Patent US6297548B1 successfully refreshed from Google Patents.
US6297548B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Stackable ceramic FBGA for high thermal applications
Assignee: Micron Technology Inc
•
Filing: 1999-06-30
•
Granted: 2001-10-02
•
Expires: 2019-06-30
Abstract
Abstract An apparatus package for high temperature thermal applications for ball grid array semiconductor devices and a method of packaging ball grid array semiconductor devices.
Inventors
- 👤 Walter L. Moden
- 👤 David J. Corisis
- 👤 Leonard E. Mess
- 👤 Larry D. Kinsman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 23:36
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W90/00; H10W70/62; H10W70/65; H10W70/654; H10W70/655; H10W70/682; H10W70/685; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W90/20; H10W90/22; H10W90/291; H10W90/297; H10W90/701; H10W90/721; H10W90/722; H10W90/724; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 57
Claim 1
Independent Claim
169 words
An assembly comprising: a first carrier having a cavity therein, an upper surface, a lower surface, at least one connection pad on the upper surface, at least one connection pad on the lower surface, a first circuit connecting the at least one connection pad on the upper surface to the at least one connection pad on the lower surface, and at least one second circuit located in a portion of the cavity connected to the at least one connection pad on the upper surface and the at least one connection pad on the lower surface; a semiconductor device having an active surface having at least one bond pad thereon, the semiconductor device located within the cavity of the first carrier; a first connector between the at least one second circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the semiconductor device; and encapsulant material filling a portion of the cavity in the first carrier.
Claim 2
Dependent Claim
169 words
An assembly comprising: a first carrier having a cavity therein, an upper surface, a lower surface, at least one connection pad on the upper surface, at least one connection pad on the lower surface, a first circuit connecting the at least one connection pad on the upper surface to the at least one connection pad on the lower surface, and at least one second circuit located in a portion of the cavity connected to the at least one connection pad on the upper surface and the at least one connection pad on the lower surface; a semiconductor device having an active surface having at least one bond pad thereon, the semiconductor device located within the cavity of the first carrier; a first connector between the at least one second circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the semiconductor device; and encapsulant material filling a portion of the cavity in the first carrier.
Claim 3
Dependent Claim
62 words
The assembly of claim 1 , further comprising: a substrate having an upper surface, a lower surface, and at least one circuit on the upper surface thereof; and at least one second connector connected to the at least one connection pad on the lower surface of the first carrier and the at least one circuit on the upper surface of the substrate.
Claim 4
Dependent Claim
19 words
The assembly of claim 1 , wherein the first carrier includes at least one fin on a portion thereof.
Claim 5
Dependent Claim
193 words
The assembly of claim 1 , further comprising: a second carrier oriented with respect to the first carrier and positioned the same direction as the first carrier further having a cavity therein, an upper surface, a lower surface, at least one connection pad on the upper surface, at least one connection pad on the lower surface, at least one first circuit connecting the at least one connection pad on the upper surface to the at least one connection pad on the lower surface, and at least one second circuit located in a portion of the cavity connected to the at least one connection pad on the upper surface and the at least one connection pad on the lower surface; a semiconductor device having an active surface having at least one bond pad thereon, the semiconductor device located within the cavity of the second carrier; a first connector between the at least one second circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the semiconductor device; and encapsulant material filling a portion of the cavity in the first carrier.
Claim 6
Dependent Claim
38 words
The assembly of claim 1 , wherein the first carrier includes a first frustoconical surface on a portion thereof, a second frustoconical surface on another portion thereof, and a lip on a portion of a bottom surface thereof.
Claim 7
Dependent Claim
127 words
An assembly comprising: a first carrier having a cavity therein, an upper surface, a lower surface, at least one aperture extending therethrough, and at least one circuit located in a portion of the cavity extending to the at least one aperture; a semiconductor device having an active surface having at least one bond pad thereon, the semiconductor device located within the cavity of the first carrier; a first connector between the at least one circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the semiconductor device; encapsulant material filling a portion of the cavity in the first carrier; and connector material located in the at least one aperture in the first carrier.
Claim 8
Dependent Claim
127 words
An assembly comprising: a first carrier having a cavity therein, an upper surface, a lower surface, at least one aperture extending therethrough, and at least one circuit located in a portion of the cavity extending to the at least one aperture; a semiconductor device having an active surface having at least one bond pad thereon, the semiconductor device located within the cavity of the first carrier; a first connector between the at least one circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the semiconductor device; encapsulant material filling a portion of the cavity in the first carrier; and connector material located in the at least one aperture in the first carrier.
