US5903045A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Self-aligned connector for stacked chip module
Assignee: International Business Machines Corp
•
Filing: 1996-04-30
•
Granted: 1999-05-11
•
Expires: 2016-04-30
Abstract
Abstract A semiconductor structure includes a stack of two semiconductor chips. An edge of the chips forms a side surface of the stack. Insulation and adhesive is located between the chips, and a wire contacting circuitry on one of the chips extends through the insulation to the side surface. A first conductor contacts the wire on the side surface. The first conductor is self-aligned to the wire and extends above the side surface. The first conductor facilitates pads or connectors on the side surface that are insulated from the semiconductor chips. The self-aligned first conductor is an electroplated or electroless plated metal.
Inventors
- 👤 Claude L. Bertin
- 👤 Thomas G. Ference
- 👤 Wayne J. Howell
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 08:58
CPC Classifications
H; H10; H10W; H10W72/00; H10W90/00; H10W46/00; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W72/20; H10W72/251; H10W72/90; H10W72/921; H10W72/923; H10W72/941; H10W72/942; H10W72/951; H10W72/952; H10W90/20; H10W90/297; H10W90/701; H10W90/721; H10W90/722
Claims Analysis
Total Claims: 30
Claim 1
Independent Claim
88 words
A semiconductor structure, comprising: a planar surface comprising a semiconductor and a first insulator; a metal lead extending no higher than said surface, said lead insulated from said semiconductor by said first insulator; and a non-integral first conductor contacting said lead, said first conductor extending above said surface, said first conductor self-aligned to said lead, said first conductor having an outer periphery; and a second layer of insulation, said second layer of insulation being on said surface, said second layer of insulation being self-aligned to said outer periphery.
Claim 2
Dependent Claim
88 words
A semiconductor structure, comprising: a planar surface comprising a semiconductor and a first insulator; a metal lead extending no higher than said surface, said lead insulated from said semiconductor by said first insulator; and a non-integral first conductor contacting said lead, said first conductor extending above said surface, said first conductor self-aligned to said lead, said first conductor having an outer periphery; and a second layer of insulation, said second layer of insulation being on said surface, said second layer of insulation being self-aligned to said outer periphery.
Claim 3
Dependent Claim
71 words
A semiconductor structure as recited in claim 1, wherein said planar surface being a first side surface of at least two stacked integrated circuit chips, said side surface comprising semiconductor edges of said stacked chips, said first insulation being insulation between said chips; and said conductive lead making electrical contact with a circuit on one of said chips, said conductive lead extending through said first insulation to said first side surface.
Claim 4
Dependent Claim
15 words
A semiconductor structure as recited in claim 2, said first conductor being a plated metal.
Claim 5
Dependent Claim
41 words
A semiconductor structure as recited in claim 2, a said second layer of insulation being on said first side surface, said structure further comprising a metallization layer on said second layer of insulation, said metallization layer electrically contacting said first conductor.
Claim 6
Dependent Claim
15 words
A semiconductor structure as recited in claim 4, said metallization layer being a T-connect pad.
Claim 7
Dependent Claim
17 words
A semiconductor structure as recited in claim 5, said T-connect pad being self-aligned to said first conductor.
Claim 8
Dependent Claim
15 words
A semiconductor structure as recited in claim 6, said T-connect pad comprising a plated metal.
Claim 9
Dependent Claim
17 words
A semiconductor structure as recited in claim 5, further comprising a terminal metal on said T-connect pad.
Claim 10
Dependent Claim
14 words
A semiconductor structure as recited in claim 8, said terminal metal comprising plated solder.
Claim 11
Dependent Claim
32 words
A semiconductor structure as recited in claim 2, said stack further comprising a second side surface, said conductive lead extending both to said second side surface and to said first side surface.
Claim 12
Dependent Claim
39 words
A semiconductor structure as recited in claim 10, further comprising a plurality of conductive leads extending to both said first and said second side surfaces of said stacked chips, said conductive leads all interconnected along said second side surface.
Claim 13
Dependent Claim
44 words
A semiconductor structure, comprising: a metal lead; a non-integral first conductor contacting said lead, said first conductor self-aligned to said lead, said first conductor having an outer periphery; and an insulator self-aligned to said outer periphery, wherein said first conductor extends through said insulator.
Claim 14
Dependent Claim
44 words
A semiconductor structure, comprising: a metal lead; a non-integral first conductor contacting said lead, said first conductor self-aligned to said lead, said first conductor having an outer periphery; and an insulator self-aligned to said outer periphery, wherein said first conductor extends through said insulator.
Claim 15
Dependent Claim
15 words
A semiconductor as recited in claim 12, wherein said first conductor comprises a plated conductor.
Claim 16
Dependent Claim
15 words
A semiconductor as recited in claim 13, wherein said first conductor comprises an electroplated conductor.
Claim 17
Dependent Claim
15 words
A semiconductor as recited in claim 13, wherein said first conductor comprises a terminal metal.
Claim 18
Dependent Claim
24 words
A semiconductor as recited in claim 13, wherein said first conductor comprises one from the group consisting of chrome, copper, gold, nickel, and solder.
Claim 19
Dependent Claim
16 words
A semiconductor as recited in claim 12, further comprising a contactor self-aligned to said first conductor.
Claim 20
Dependent Claim
14 words
A semiconductor as recited in claim 17, wherein said contactor comprises a bump contactor.
Claim 21
Dependent Claim
15 words
A semiconductor as recited in claim 18, wherein said bump contactor comprises a solder bump.
Claim 22
Dependent Claim
13 words
A semiconductor as recited in claim 17, wherein said contactor comprises plated metal.
Claim 23
Dependent Claim
13 words
A semiconductor as recited in claim 20, wherein said contactor comprises electroplated metal.
Claim 24
Dependent Claim
44 words
A semiconductor structure, comprising: a first metal lead and an insulator, said first metal lead extending through said insulator; a second metal pad contacting said first metal lead and self-aligned to said first metal lead; and a contactor self-aligned to said second metal pad.
Claim 25
Dependent Claim
44 words
A semiconductor structure, comprising: a first metal lead and an insulator, said first metal lead extending through said insulator; a second metal pad contacting said first metal lead and self-aligned to said first metal lead; and a contactor self-aligned to said second metal pad.
Claim 26
Dependent Claim
16 words
A semiconductor as recited in claim 22, wherein said second metal pad comprises a terminal metal.
Claim 27
Dependent Claim
16 words
A semiconductor as recited in claim 22, wherein said second metal pad comprises a layered structure.
Claim 28
Dependent Claim
21 words
A semiconductor as recited in claim 22, wherein said second metal pad comprises at least one of chrome, copper, and gold.
Claim 29
Dependent Claim
17 words
A semiconductor as recited in claim 22, wherein said second metal pad and said contactor are plated.
Claim 30
Dependent Claim
14 words
A semiconductor as recited in claim 22, wherein said contactor comprises a solder bump.
References Cited (Backward Citations)
US4525921A
Cited
US4672737A
Cited
US5016138A
Cited
US5426566A
Cited
US5279991A
Cited
US5432729A
Cited
US5478781A
Cited
US5719438A
Cited
US5466634A
Cited
US5517057A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-05-10 | 2002-11-09 | 2003-05-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-05-10 | 2006-11-09 | 2007-05-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-05-10 | 2010-11-09 | 2011-05-11 | $7700.00 | Window Closed / Lapsed |