US5220724A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of securing surface-mounted devices to a substrate
Assignee: Robert Bosch GmbH
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Filing: 1991-09-09
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Granted: 1993-06-22
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Expires: 2011-09-09
Abstract
Abstract A method for mounting Surface-Mounted-Devices ("SMD's") on a substrate, e.g. a PC board, involves warming an adhesive containing conductive particles from a room-temperature solid state to a warmed fluid state, applying said fluid adhesive to the substrate, permitting the adhesive to cool back into a solid state, subsequently warming the substrate and adhesive to render the adhesive tacky and yielding, mounting the components (2-5) in the tacky adhesive, and permitting the adhesive to cool back into a solid state, thereby securing the components on the substrate.
Inventors
- 👤 Roland Gerstner
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 04:58
CPC Classifications
H; H05; H05K; H05K13/00; H05K13/04; H05K13/046; H05K13/0469; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H05K1/00; H05K1/18; H05K1/181; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10636; H05K2201/10954; H05K2201/10969; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0108; H05K2203/03; H05K2203/0338; H05K2203/11; H05K2203/1105; H05K3/10; H05K3/12; H05K3/1216; H05K3/34; H05K3/341; H05K3/3465; H05K3/3485; H10; H10W; H10W72/00; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
122 words
Method of securing Surface-Mounted Device components (2) on a substrate (1) using an electrically conductive adhesive (8) applied, by at least one of screen printing and stamping, onto the substrate, comprising the steps of providing a solvent-free thermoplastic adhesive consisting of a mixture of polyamide and conductive particles, warming said solvent-free thermoplastic adhesive containing said mixture from a room-temperature solid state to a warmed fluid state, applying said fluid adhesive to said substrate, permitting said adhesive to cool back into a slid state, subsequently warming said substrate and adhesive to render said adhesive tacky and yielding, mounting said components (2) in said tacky adhesive, and permitting said adhesive to cool back into a solid state, thereby securing said components on said substrate.
Claim 2
Dependent Claim
122 words
Method of securing Surface-Mounted Device components (2) on a substrate (1) using an electrically conductive adhesive (8) applied, by at least one of screen printing and stamping, onto the substrate, comprising the steps of providing a solvent-free thermoplastic adhesive consisting of a mixture of polyamide and conductive particles, warming said solvent-free thermoplastic adhesive containing said mixture from a room-temperature solid state to a warmed fluid state, applying said fluid adhesive to said substrate, permitting said adhesive to cool back into a slid state, subsequently warming said substrate and adhesive to render said adhesive tacky and yielding, mounting said components (2) in said tacky adhesive, and permitting said adhesive to cool back into a solid state, thereby securing said components on said substrate.
Claim 3
Dependent Claim
11 words
Method according to claim 1, wherein said adhesive contains silver particles.
Claim 4
Dependent Claim
16 words
Method according to claim 1, wherein said adhesive is applied by stamping, using a heated stamp.
Claim 5
Dependent Claim
17 words
Method according to claim 1, wherein said adhesive is applied by screen printing using a heated screen.
Claim 6
Dependent Claim
13 words
Method according to claim 1, wherein said adhesive comprises HENKEL adhesive no. 6208.
Claim 7
Dependent Claim
137 words
Method of securing Surface-Mounted Device components (2) on a substrate (1) using an electrically conductive adhesive (8) applied, by at least one of screen printing and stamping, onto the substrate, comprising the steps of warming a solvent-free thermoplastic adhesive containing conductive particles from a room-temperature solid state to a warmed fluid state, applying said fluid adhesive to said substrate, permitting said adhesive to cool back into a solid state, applying a solder paste (6) to said substrate at selected locations, and soldering solderable components (3, 4, 5) to said substrate (1) by heating said solder paste; subsequently warming said substrate and adhesive to render said adhesive tacky and yielding, mounting said (SMD) components (2) in said tacky adhesive, and permitting said adhesive to cool back into a solid state, thereby securing said (SMD) components on said substrate.
