Microelectronic modules and assemblies

Abstract

Abstract A VERTICAL STACK OF MULTILAYER-CERAMIC MICRO-ELECTRONIC CIRCUIT-COMPONENT MODULES HAVING DISCRETE CIRCUIT COMPONENTS MOUNTED THEREON AND HAVING CONTACTS ON OPPOSITE SURFACES THEREOF, ALTERNATING WITH MULTILAYER-CERAMIC TRANSITION MODULES HAVING CONTACTS ON THEIR OPPOSITE SURFACES WHICH MATE WITH, AND ARE BONDED TO, THE CORRESPONDING CONTACTS ON THE ADJACENT CIRCUIT-COMPONENT MODULES, THE TRANSITION MODULES PROVIDE THE PARTICULAR INTERCONNECTIONS BETWEEN THE CONTACTS OF THE CIRCUIT-COMPONENT MODULES ON EITHER SIDE THEREOF WHICH ARE REQUIRED FOR THE PARTICULAR CIRCUIT APPLICATION. THE TRANSITION MODULES ARE APPROPRIATELY RECESSED OR APERTURED TO ACCOMMODATE THE DISCRETE COMPONENTS ON THE CIRCUIT-COMPONENT MODULES, AND PREFERABLY AN EXTERNAL-CONNECTION MODULE IS USED AT ONE END OF THE STACK TO PROVIDE TRANSITION TO STANDARD TYPES OF EXTERNAL CONNECTORS. (TO FABRICATE THE STACK, THE MODULES ARE MADE SEPARATELY AND PROVIDED AT THE INTERMODULE CONTACT POINTS WITH GLOBULES OF SOLDER BY A SIMPLE DIP-SOLDERING METHOD, ASSEMBLED IN A SUITABLE JIG FOR HOLDING THE APPROPRIATE SOLDER GLOBULES OF THE SEVERAL MODULES AGAINST EACH OTHER, AND HEATED TO PROVIDE SIMULTANEOUS BONDING OF ALL SOLDER CONNECTIONS TO EACH OTHER, THEREBY TO PROVIDE ELECTRICAL CONNECTION AND PHYSICAL SUPPORT IN ONE OPERATION.) THE EXTERNAL-CONNECTION MODULE MAY BE EXTENDED BEYOND THE STACK SO AS TO PROVIDE SIMILAR CONNECTION AND BONDING TO ANOTHER ADJACENT SIMILAR STACK.

Inventors

• 👤 Thomas J Matcovich

Bibliographic Details