US6178093B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Information handling system with circuit assembly having holes filled with filler material
Assignee: International Business Machines Corp
•
Filing: 1998-03-03
•
Granted: 2001-01-23
•
Expires: 2018-03-03
Abstract
Abstract An information handling system is provided which comprises: a metal enclosure; at least one circuit assembly positioned within said metal enclosure, said circuit assembly including a circuitized substrate having at least one dielectric interior layer including a first surface and at least one hole therein; means for providing electrical power to said circuitized substrate within said metal enclosure; a filler material, wherein said filler material substantially fills said at least one hole within said at least one dielectric interior layer; a first wiring layer positioned on said first surface of said at least one dielectric interior layer, wherein said first wiring layer substantially covers said at least one hole having said filler material therein, said first wiring layer assisting in retaining said filler material within said at least one hole in said at least one dielectric interior layer; a first dielectric photoresist layer positioned on said first wiring layer and on said first surface of said at least one dielectric interior layer, wherein said first dielectric photoresist layer also includes at least one hole therein, said filler material also substantially filling said at least one hole within said first dielectric photoresist layer; a second wiring layer positioned on said first dielectric photoresist layer; wherein said second wiring layer includes a plurality of conductive pads as part thereof; and at least one external component electrically coupled to said conductive pads of said second wiring layer.
Inventors
- 👤 Anilkumar Chinuprasad Bhatt
- 👤 Donald Herman Glatzel
- 👤 Allen F. Moring
- 👤 Voya Rista Markovich
- 👤 Kostas Papathomas
- 👤 David John Russell
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 08:51
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4652; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H05K1/113; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4069; H05K3/4602; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2201/0355; H05K2201/09; H05K2201/09145; H05K2201/092; H05K2201/09209; H05K2201/095; H05K2201/0959; H05K2203/00; H05K2203/01; H05K2203/0191; H05K2203/02; H05K2203/025; H05K2203/0278; H05K2203/03; H05K2203/0338; H05K2203/05; H05K2203/0548; H05K2203/0554; H05K3/0011; H05K3/0017; H05K3/0023; H05K3/0094; H05K3/02; H05K3/022; H05K3/025; H05K3/22; H05K3/24; H05K3/245; H05K3/246; H05K3/42; H05K3/429; H10; H10W; H10W74/00; H10W74/10; H10W74/15; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/4913; Y10T29/49139; Y10T29/49144; Y10T29/49155; Y10T29/49165; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/24926; Y10T428/24942; Y10T428/249921; Y10T428/249994; Y10T428/249995; Y10T428/249996
Claims Analysis
Total Claims: 35
Claim 1
Independent Claim
275 words
An information handling system, comprising: a metal enclosure; at least one circuit assembly positioned within said metal enclosure, said circuit assembly including a circuitized substrate having at least one dielectric interior layer including a first surface and at least one hole therein; means for providing electrical power to said circuitized substrate within said metal enclosure; a filler material, wherein said filler material substantially fills said at least one hole within said at least one dielectric interior layer; and wherein said filler material comprises an organic base and at least one member selected from the group consisting of electroconductive particles and thermoconductive particles and wherein said organic base is about 20 percent to about 30 percent by weight of said filler material; a first wiring layer positioned on said first surface of said at least one dielectric interior layer, wherein said first wiring layer substantially covers said at least one hole having said filler material therein, said first wiring layer assisting in retaining said filler material within said at least one hole in said at least one dielectric interior layer; a first dielectric photoresist layer positioned on said first wiring layer and on said first surface of said at least one dielectric interior layer, wherein said first dielectric photoresist layer also includes at least one hole therein, said filler material also substantially filling said at least one hole within said first dielectric photoresist layer; a second wiring layer positioned on said first dielectric photoresist layer, wherein said second wiring layer includes a plurality of conductive pads as part thereof; and at least one external component electrically coupled to said conductive pads of said second wiring layer.
Claim 2
Dependent Claim
275 words
An information handling system, comprising: a metal enclosure; at least one circuit assembly positioned within said metal enclosure, said circuit assembly including a circuitized substrate having at least one dielectric interior layer including a first surface and at least one hole therein; means for providing electrical power to said circuitized substrate within said metal enclosure; a filler material, wherein said filler material substantially fills said at least one hole within said at least one dielectric interior layer; and wherein said filler material comprises an organic base and at least one member selected from the group consisting of electroconductive particles and thermoconductive particles and wherein said organic base is about 20 percent to about 30 percent by weight of said filler material; a first wiring layer positioned on said first surface of said at least one dielectric interior layer, wherein said first wiring layer substantially covers said at least one hole having said filler material therein, said first wiring layer assisting in retaining said filler material within said at least one hole in said at least one dielectric interior layer; a first dielectric photoresist layer positioned on said first wiring layer and on said first surface of said at least one dielectric interior layer, wherein said first dielectric photoresist layer also includes at least one hole therein, said filler material also substantially filling said at least one hole within said first dielectric photoresist layer; a second wiring layer positioned on said first dielectric photoresist layer, wherein said second wiring layer includes a plurality of conductive pads as part thereof; and at least one external component electrically coupled to said conductive pads of said second wiring layer.
