Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
195 words
A multilayer ceramic, multi-chip packaging assembly comprising: a ceramic substrate having at least a pair of semiconductor chip receiving cavities therein; a metalization pattern partially embedded within said substrate for providing electrical paths for semiconductor chip devices joined thereto to external circuitry; said pattern including a first level having at least a pair of exposed pads for joining semiconductor chips thereto; at least a pair of semiconductor chip devices joined to said joining pads within said semiconductor chip receiving cavities; said pattern further including a second level above said first level, said second level including exposed finger areas spaced from one another and about said semiconductor chip receiving cavities, and leads extending between said finger areas and semiconductor chip terminals of said semiconductor chip devices within said semiconductor chip receiving cavities; said finger areas on one side of one of said chip receiving cavities being offset with respect to said finger areas on the opposite side of said one of said chip receiving cavities; and, said offset finger areas on one side of said one of said chip receiving cavities being aligned with finger areas on one side of another of said chip receiving cavities.
Claim 2
Dependent Claim
195 words
A multilayer ceramic, multi-chip packaging assembly comprising: a ceramic substrate having at least a pair of semiconductor chip receiving cavities therein; a metalization pattern partially embedded within said substrate for providing electrical paths for semiconductor chip devices joined thereto to external circuitry; said pattern including a first level having at least a pair of exposed pads for joining semiconductor chips thereto; at least a pair of semiconductor chip devices joined to said joining pads within said semiconductor chip receiving cavities; said pattern further including a second level above said first level, said second level including exposed finger areas spaced from one another and about said semiconductor chip receiving cavities, and leads extending between said finger areas and semiconductor chip terminals of said semiconductor chip devices within said semiconductor chip receiving cavities; said finger areas on one side of one of said chip receiving cavities being offset with respect to said finger areas on the opposite side of said one of said chip receiving cavities; and, said offset finger areas on one side of said one of said chip receiving cavities being aligned with finger areas on one side of another of said chip receiving cavities.
Claim 3
Dependent Claim
30 words
The invention defined by claim 1 wherein said pattern includes a third level spaced from and positioned beneath said semiconductor chip devices for completing interconnections between said semiconductor chip devices.
Claim 4
Dependent Claim
19 words
The invention defined by claim 1 wherein said first level pattern includes means for electrically connecting to external circuitry.
Claim 5
Dependent Claim
17 words
The invention defined by claim 1 including embedded means for electrically interconnecting said first and second levels.
Claim 6
Dependent Claim
19 words
The invention defined by claim 1 wherein said second level pattern includes means for electrically connecting to external circuitry.
Claim 7
Dependent Claim
25 words
The invention defined by claim 1 wherein said second level includes embedded lead lines extending from said finger areas for electrically connecting to external circuitry.
Claim 8
Dependent Claim
17 words
The invention defined by claim 1 including embedded means for electrically interconnecting said first and second levels.
Claim 9
Dependent Claim
13 words
The invention defined by claim 1 including electrical interconnection means between finger areas.
Claim 10
Dependent Claim
38 words
The invention defined by claim 1 wherein said first level of said metalization pattern includes means for interconnecting to said second and third levels and further includes lead lines extending from said interlevel interconnection means to external circuitry.
Claim 11
Dependent Claim
16 words
The invention defined by claim 1 including leads along at least one edge of said substrate.
Claim 12
Dependent Claim
18 words
The invention defined by claim 1 including means for hermetically sealing said semiconductor chip devices within said cavities.