corresponding respective pins, the frame bonding pads being capable of bonding on opposed sides of said lead frame; B. at least one pair of semiconductor integrated circuit bars, each circuit bar having bonding pads arranged in mirror image of one another and the pair of circuit bars being bonded on opposed sides of said lead frame by said bonding pads of each circuit bar being bonded to corresponding frame bonding pads; and C. encapsulation material surrounding said circuit bars, frame bonding pads, and at least a part of each of said pins.

Claim 21

The device of claim 17 in which said circuit bars have bar bonding pads arranged identical with one another and at least pad leads on each circuit bar interconnecting corresponding bar bonding pads and bonding pads.

Claim 22

The device of claim 17 in which said circuit bars are DRAMS.

Claim 23

The device of claim 17 in which each of said circuit bars have Data-in and Data-out bonding pads and the Data-in and Data-out bonding pads of the pair of circuit bars are separate from one another in bonding to said frame bonding pads.

Claim 24

The device of claim 17 in which said circuit bars have Data-in bonding pads bonded to the same frame bonding pad, and Data-out bonding pads bonded to the same frame bonding pad, and the pair of circuit bars each having a row address strobe bonding pad bonded to frame bonding pads separate from one another.

Claim 25

The device of claim 1 or 17 in which each of said circuit bars are 256K DRAMS and said bonding pads being bonded to said frame bonding pads in a configuration of a 256K×2 memory device.

Claim 26

The device of claim 1 or 17 in which each of said circuit bars are 256K DRAMS and said bonding pads being bonded to said frame bonding pads in a configuration of a 512K×1 memory device.

Claim 27

The device of claim 1 or 17 in which each of said circuit bars are 1 megabit DRAMS and said bonding pads being bonded to said frame bonding pads in a configuration of a 1 megabit×2 memory device.

Claim 28

The device of claim 1 or 17 in which each of said circuit bars are 1 megabit DRAMS and said bonding pads being bonded to said frame bonding pads in a configuration of a 2 megabit×1 memory device.