Claim 9
Dependent Claim
61 words
The assembly of claim 6 , further comprising: a substrate having an upper surface, a lower surface, and at least one circuit on the upper surface thereof; and at least one second connector connected to the connector material in the at least one aperture in the first carrier and the at least one circuit on the upper surface of the substrate.
Claim 10
Dependent Claim
19 words
The assembly of claim 6 , wherein the first carrier includes at least one fin on a portion thereof.
Claim 11
Dependent Claim
161 words
The assembly of claim 6 , further comprising: a second carrier oriented with respect to the first carrier and positioned the same direction as the first carrier further having a cavity therein, an upper surface, a lower surface, at least one aperture therethrough, and at least one circuit located in a portion of the cavity connected to the at least one aperture; a semiconductor device having an active surface having at least one bond pad thereon, the semiconductor device located within the cavity of the second carrier; a first connector between the at least one circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the semiconductor device; encapsulant material filling a portion of the cavity in the first carrier; and connector material located in a second aperture in the second carrier connected to the connector material in the at least one aperture in the first carrier.
Claim 12
Dependent Claim
38 words
The assembly of claim 6 , wherein the first carrier includes a first frustoconical surface on a portion thereof, a second frustoconical surface on another portion thereof, and a lip on a portion of a bottom surface thereof.
Claim 13
Dependent Claim
171 words
A semiconductor device assembly comprising: a first carrier having a cavity therein, an upper surface, a lower surface, at least one connection pad on the upper surface, at least one connection pad on the lower surface, a first circuit connecting the at least one connection pad on the upper surface to the at least one connection pad on the lower surface, and at least one second circuit located in a portion of the cavity connected to the at least one connection pad on the upper surface and the at least one connection pad on the lower surface; a semiconductor device having an active surface having at least one bond pad thereon, the semiconductor device located within the cavity of the first carrier; a first connector between the at least one second circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the semiconductor device; and encapsulant material filling a portion of the cavity in the first carrier.
Claim 14
Dependent Claim
171 words
A semiconductor device assembly comprising: a first carrier having a cavity therein, an upper surface, a lower surface, at least one connection pad on the upper surface, at least one connection pad on the lower surface, a first circuit connecting the at least one connection pad on the upper surface to the at least one connection pad on the lower surface, and at least one second circuit located in a portion of the cavity connected to the at least one connection pad on the upper surface and the at least one connection pad on the lower surface; a semiconductor device having an active surface having at least one bond pad thereon, the semiconductor device located within the cavity of the first carrier; a first connector between the at least one second circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the semiconductor device; and encapsulant material filling a portion of the cavity in the first carrier.
Claim 15
Dependent Claim
67 words
The semiconductor device assembly of claim 11 , further comprising: a substrate having an upper surface, a lower surface, and the at least one second circuit on the upper surface thereof; and at least one second connector connected to the at least one connection pad on the lower surface of the first carrier and the at least one second circuit on the upper surface of the substrate.
Claim 16
Dependent Claim
21 words
The semiconductor device assembly of claim 11 , wherein the first carrier includes at least one fin on a portion thereof.
Claim 17
Dependent Claim
193 words
The semiconductor device assembly of claim 11 , further comprising: a second carrier oriented with respect to the first carrier and positioned the same direction as the first carrier further having a cavity therein, an upper surface, a lower surface, at least one connection pad on the upper surface, at least one connection pad on the lower surface, a first circuit connecting the at least one connection pad on the upper surface to the at least one connection pad on the lower surface, and at least one second circuit located in a portion of the cavity connected to the at least one connection pad on the upper surface and the at least one connection pad on the lower surface; a semiconductor device having an active surface having at least one bond pad thereon, the semiconductor device located within the cavity of the second carrier; a first connector between the at least one second circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the semiconductor device; and encapsulant material filling a portion of the cavity in the first carrier.
Claim 18
Dependent Claim
40 words
The semiconductor device assembly of claim 11 , wherein the first carrier includes a first frustoconical surface on a portion thereof, a second frustoconical surface on another portion thereof, and a lip on a portion of a bottom surface thereof.
