Patent US6222280B1 successfully refreshed from Google Patents.
US6222280B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Test interconnect for semiconductor components having bumped and planar contacts
Assignee: Micron Technology Inc
•
Filing: 1999-03-22
•
Granted: 2001-04-24
•
Expires: 2019-03-22
Abstract
Abstract An interconnect for testing semiconductor components having both bumped contacts, and planar contacts, is provided. The interconnect includes: a substrate, first contacts on the substrate for electrically engaging the bumped contacts, and second contacts on the substrate for electrically engaging the planar contacts. In illustrative embodiments the first contacts include recesses in the substrate covered with a conductive layer, or recesses formed in a compliant layer on the substrate, or conductive polymer donuts sized and shaped to retain the bumped contacts. In illustrative embodiments the second contacts include etched pillars having penetrating projections, or conductive polymer bumps having penetrating particles, or flat topped projections having a compliant layer thereon. The interconnect can be used to construct a die level test carrier for testing components in singulated form, or to construct a wafer level test carrier for testing components in wafer or panel form.
Inventors
- 👤 Warren M. Farnworth
- 👤 Salman Akram
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 22:46
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/06711; G01R1/06733; G01R1/073; G01R1/07307; G01R1/07314; G01R1/04; G01R1/0408; H; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K3/00; H05K3/30; H05K3/32; H05K3/325
Claims Analysis
Total Claims: 53
Claim 1
Independent Claim
70 words
An interconnect for a semiconductor component comprising: a substrate; a first contact comprising a recess on the substrate at least partially covered with a conductive layer, the recess configured to retain and electrically engage a bumped contact on the component; and a second contact comprising a projection on the substrate sized and shaped to engage a planar contact on the component as the first contact electrically engages the bumped contact.
Claim 2
Dependent Claim
70 words
An interconnect for a semiconductor component comprising: a substrate; a first contact comprising a recess on the substrate at least partially covered with a conductive layer, the recess configured to retain and electrically engage a bumped contact on the component; and a second contact comprising a projection on the substrate sized and shaped to engage a planar contact on the component as the first contact electrically engages the bumped contact.
Claim 3
Dependent Claim
17 words
The interconnect of claim 1 wherein the substrate comprises a polymer layer wherein the recess is formed.
Claim 4
Dependent Claim
16 words
The interconnect of claim 1 wherein the recess comprises a conductive polymer donut on the substrate.
Claim 5
Dependent Claim
21 words
The interconnect of claim 1 wherein the second contact comprise a conductive polymer comprising metal particles for penetrating the planar contact.
Claim 6
Dependent Claim
12 words
The interconnect of claim 1 wherein the recess comprises a stepped surface.
Claim 7
Dependent Claim
86 words
An interconnect for a semiconductor component comprising: a substrate; a first contact comprising a recess on the substrate at least partially covered with a conductive layer, the recess configured to retain and electrically engage a bumped contact on the component; and a second contact comprising a projection on the substrate configured to engage a planar contact on the component, the projection having a height selected to space the component from the substrate to prevent deformation of the bumped contact during electrical engagement by the first contact.
Claim 8
Dependent Claim
86 words
An interconnect for a semiconductor component comprising: a substrate; a first contact comprising a recess on the substrate at least partially covered with a conductive layer, the recess configured to retain and electrically engage a bumped contact on the component; and a second contact comprising a projection on the substrate configured to engage a planar contact on the component, the projection having a height selected to space the component from the substrate to prevent deformation of the bumped contact during electrical engagement by the first contact.
Claim 9
Dependent Claim
29 words
The interconnect of claim 6 wherein the projection has a planar tip portion configured to support and prevent tilting of the component during electrical engagement of the bumped contact.
Claim 10
Dependent Claim
76 words
An interconnect for a semiconductor component comprising: a substrate; a first contact comprising a recess on the substrate at least partially covered with a conductive layer, the recess configured to retain and electrically engage a bumped contact on the component; and a second contact comprising a conductive polymer projection on the substrate configured to electrically engage a planar contact on the component, the projection comprising a plurality of particles therein configured to penetrate the planar contact.