Claim 3
Dependent Claim
42 words
The information handling system recited in claim 1 further comprising a central processing unit, a random access memory means for directing said central processing unit, and an input/output means for receiving input signals and transmitting output signals from said information handling system.
Claim 4
Dependent Claim
27 words
The information handling system recited in claim 1 wherein said dielectric interior layer comprises a material selected from the group consisting of ceramic and an organic compound.
Claim 5
Dependent Claim
29 words
The information handling system recited in claim 1 wherein said at least one hole within said at least one dielectric interior layer extends substantially through said dielectric interior layer.
Claim 6
Dependent Claim
28 words
The information handling system recited in claim 4 wherein said at least one hole within said at least one first dielectric photoresist layer includes a plated layer thereon.
Claim 7
Dependent Claim
27 words
The information handling system recited in claim 1 wherein at least two of said conductive pads are spaced apart from about 5 mils to about 50 mils.
Claim 8
Dependent Claim
33 words
The information handling system recited in claim 1 wherein said at least one hole within said at least one dielectric interior layer includes a diameter of about 2 mils to about 24 mils.
Claim 9
Dependent Claim
26 words
The information handling system recited in claim 1 wherein said organic base further comprises a resin selected from the group consisting of thermoplastic and thermoset resins.
Claim 10
Dependent Claim
29 words
The information handling system recited in claim 8 wherein said resin is a thermoplastic resin and further comprises an adhesive selected from the group consisting of epoxy and silicone.
Claim 11
Dependent Claim
14 words
The information handling system recited in claim 9 wherein said epoxy comprises epoxy-novolac resin.
Claim 12
Dependent Claim
24 words
The information handling system recited in claim 1 wherein said electroconductive particles comprise a material selected from the group consisting of metal and carbon.
Claim 13
Dependent Claim
25 words
The information handling system recited in claim 11 wherein said metal is selected from the group consisting of silver, copper, tin, lead and alloys thereof.
Claim 14
Dependent Claim
29 words
The information handling system recited in claim 1 wherein said electroconductive particles or thermoconductive particles are about 70 percent to about 80 percent by weight of said filler material.
Claim 15
Dependent Claim
18 words
The information handling system recited in claim 1 wherein said dielectric photoresist layer is comprised of permanent photoresist.
Claim 16
Dependent Claim
48 words
The information handling system recited in claim 14 wherein said circuitized substrate further includes a second dielectric photoresist layer positioned on said first dielectric photoresist layer and on said second wiring layer, said second dielectric photoresist including a third wiring layer positioned on said second dielectric photoresist layer.
Claim 17
Dependent Claim
21 words
The information handling system recited in claim 15 wherein said first wiring layer and said third wiring layer are electrically coupled.
Claim 18
Dependent Claim
34 words
The information handling system recited in claim 1 wherein said at least one external component is selected from the group consisting of a flip chip, a leaded component, a BGA module and combinations thereof.
Claim 19
Dependent Claim
279 words
An information handling system, comprising: a metal enclosure; at least one circuit assembly positioned within said metal enclosure, said circuit assembly including a circuitized substrate having at least one dielectric interior layer including a first surface and at least one hole therein; means for providing electrical power to said circuitized substrate within said metal enclosure; a filler material, wherein said filler material substantially fills said at least one hole within said at least one dielectric interior layer; and wherein said filler material comprises an organic base and at least one member selected from the group consisting of electroconductive particles and thermoconductive particles, and wherein said electroconductive particles or said thermoconductive particles are about 70 percent to about 80 percent by weight of said filler material; a first wiring layer positioned on said first surface of said at least one dielectric interior layer, wherein said first wiring layer substantially covers said at least one hole having said filler material therein, said first wiring layer assisting in retaining said filler material within said at least one hole in said at least one dielectric interior layer; a first dielectric photoresist layer positioned on said first wiring layer and on said first surface of said at least one dielectric interior layer; wherein said first dielectric photoresist layer also includes at least one hole therein, said filler material also substantially filling said at least one hole within said first dielectric photoresist layer; a second wiring layer positioned on said first dielectric photoresist layer; wherein said second wiring layer includes a plurality of conductive pads as part thereof; and at least one external component electrically coupled to said conductive pads of said second wiring layer.