Claim 19
Dependent Claim
129 words
A semiconductor device assembly comprising: a first carrier having a cavity therein, an upper surface, a lower surface, at least one aperture extending therethrough, and at least one circuit located in a portion of the cavity extending to the at least one aperture; a semiconductor device having an active surface having at least one bond pad thereon, the semiconductor device located within the cavity of the first carrier; a first connector between the at least one circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the semiconductor device; encapsulant material filling a portion of the cavity in the first carrier; and connector material located in the at least one aperture in the first carrier.
Claim 20
Dependent Claim
129 words
A semiconductor device assembly comprising: a first carrier having a cavity therein, an upper surface, a lower surface, at least one aperture extending therethrough, and at least one circuit located in a portion of the cavity extending to the at least one aperture; a semiconductor device having an active surface having at least one bond pad thereon, the semiconductor device located within the cavity of the first carrier; a first connector between the at least one circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the semiconductor device; encapsulant material filling a portion of the cavity in the first carrier; and connector material located in the at least one aperture in the first carrier.
Claim 21
Dependent Claim
62 words
The semiconductor assembly of claim 16 , further comprising: a substrate having an upper surface, a lower surface, and at least one circuit on the upper surface thereof; and at least one second connector connected to the connector material in the at least one aperture in the first carrier and the at least one circuit on the upper surface of the substrate.
Claim 22
Dependent Claim
21 words
The semiconductor device assembly of claim 16 , wherein the first carrier includes at least one fin on a portion thereof.
Claim 23
Dependent Claim
163 words
The semiconductor device assembly of claim 16 , further comprising: a second carrier oriented with respect to the first carrier and positioned the same direction as the first carrier further having a cavity therein, an upper surface, a lower surface, at least one aperture therethrough, and at least one circuit located in a portion of the cavity connected to the at least one aperture; a semiconductor device having an active surface having at least one bond pad thereon, the semiconductor device located within the cavity of the second carrier; a first connector between the at least one circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the semiconductor device; encapsulant material filling a portion of the cavity in the first carrier; and connector material located in a second aperture in the second carrier connected to the connector material in the at least one aperture in the first carrier.
Claim 24
Dependent Claim
40 words
The semiconductor device assembly of claim 16 , wherein the first carrier includes a first frustoconical surface on a portion thereof, a second frustoconical surface on another portion thereof, and a lip on a portion of a bottom surface thereof.
Claim 25
Dependent Claim
225 words
An assembly comprising: a substrate having an upper surface, a lower surface, and at least one circuit on the upper surface thereof, a first carrier having a cavity therein, an upper surface, a lower surface, at least one connection pad on the upper surface, at least one connection pad on the lower surface, at least one first circuit connecting the at least one connection pad on the upper surface to the at least one connection pad on the lower surface, and at least one second circuit located in a portion of the cavity connected to the at least one connection pad on the upper surface and the at least one connection pad on the lower surface; a semiconductor device having an active surface having at least one bond pad thereon, the semiconductor device located within the cavity of the first carrier; a first connector between the at least one second circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the semiconductor device; encapsulant material filling a portion of the cavity in the first carrier; and at least one second connector connected to the at least one connection pad on the lower surface of the first carrier and the at least one first circuit on the upper surface of the substrate.
Claim 26
Dependent Claim
225 words
An assembly comprising: a substrate having an upper surface, a lower surface, and at least one circuit on the upper surface thereof, a first carrier having a cavity therein, an upper surface, a lower surface, at least one connection pad on the upper surface, at least one connection pad on the lower surface, at least one first circuit connecting the at least one connection pad on the upper surface to the at least one connection pad on the lower surface, and at least one second circuit located in a portion of the cavity connected to the at least one connection pad on the upper surface and the at least one connection pad on the lower surface; a semiconductor device having an active surface having at least one bond pad thereon, the semiconductor device located within the cavity of the first carrier; a first connector between the at least one second circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the semiconductor device; encapsulant material filling a portion of the cavity in the first carrier; and at least one second connector connected to the at least one connection pad on the lower surface of the first carrier and the at least one first circuit on the upper surface of the substrate.
Claim 27
Dependent Claim
19 words
The assembly of claim 21 , wherein the first carrier includes at least one fin on a portion thereof.