Claim 11
Dependent Claim
76 words
An interconnect for a semiconductor component comprising: a substrate; a first contact comprising a recess on the substrate at least partially covered with a conductive layer, the recess configured to retain and electrically engage a bumped contact on the component; and a second contact comprising a conductive polymer projection on the substrate configured to electrically engage a planar contact on the component, the projection comprising a plurality of particles therein configured to penetrate the planar contact.
Claim 12
Dependent Claim
21 words
The interconnect of claim 8 wherein the second contact further comprises a contact pad on the substrate comprising a non-oxidizing metal.
Claim 13
Dependent Claim
26 words
The interconnect of claim 8 wherein the conductive polymer projection comprises a material selected from the group consisting of anisotropic conductive adhesives and metal filled silicone.
Claim 14
Dependent Claim
60 words
An interconnect for a semiconductor component comprising: a substrate; a first contact comprising a conductive polymer donut on the substrate configured to retain and electrically engage a bumped contact on the component; and a second contact comprising a projection on the substrate configured to engage a planar contact on the component as the first contact electrically engages the bumped contact.
Claim 15
Dependent Claim
60 words
An interconnect for a semiconductor component comprising: a substrate; a first contact comprising a conductive polymer donut on the substrate configured to retain and electrically engage a bumped contact on the component; and a second contact comprising a projection on the substrate configured to engage a planar contact on the component as the first contact electrically engages the bumped contact.
Claim 16
Dependent Claim
20 words
The interconnect of claim 11 wherein the conductive polymer donut includes a plurality of particles for penetrating the bumped contact.
Claim 17
Dependent Claim
21 words
The interconnect of claim 11 wherein the conductive polymer donut comprises a contact pad on the substrate comprising a non-oxidizing metal.
Claim 18
Dependent Claim
61 words
An interconnect for a semiconductor component comprising: a substrate; a first contact on the substrate configured to electrically engage a bumped contact on the component; and a second contact comprising a projection on the substrate having a planar tip portion with a polymer layer thereon configured to support the component during electrical engagement of the bumped contact by the first contact.
Claim 19
Dependent Claim
61 words
An interconnect for a semiconductor component comprising: a substrate; a first contact on the substrate configured to electrically engage a bumped contact on the component; and a second contact comprising a projection on the substrate having a planar tip portion with a polymer layer thereon configured to support the component during electrical engagement of the bumped contact by the first contact.
Claim 20
Dependent Claim
41 words
The interconnect of claim 14 wherein the component comprises a plurality of bumped contacts located along a center line thereof and the interconnect comprises at least two second contacts configured to support the component on either side of the bumped contacts.
Claim 21
Dependent Claim
23 words
The interconnect of claim 14 wherein the polymer layer comprises a material selected from the group consisting of polyimide, silicone, and butyl rubber.
Claim 22
Dependent Claim
16 words
The interconnect of claim 14 wherein the substrate comprises silicon and the second contact comprises silicon.
Claim 23
Dependent Claim
107 words
An interconnect for a semiconductor component comprising: a substrate; a first contact comprising a recess on the substrate at least partially covered with a conductive layer, the recess configured to retain and electrically engage a bumped contact on the component; a second contact comprising a projection on the substrate configured to engage a planar contact on the component as the first contact electrically engages the bumped contact; and an alignment member on the substrate having a first alignment opening configured to contact a peripheral edge of the component and a second alignment opening aligned with the recess configured to guide the bumped contact onto the first contact.
Claim 24
Dependent Claim
107 words
An interconnect for a semiconductor component comprising: a substrate; a first contact comprising a recess on the substrate at least partially covered with a conductive layer, the recess configured to retain and electrically engage a bumped contact on the component; a second contact comprising a projection on the substrate configured to engage a planar contact on the component as the first contact electrically engages the bumped contact; and an alignment member on the substrate having a first alignment opening configured to contact a peripheral edge of the component and a second alignment opening aligned with the recess configured to guide the bumped contact onto the first contact.