Claim 8
Dependent Claim
137 words
Method of securing Surface-Mounted Device components (2) on a substrate (1) using an electrically conductive adhesive (8) applied, by at least one of screen printing and stamping, onto the substrate, comprising the steps of warming a solvent-free thermoplastic adhesive containing conductive particles from a room-temperature solid state to a warmed fluid state, applying said fluid adhesive to said substrate, permitting said adhesive to cool back into a solid state, applying a solder paste (6) to said substrate at selected locations, and soldering solderable components (3, 4, 5) to said substrate (1) by heating said solder paste; subsequently warming said substrate and adhesive to render said adhesive tacky and yielding, mounting said (SMD) components (2) in said tacky adhesive, and permitting said adhesive to cool back into a solid state, thereby securing said (SMD) components on said substrate.
Claim 9
Dependent Claim
136 words
Method of securing Surface-Mounted Device (SMD) components (2) on a substrate (1) using an electrically conductive adhesive (8) applied, by at least one of screen printing and stamping, onto the substrate, comprising the steps of warming an adhesive containing conductive particles from a room-temperature solid state to a warmed fluid state, applying said fluid adhesive to said substrate, permitting said adhesive to cool back into a solid state, applying a solder paste (6) to said substrate at selected locations, and soldering solderable components (3, 4, 5) to said substrate (1) by heating said solder paste, subsequently warming said substrate and adhesive to render said adhesive tacky and yielding, mounting said SMD components in said tacky adhesive, and permitting said adhesive to cool back into a solid state, thereby securing said SMD components (2) on said substrate.
Claim 10
Dependent Claim
136 words
Method of securing Surface-Mounted Device (SMD) components (2) on a substrate (1) using an electrically conductive adhesive (8) applied, by at least one of screen printing and stamping, onto the substrate, comprising the steps of warming an adhesive containing conductive particles from a room-temperature solid state to a warmed fluid state, applying said fluid adhesive to said substrate, permitting said adhesive to cool back into a solid state, applying a solder paste (6) to said substrate at selected locations, and soldering solderable components (3, 4, 5) to said substrate (1) by heating said solder paste, subsequently warming said substrate and adhesive to render said adhesive tacky and yielding, mounting said SMD components in said tacky adhesive, and permitting said adhesive to cool back into a solid state, thereby securing said SMD components (2) on said substrate.
Claim 11
Dependent Claim
130 words
Method of securing Surface-Mounted Device components (2) on a substrate (1) using an electrically conductive adhesive (8) applied by stamping onto the substrate. comprising the steps of warming a solvent-free thermoplastic adhesive containing conductive particles from a room-temperature solid state to a warmed fluid state, applying said fluid adhesive to said substrate, permitting said adhesive to cool back into a solid state, applying a solder paste (6) to said substrate at selected locations, and soldering solderable components (3, 4, 5) to said substrate (1) by heating said solder paste; subsequently warming said substrate and adhesive to render said adhesive tacky and yielding, mounting said (SMD) components (2) in said tacky adhesive, and permitting said adhesive to cool back into a solid state, thereby securing said (SMD) components on said substrate.
Claim 12
Dependent Claim
130 words
Method of securing Surface-Mounted Device components (2) on a substrate (1) using an electrically conductive adhesive (8) applied by stamping onto the substrate. comprising the steps of warming a solvent-free thermoplastic adhesive containing conductive particles from a room-temperature solid state to a warmed fluid state, applying said fluid adhesive to said substrate, permitting said adhesive to cool back into a solid state, applying a solder paste (6) to said substrate at selected locations, and soldering solderable components (3, 4, 5) to said substrate (1) by heating said solder paste; subsequently warming said substrate and adhesive to render said adhesive tacky and yielding, mounting said (SMD) components (2) in said tacky adhesive, and permitting said adhesive to cool back into a solid state, thereby securing said (SMD) components on said substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-06-21 | 1996-12-21 | 1997-06-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-06-21 | 2000-12-21 | 2001-06-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-06-21 | 2004-12-21 | 2005-06-22 | $7700.00 | Window Closed / Lapsed |