Claim 28
Dependent Claim
191 words
The assembly of claim 21 , further comprising: a second carrier oriented with respect to the first carrier and positioned the same direction as the first carrier further having a cavity therein, an upper surface, a lower surface, at least one connection pad on the upper surface, at least one connection pad on the lower surface, a first circuit connecting the at least one connection pad on the upper surface to the at least one connection pad on the lower surface, and at least one second circuit located in a portion of the cavity connected to the at least one connection pad on the upper surface and the at least one connection pad on the lower surface; a semiconductor device having an active surface having at least one bond pad thereon, the semiconductor device located within the cavity of the second carrier; a first connector between the at least one second circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the semiconductor device; and encapsulant material filling a portion of the cavity in the first carrier.
Claim 29
Dependent Claim
38 words
The assembly of claim 21 , wherein the first carrier includes a first frustoconical surface on a portion thereof, a second frustoconical surface on another portion thereof, and a lip on a portion of a bottom surface thereof.
Claim 30
Dependent Claim
178 words
An assembly comprising: a substrate having an upper surface, a lower surface, and at least one circuit on the upper surface thereof; a first carrier having a cavity therein, an upper surface, a lower surface, at least one aperture extending therethrough, and at least one circuit located in a portion of the cavity extending to the at least one aperture; a semiconductor device having an active surface having at least one bond pad thereon, the semiconductor device located within the cavity of the first carrier; a first connector between the at least one circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the semiconductor device; encapsulant material filling a portion of the cavity in the first carrier; connector material located in the at least one aperture in the carrier; and at least one second connector connected to the connector material in the at least one aperture in the first carrier and the at least one circuit on the upper surface of the substrate.
Claim 31
Dependent Claim
178 words
An assembly comprising: a substrate having an upper surface, a lower surface, and at least one circuit on the upper surface thereof; a first carrier having a cavity therein, an upper surface, a lower surface, at least one aperture extending therethrough, and at least one circuit located in a portion of the cavity extending to the at least one aperture; a semiconductor device having an active surface having at least one bond pad thereon, the semiconductor device located within the cavity of the first carrier; a first connector between the at least one circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the semiconductor device; encapsulant material filling a portion of the cavity in the first carrier; connector material located in the at least one aperture in the carrier; and at least one second connector connected to the connector material in the at least one aperture in the first carrier and the at least one circuit on the upper surface of the substrate.
Claim 32
Dependent Claim
19 words
The assembly of claim 25 , wherein the first carrier includes at least one fin on a portion thereof.
Claim 33
Dependent Claim
161 words
The assembly of claim 25 , further comprising: a second carrier oriented with respect to the first carrier and positioned the same direction as the first carrier further having a cavity therein, an upper surface, a lower surface, at least one aperture therethrough, and at least one circuit located in a portion of the cavity connected to the at least one aperture; a semiconductor device having an active surface having at least one bond pad thereon, the semiconductor device located within the cavity of the second carrier; a first connector between the at least one circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the semiconductor device; encapsulant material filling a portion of the cavity in the first carrier; and connector material located in a second aperture in the second carrier connected to the connector material in the at least one aperture in the first carrier.
Claim 34
Dependent Claim
38 words
The assembly of claim 25 , wherein the first carrier includes a first frustoconical surface on a portion thereof, a second frustoconical surface on another portion thereof, and a lip on a portion of the bottom surface thereof.
Claim 35
Dependent Claim
227 words
A semiconductor device assembly comprising: a substrate having an upper surface, a lower surface, and at least one circuit on the upper surface thereof; a first carrier having a cavity therein, an upper surface, a lower surface, at least one connection pad on the upper surface, at least one connection pad on the lower surface, at least one first circuit connecting the at least one connection pad on the upper surface to the at least one connection pad on the lower surface, and at least one second circuit located in a portion of the cavity connected to the at least one connection pad on the upper surface and the at least one connection pad on the lower surface; a semiconductor device having an active surface having at least one bond pad thereon, the semiconductor device located within the cavity of the first carrier; a first connector between the at least one second circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the semiconductor device; encapsulant material filling a portion of the cavity in the first carrier; and at least one second connector connected to the at least one connection pad on the lower surface of the first carrier and the at least one first circuit on the upper surface of the substrate.