Claim 25
Dependent Claim
13 words
The interconnect of claim 18 wherein the alignment member comprises a photoimageable polymer.
Claim 26
Dependent Claim
14 words
The interconnect of claim 18 wherein the first contact comprises a conductive polymer donut.
Claim 27
Dependent Claim
22 words
The interconnect of claim 18 wherein the second contact comprises a conductive polymer having dendritic metal particles for penetrating the planar contact.
Claim 28
Dependent Claim
12 words
The interconnect of claim 18 wherein the recess comprises a stepped surface.
Claim 29
Dependent Claim
73 words
A carrier for testing a semiconductor component comprising: a base configured to hold the component; an interconnect on the base comprising a first contact configured to retain and electrically engage a bumped contact on the component and a second contact comprising a projection configured to engage a planar contact on the component as the first contact electrically engages the bumped contact; and a force applying mechanism for biasing the component against the interconnect.
Claim 30
Dependent Claim
73 words
A carrier for testing a semiconductor component comprising: a base configured to hold the component; an interconnect on the base comprising a first contact configured to retain and electrically engage a bumped contact on the component and a second contact comprising a projection configured to engage a planar contact on the component as the first contact electrically engages the bumped contact; and a force applying mechanism for biasing the component against the interconnect.
Claim 31
Dependent Claim
20 words
The carrier of claim 23 further comprising an alignment member on the interconnect for aligning the component to the interconnect.
Claim 32
Dependent Claim
14 words
The carrier of claim 23 wherein the first contact comprises a conductive polymer donut.
Claim 33
Dependent Claim
17 words
The carrier of claim 23 wherein the second contact comprises a conductive polymer having conductive particles therein.
Claim 34
Dependent Claim
23 words
The carrier of claim 23 wherein the component comprises an element selected from the group consisting of bare dice and chip scale packages.
Claim 35
Dependent Claim
12 words
The carrier of claim 23 wherein the component comprises a semiconductor wafer.
Claim 36
Dependent Claim
82 words
A carrier for testing a semiconductor component comprising: a base configured to hold the component; an interconnect on the base comprising: a plurality of first contacts configured to electrically engage a plurality of bumped contacts on the component; and a second contact comprising a projection configured to engage a planar contact on the component and to support the component during electrical engagement of the bumped contacts by the first contacts; and a force applying mechanism for biasing the component against the interconnect.
Claim 37
Dependent Claim
82 words
A carrier for testing a semiconductor component comprising: a base configured to hold the component; an interconnect on the base comprising: a plurality of first contacts configured to electrically engage a plurality of bumped contacts on the component; and a second contact comprising a projection configured to engage a planar contact on the component and to support the component during electrical engagement of the bumped contacts by the first contacts; and a force applying mechanism for biasing the component against the interconnect.
Claim 38
Dependent Claim
39 words
The carrier of claim 29 wherein the bumped contacts are located along a center line of the component and the interconnect comprises at least two second contacts configured to engage planar contacts on either side of the bumped contacts.
Claim 39
Dependent Claim
20 words
The carrier of claim 29 further comprising an alignment member on the interconnect for aligning the component to the interconnect.
Claim 40
Dependent Claim
84 words
A carrier for testing a semiconductor component comprising: a base for retaining the component; an interconnect on the base for electrically connecting the component to a test circuit, the interconnect comprising: a substrate; a first contact comprising a conductive polymer donut on the substrate configured to retain and electrically engage a bumped contact on the component; and a second contact comprising a projection on the substrate configured to engage a planar contact on the component as the first contact electrically engages the bumped contact.