Claim 20
Dependent Claim
279 words
An information handling system, comprising: a metal enclosure; at least one circuit assembly positioned within said metal enclosure, said circuit assembly including a circuitized substrate having at least one dielectric interior layer including a first surface and at least one hole therein; means for providing electrical power to said circuitized substrate within said metal enclosure; a filler material, wherein said filler material substantially fills said at least one hole within said at least one dielectric interior layer; and wherein said filler material comprises an organic base and at least one member selected from the group consisting of electroconductive particles and thermoconductive particles, and wherein said electroconductive particles or said thermoconductive particles are about 70 percent to about 80 percent by weight of said filler material; a first wiring layer positioned on said first surface of said at least one dielectric interior layer, wherein said first wiring layer substantially covers said at least one hole having said filler material therein, said first wiring layer assisting in retaining said filler material within said at least one hole in said at least one dielectric interior layer; a first dielectric photoresist layer positioned on said first wiring layer and on said first surface of said at least one dielectric interior layer; wherein said first dielectric photoresist layer also includes at least one hole therein, said filler material also substantially filling said at least one hole within said first dielectric photoresist layer; a second wiring layer positioned on said first dielectric photoresist layer; wherein said second wiring layer includes a plurality of conductive pads as part thereof; and at least one external component electrically coupled to said conductive pads of said second wiring layer.
Claim 21
Dependent Claim
42 words
The information handling system recited in claim 18 further comprising a central processing unit, a random access memory means for directing said central processing unit, and an input/output means for receiving input signals and transmitting output signals from said information handling system.
Claim 22
Dependent Claim
27 words
The information handling system recited in claim 18 wherein said dielectric interior layer comprises a material selected from the group consisting of ceramic and an organic compound.
Claim 23
Dependent Claim
29 words
The information handling system recited in claim 18 wherein said at least one hole within said at least one dielectric interior layer extends substantially through said dielectric interior layer.
Claim 24
Dependent Claim
28 words
The information handling system recited in claim 21 wherein said at least one hole within said at least one first dielectric photoresist layer includes a plated layer thereon.
Claim 25
Dependent Claim
27 words
The information handling system recited in claim 18 wherein at least two of said conductive pads are spaced apart from about 5 mils to about 50 mils.
Claim 26
Dependent Claim
33 words
The information handling system recited in claim 18 wherein said at least one hole within said at least one dielectric interior layer includes a diameter of about 2 mils to about 24 mils.
Claim 27
Dependent Claim
26 words
The information handling system recited in claim 18 wherein said organic base further comprises a resin selected from the group consisting of thermoplastic and thermoset resins.
Claim 28
Dependent Claim
29 words
The information handling system recited in claim 25 wherein said resin is a thermoplastic resin and further comprises an adhesive selected from the group consisting of epoxy and silicone.
Claim 29
Dependent Claim
14 words
The information handling system recited in claim 26 wherein said epoxy comprises epoxy-novolac resin.
Claim 30
Dependent Claim
24 words
The information handling system recited in claim 18 wherein said electroconductive particles comprise a material selected from the group consisting of metal and carbon.
Claim 31
Dependent Claim
25 words
The information handling system recited in claim 28 wherein said metal is selected from the group consisting of silver, copper, tin, lead and alloys thereof.
Claim 32
Dependent Claim
18 words
The information handling system recited in claim 18 wherein said dielectric photoresist layer is comprised of permanent photoresist.
Claim 33
Dependent Claim
48 words
The information handling system recited in claim 30 wherein said circuitized substrate further includes a second dielectric photoresist layer positioned on said first dielectric photoresist layer and on said second wiring layer, said second dielectric photoresist including a third wiring layer positioned on said second dielectric photoresist layer.
Claim 34
Dependent Claim
21 words
The information handling system recited in claim 28 wherein said first wiring layer and said third wiring layer are electrically coupled.
Claim 35
Dependent Claim
34 words
The information handling system recited in claim 18 wherein said at least one external component is selected from the group consisting of a flip chip, a leaded component, a BGA module and combinations thereof.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-01-23 | 2004-07-24 | 2005-01-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-01-23 | 2008-07-24 | 2009-01-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-01-23 | 2012-07-24 | 2013-01-23 | $7700.00 | Window Closed / Lapsed |