Claim 36
Dependent Claim
227 words
A semiconductor device assembly comprising: a substrate having an upper surface, a lower surface, and at least one circuit on the upper surface thereof; a first carrier having a cavity therein, an upper surface, a lower surface, at least one connection pad on the upper surface, at least one connection pad on the lower surface, at least one first circuit connecting the at least one connection pad on the upper surface to the at least one connection pad on the lower surface, and at least one second circuit located in a portion of the cavity connected to the at least one connection pad on the upper surface and the at least one connection pad on the lower surface; a semiconductor device having an active surface having at least one bond pad thereon, the semiconductor device located within the cavity of the first carrier; a first connector between the at least one second circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the semiconductor device; encapsulant material filling a portion of the cavity in the first carrier; and at least one second connector connected to the at least one connection pad on the lower surface of the first carrier and the at least one first circuit on the upper surface of the substrate.
Claim 37
Dependent Claim
21 words
The semiconductor device assembly of claim 29 , wherein the first carrier includes at least one fm on a portion thereof.
Claim 38
Dependent Claim
193 words
The semiconductor device assembly of claim 29 , further comprising: a second carrier oriented with respect to the first carrier and positioned the same direction as the first carrier further having a cavity therein, an upper surface, a lower surface, at least one connection pad on the upper surface, at least one connection pad on the lower surface, a first circuit connecting the at least one connection pad on the upper surface to the at least one connection pad on the lower surface, and at least one second circuit located in a portion of the cavity connected to the at least one connection pad on the upper surface and the at least one connection pad on the lower surface; a semiconductor device having an active surface having at least one bond pad thereon, the semiconductor device located within the cavity of the second carrier; a first connector between the at least one second circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the semiconductor device; and encapsulant material filling a portion of the cavity in the first carrier.
Claim 39
Dependent Claim
40 words
The semiconductor device assembly of claim 29 , wherein the first carrier includes a first frustoconical surface on a portion thereof, a second frustoconical surface on another portion thereof, and a lip on a portion of a bottom surface thereof.
Claim 40
Dependent Claim
184 words
A semiconductor device assembly comprising: a substrate having an upper surface, a lower surface, and at least one first circuit on the upper surface thereof; a first carrier having a cavity therein, an upper surface, a lower surface, at least one aperture extending therethrough, and at least one second circuit located in a portion of the cavity extending to the at least one aperture; a semiconductor device having an active surface having at least one bond pad thereon, the semiconductor device located within the cavity of the first carrier; a first connector between the at least one second circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the semiconductor device; encapsulant material filling a portion of the cavity in the first carrier; connector material located in the at least one aperture in the carrier; and at least one second connector connected to the connector material in the at least one aperture in the first carrier and the at least one first circuit on the upper surface of the substrate.
Claim 41
Dependent Claim
184 words
A semiconductor device assembly comprising: a substrate having an upper surface, a lower surface, and at least one first circuit on the upper surface thereof; a first carrier having a cavity therein, an upper surface, a lower surface, at least one aperture extending therethrough, and at least one second circuit located in a portion of the cavity extending to the at least one aperture; a semiconductor device having an active surface having at least one bond pad thereon, the semiconductor device located within the cavity of the first carrier; a first connector between the at least one second circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the semiconductor device; encapsulant material filling a portion of the cavity in the first carrier; connector material located in the at least one aperture in the carrier; and at least one second connector connected to the connector material in the at least one aperture in the first carrier and the at least one first circuit on the upper surface of the substrate.
Claim 42
Dependent Claim
21 words
The semiconductor device assembly of claim 33 , wherein the first carrier includes at least one fin on a portion thereof.
Claim 43
Dependent Claim
163 words
The semiconductor device assembly of claim 33 , further comprising: a second carrier oriented with respect to the first carrier and positioned the same direction as the first carrier further having a cavity therein, an upper surface, a lower surface, at least one aperture therethrough, and at least one circuit located in a portion of the cavity connected to the at least one aperture; a semiconductor device having an active surface having at least one bond pad thereon, the semiconductor device located within the cavity of the second carrier; a first connector between the at least one circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the semiconductor device; encapsulant material filling a portion of the cavity in the first carrier; and connector material located in a second aperture in the second carrier connected to the connector material in the at least one aperture in the first carrier.
Claim 44
Dependent Claim
40 words
The semiconductor device assembly of claim 33 , wherein the first carrier includes a first frustoconical surface on a portion thereof, a second frustoconical surface on another portion thereof, and a lip on a portion of a bottom surface thereof.