Claim 41
Dependent Claim
84 words
A carrier for testing a semiconductor component comprising: a base for retaining the component; an interconnect on the base for electrically connecting the component to a test circuit, the interconnect comprising: a substrate; a first contact comprising a conductive polymer donut on the substrate configured to retain and electrically engage a bumped contact on the component; and a second contact comprising a projection on the substrate configured to engage a planar contact on the component as the first contact electrically engages the bumped contact.
Claim 42
Dependent Claim
21 words
The carrier of claim 32 wherein the conductive polymer donut comprises a plurality of metal particles for penetrating the bumped contact.
Claim 43
Dependent Claim
13 words
The carrier of claim 32 wherein the second contact comprises a conductive polymer.
Claim 44
Independent Claim
82 words
A system for testing a semiconductor component comprising: test circuitry for applying test signals to the component; and a carrier for holding the component in electrical communication with the test circuitry, the carrier comprising an interconnect comprising a first contact for electrically engaging a bumped contact on the component and a second contact for engaging a planar contact on the component, the second contact having a height selected to space the component from the interconnect to prevent deformation of the bumped contact.
Claim 45
Independent Claim
82 words
A system for testing a semiconductor component comprising: test circuitry for applying test signals to the component; and a carrier for holding the component in electrical communication with the test circuitry, the carrier comprising an interconnect comprising a first contact for electrically engaging a bumped contact on the component and a second contact for engaging a planar contact on the component, the second contact having a height selected to space the component from the interconnect to prevent deformation of the bumped contact.
Claim 46
Dependent Claim
20 words
The system of claim 35 wherein the carrier further comprises an alignment member for aligning the component to the interconnect.
Claim 47
Dependent Claim
45 words
The system of claim 35 wherein the interconnect comprises a polymer alignment member having a first alignment opening for contacting a peripheral edge of the component and a second alignment opening aligned with the first contact for aligning the bumped contact to the first contact.
Claim 48
Independent Claim
131 words
A system for testing a semiconductor component comprising: test circuitry for applying test signals to the component; and a carrier for holding the component in electrical communication with the test circuitry, the carrier comprising: a base; an interconnect on the base comprising: a substrate; a first contact comprising a recess on the substrate at least partially covered with a conductive layer, the recess configured to retain and electrically engage a bumped contact on the component; and a second contact comprising a projection on the substrate configured to engage a planar contact on the component, the projection having a planar surface for supporting the component to prevent tilting thereof during electrical engagement of the bumped contact by the first contact; and a force applying mechanism for biasing the component against the interconnect.
Claim 49
Independent Claim
131 words
A system for testing a semiconductor component comprising: test circuitry for applying test signals to the component; and a carrier for holding the component in electrical communication with the test circuitry, the carrier comprising: a base; an interconnect on the base comprising: a substrate; a first contact comprising a recess on the substrate at least partially covered with a conductive layer, the recess configured to retain and electrically engage a bumped contact on the component; and a second contact comprising a projection on the substrate configured to engage a planar contact on the component, the projection having a planar surface for supporting the component to prevent tilting thereof during electrical engagement of the bumped contact by the first contact; and a force applying mechanism for biasing the component against the interconnect.
Claim 50
Dependent Claim
49 words
The system of claim 38 wherein the interconnect further comprises an alignment member on the substrate having a first alignment opening configured to contact a peripheral edge of the component and a second alignment opening aligned with the recess configured to guide the bumped contact onto the first contact.
Claim 51
Dependent Claim
13 words
The system of claim 38 wherein the recess comprises a conductive polymer donut.
Claim 52
Dependent Claim
13 words
The system of claim 38 wherein the second contact comprises a conductive polymer.
Claim 53
Dependent Claim
12 words
The system of claim 38 wherein the recess comprises a stepped surface.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-04-23 | 2004-10-23 | 2005-04-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-04-23 | 2008-10-23 | 2009-04-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-04-23 | 2012-10-23 | 2013-04-24 | $7700.00 | Window Closed / Lapsed |