Claim 45
Dependent Claim
451 words
An assembly comprising: a substrate having an upper surface, a lower surface, and at least one circuit on the upper surface thereof; a first carrier having a cavity therein, an upper surface, a lower surface, at least one connection pad on the upper surface, at least one connection pad on the lower surface, at least one first circuit connecting the at least one connection pad on the upper surface to the at least one connection pad on the lower surface, and at least one second circuit located in a portion of the cavity connected to one of the at least one connection pad on the upper surface and the at least one connection pad on the lower surface; a first semiconductor device having an active surface having at least one bond pad thereon, the first semiconductor device located within the cavity of the first carrier; a first connector between the at least one second circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the first semiconductor device; encapsulant material filling a portion of the cavity in the first carrier; at least one second connector connected to the at least one connection pad on the lower surface of the first carrier and the at least one first circuit on the upper surface of the substrate; a second carrier oriented with respect to the first carrier and positioned the same direction as the first carrier further having a cavity therein, an upper surface, a lower surface, at least one connection pad on the upper surface, at least one connection pad on the lower surface, at least one first circuit connecting the at least one connection pad on the upper surface to the at least one connection pad on the lower surface, and at least one second circuit located in a portion of the cavity connected to the at least one connection pad on the upper surface and the at least one connection pad on the lower surface; a second semiconductor device having an active surface having at least one bond pad thereon, the second semiconductor device located within the cavity of the second carrier; a second connector between the at least one second circuit located in a portion of the cavity of the second carrier and the at least one bond pad on the active surface of the second semiconductor device; encapsulant material filling a portion of the cavity in the second carrier; at least one third connector connected to the at least one connection pad on the lower surface of the second carrier and the at least one first circuit on the lower surface of the substrate.
Claim 46
Dependent Claim
451 words
An assembly comprising: a substrate having an upper surface, a lower surface, and at least one circuit on the upper surface thereof; a first carrier having a cavity therein, an upper surface, a lower surface, at least one connection pad on the upper surface, at least one connection pad on the lower surface, at least one first circuit connecting the at least one connection pad on the upper surface to the at least one connection pad on the lower surface, and at least one second circuit located in a portion of the cavity connected to one of the at least one connection pad on the upper surface and the at least one connection pad on the lower surface; a first semiconductor device having an active surface having at least one bond pad thereon, the first semiconductor device located within the cavity of the first carrier; a first connector between the at least one second circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the first semiconductor device; encapsulant material filling a portion of the cavity in the first carrier; at least one second connector connected to the at least one connection pad on the lower surface of the first carrier and the at least one first circuit on the upper surface of the substrate; a second carrier oriented with respect to the first carrier and positioned the same direction as the first carrier further having a cavity therein, an upper surface, a lower surface, at least one connection pad on the upper surface, at least one connection pad on the lower surface, at least one first circuit connecting the at least one connection pad on the upper surface to the at least one connection pad on the lower surface, and at least one second circuit located in a portion of the cavity connected to the at least one connection pad on the upper surface and the at least one connection pad on the lower surface; a second semiconductor device having an active surface having at least one bond pad thereon, the second semiconductor device located within the cavity of the second carrier; a second connector between the at least one second circuit located in a portion of the cavity of the second carrier and the at least one bond pad on the active surface of the second semiconductor device; encapsulant material filling a portion of the cavity in the second carrier; at least one third connector connected to the at least one connection pad on the lower surface of the second carrier and the at least one first circuit on the lower surface of the substrate.
Claim 47
Dependent Claim
19 words
The assembly of claim 37 , wherein the first carrier includes at least one fin on a portion thereof.
Claim 48
Dependent Claim
193 words
The assembly of claim 37 , further comprising: a third carrier oriented with respect to the first carrier and positioned the same direction as the first carrier further having a cavity therein, an upper surface, a lower surface, at least one connection pad on the upper surface, at least one connection pad on the lower surface, a first circuit connecting the at least one connection pad on the upper surface to the at least one connection pad on the lower surface, and at least one second circuit located in a portion of the cavity connected to the at least one connection pad on the upper surface and the at least one connection pad on the lower surface; a third semiconductor device having an active surface having at least one bond pad thereon, the third semiconductor device located within the cavity of the third carrier; a fourth connector between the at least one first circuit located in a portion of the cavity of the third carrier and the at least one bond pad on the active surface of the semiconductor device; and encapsulant material filling a portion of the cavity in the third carrier.
Claim 49
Dependent Claim
38 words
The assembly of claim 37 , wherein the first carrier includes a first frustoconical surface on a portion thereof, a second frustoconical surface on another portion thereof, and a lip on a portion of a bottom surface thereof.
Claim 50
Dependent Claim
403 words
An assembly comprising: a substrate having an upper surface, a lower surface, and at least one circuit on the upper surface thereof; a first carrier having a cavity therein, an upper surface, a lower surface, at least one aperture extending therethrough, and the at least one circuit located in a portion of the cavity extending to the at least one aperture; a semiconductor device having an active surface having at least one bond pad thereon, the semiconductor device located within the cavity of the first carrier; a first connector between the at least one circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the semiconductor device; encapsulant material filling a portion of the cavity in the first carrier; a first connector material located in the at least one aperture in the carrier; at least one second connector connected to the first connector material in the at least one aperture in the first carrier and the at least one circuit on the upper surface of the substrate; a second carrier oriented with respect to the first carrier and positioned the same direction as the first carrier further having a cavity therein, an upper surface, a lower surface, at least one connection pad on the upper surface, at least one connection pad on the lower surface, at least one first circuit connecting the at least one connection pad on the upper surface to the at least one connection pad on the lower surface, and at least one second circuit located in a portion of the cavity connected to the at least one connection pad on the upper surface and the at least one connection pad on the lower surface; a second semiconductor device having an active surface having at least one bond pad thereon, the second semiconductor device located within the cavity of the second carrier; a second connector between the at least one second circuit located in a portion of the cavity of the second carrier and the at least one bond pad on the active surface of the second semiconductor device; encapsulant material filling a portion of the cavity in the second carrier; at least one third connector connected to the at least one connection pad on the lower surface of the second carrier and the at least one first circuit on the lower surface of the substrate.
Claim 51
Dependent Claim
403 words
An assembly comprising: a substrate having an upper surface, a lower surface, and at least one circuit on the upper surface thereof; a first carrier having a cavity therein, an upper surface, a lower surface, at least one aperture extending therethrough, and the at least one circuit located in a portion of the cavity extending to the at least one aperture; a semiconductor device having an active surface having at least one bond pad thereon, the semiconductor device located within the cavity of the first carrier; a first connector between the at least one circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the semiconductor device; encapsulant material filling a portion of the cavity in the first carrier; a first connector material located in the at least one aperture in the carrier; at least one second connector connected to the first connector material in the at least one aperture in the first carrier and the at least one circuit on the upper surface of the substrate; a second carrier oriented with respect to the first carrier and positioned the same direction as the first carrier further having a cavity therein, an upper surface, a lower surface, at least one connection pad on the upper surface, at least one connection pad on the lower surface, at least one first circuit connecting the at least one connection pad on the upper surface to the at least one connection pad on the lower surface, and at least one second circuit located in a portion of the cavity connected to the at least one connection pad on the upper surface and the at least one connection pad on the lower surface; a second semiconductor device having an active surface having at least one bond pad thereon, the second semiconductor device located within the cavity of the second carrier; a second connector between the at least one second circuit located in a portion of the cavity of the second carrier and the at least one bond pad on the active surface of the second semiconductor device; encapsulant material filling a portion of the cavity in the second carrier; at least one third connector connected to the at least one connection pad on the lower surface of the second carrier and the at least one first circuit on the lower surface of the substrate.
Claim 52
Dependent Claim
19 words
The assembly of claim 41 , wherein the first carrier includes at least one fin on a portion thereof.
Claim 53
Dependent Claim
196 words
The assembly of claim 41 , further comprising: a third carrier oriented with respect to the first carrier and positioned the same direction as the first carrier further having a cavity therein, an upper surface, a lower surface, at least one connection pad on the upper surface, at least one connection pad on the lower surface, at least one first circuit connecting the at least one connection pad on the upper surface to the at least one connection pad on the lower surface, and at least one second circuit located in a portion of the cavity connected to the at least one connection pad on the upper surface and the at least one connection pad on the lower surface; a third semiconductor device having an active surface having at least one bond pad thereon, the third semiconductor device located within the cavity of the third carrier; a fourth connector between the at least one second circuit located in a portion of the cavity of the third carrier and the at least one bond pad on the active surface of the third semiconductor device; and encapsulant material filling a portion of the cavity in the third carrier.
Claim 54
Dependent Claim
407 words
An semiconductor device assembly comprising: a substrate having an upper surface, a lower surface, and at least one circuit on the upper surface thereof; a first carrier having a cavity therein, an upper surface, a lower surface, at least one aperture extending therethrough, and the at least one circuit located in a portion of the cavity extending to the at least one aperture; a semiconductor device having an active surface having at least one bond pad thereon, the semiconductor device located within the cavity of the first carrier; a first connector between the at least one circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the semiconductor device; encapsulant material filling a portion of the cavity in the first carrier; a first connector material located in the at least one aperture in the first carrier; at least one second connector connected to the first connector material located in the at least one aperture in the first carrier and the at least one circuit on the upper surface of the substrate; a second carrier oriented with respect to the first carrier and positioned the same direction as the first carrier further having a cavity therein, an upper surface, a lower surface, at least one connection pad on the upper surface, at least one connection pad on the lower surface, at least one first circuit connecting the at least one connection pad on the upper surface to the at least one connection pad on the lower surface, and at least one second circuit located in a portion of the cavity connected to the at least one connection pad on the upper surface and the at least one connection pad on the lower surface; a second semiconductor device having an active surface having at least one bond pad thereon, the second semiconductor device located within the cavity of the second carrier; a second connector between the at least one second circuit located in a portion of the cavity of the second carrier and the at least one bond pad on the active surface of the second semiconductor device; encapsulant material filling a portion of the cavity in the second carrier; at least one third connector connected to the at least one connection pad on the lower surface of the second carrier and the at least one first circuit on the lower surface of the substrate.
Claim 55
Dependent Claim
407 words
An semiconductor device assembly comprising: a substrate having an upper surface, a lower surface, and at least one circuit on the upper surface thereof; a first carrier having a cavity therein, an upper surface, a lower surface, at least one aperture extending therethrough, and the at least one circuit located in a portion of the cavity extending to the at least one aperture; a semiconductor device having an active surface having at least one bond pad thereon, the semiconductor device located within the cavity of the first carrier; a first connector between the at least one circuit located in a portion of the cavity of the first carrier and the at least one bond pad on the active surface of the semiconductor device; encapsulant material filling a portion of the cavity in the first carrier; a first connector material located in the at least one aperture in the first carrier; at least one second connector connected to the first connector material located in the at least one aperture in the first carrier and the at least one circuit on the upper surface of the substrate; a second carrier oriented with respect to the first carrier and positioned the same direction as the first carrier further having a cavity therein, an upper surface, a lower surface, at least one connection pad on the upper surface, at least one connection pad on the lower surface, at least one first circuit connecting the at least one connection pad on the upper surface to the at least one connection pad on the lower surface, and at least one second circuit located in a portion of the cavity connected to the at least one connection pad on the upper surface and the at least one connection pad on the lower surface; a second semiconductor device having an active surface having at least one bond pad thereon, the second semiconductor device located within the cavity of the second carrier; a second connector between the at least one second circuit located in a portion of the cavity of the second carrier and the at least one bond pad on the active surface of the second semiconductor device; encapsulant material filling a portion of the cavity in the second carrier; at least one third connector connected to the at least one connection pad on the lower surface of the second carrier and the at least one first circuit on the lower surface of the substrate.
Claim 56
Dependent Claim
19 words
The assembly of claim 44 , wherein the first carrier includes at least one fin on a portion thereof.
Claim 57
Dependent Claim
194 words
The assembly of claim 44 , further comprising: a third carrier oriented with respect to the first carrier and positioned the same direction as the first carrier further having a cavity therein, an upper surface, a lower surface, at least one connection pad on the upper surface, at least one connection pad on the lower surface, a first circuit connecting the at least one connection pad on the upper surface to the at least one connection pad on the lower surface, and at least one second circuit located in a portion of the cavity connected to the at least one connection pad on the upper surface and the at least one connection pad on the lower surface; a third semiconductor device having an active surface having at least one bond pad thereon, the third semiconductor device located within the cavity of the third carrier; a fourth connector between the at least one first circuit located in a portion of the cavity of the third carrier and the at least one bond pad on the active surface of the third semiconductor device; and encapsulant material filling a portion of the cavity in the third carrier.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-10-01 | 2005-04-02 | 2005-10-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-10-01 | 2009-04-02 | 2009-10-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-10-01 | 2013-04-02 | 2013-10-02 | $7700.00 | Window Closed / Lapsed |