Method of making an electronic device using an uniaxial conductive adhesive

Claim 1

A method of connecting a circuit member (18) having a plurality of laterally spaced conductive terminals (20) to a substrate (12) including a mounting surface (14) having a plurality of laterally spaced conductive paths (16), said method including the steps of: applying an adhesive (22) including a resin having a viscosity of 10,000 to 40,000 cps and having a twenty to twenty-five percent by weight content of spaced conductive metal particles suspended therein over the mounting surface (14) of the substrate (12) having the conductive paths (16) wherein the resin is a dielectric preventing conductivity between the spaced metal particles therein; mounting the circuit member (18) on the adhesive (22) while vertically aligning the conductive terminals (20) over preselected ones of the conductive paths (16); and characterized by applying pressure against the terminal (20) and the vertically aligned conductive path (16) and flowing the resin out from between the terminal (20) and conductive path (16) at a faster rate than the conductive metal particles to concentrate the percent by weight content of the conductive metal particles in the resin between each conductive terminal (20) and the vertically aligned conductive path (16) to between forty to fifty percent by weight and to decrease the spacing between the metal particles allowing conducting through the resin and making the resin uniaxially conductive vertically between the conductive terminal (20) and conductor path (16) while maintaining the adhesive (22) between laterally spaced terminals (20) and conductive paths (16) in the unconcentrated and nonconductive state.

Claim 2

A method of connecting a circuit member (18) having a plurality of laterally spaced conductive terminals (20) to a substrate (12) including a mounting surface (14) having a plurality of laterally spaced conductive paths (16), said method including the steps of: applying an adhesive (22) including a resin having a viscosity of 10,000 to 40,000 cps and having a twenty to twenty-five percent by weight content of spaced conductive metal particles suspended therein over the mounting surface (14) of the substrate (12) having the conductive paths (16) wherein the resin is a dielectric preventing conductivity between the spaced metal particles therein; mounting the circuit member (18) on the adhesive (22) while vertically aligning the conductive terminals (20) over preselected ones of the conductive paths (16); and characterized by applying pressure against the terminal (20) and the vertically aligned conductive path (16) and flowing the resin out from between the terminal (20) and conductive path (16) at a faster rate than the conductive metal particles to concentrate the percent by weight content of the conductive metal particles in the resin between each conductive terminal (20) and the vertically aligned conductive path (16) to between forty to fifty percent by weight and to decrease the spacing between the metal particles allowing conducting through the resin and making the resin uniaxially conductive vertically between the conductive terminal (20) and conductor path (16) while maintaining the adhesive (22) between laterally spaced terminals (20) and conductive paths (16) in the unconcentrated and nonconductive state.

Claim 14

A method of securing two electrically conductive members together, said method including the steps of: applying an adhesive including a resin having a viscosity of 10,000 to 40,000 cps and having a twenty to twenty-five percent by weight content of spaced conductive metal particles suspended therein between the two members wherein the resin is a dielectric preventing conductivity between the spaced metal particles, and forcing the members together and flowing the resin out from between the terminal (20) and conductive path (16) at a faster rate than the conductive metal particles to concentrate the percent by weight content of the metal particles in the resin between the members to between forty and fifty percent by weight to decrease the spacing between the metal particles allowing conductivity through the resin and making the resin conductive between the members while maintaining the resin not between the members in the unconcentrated and nonconductive state.

Claim 15

A method of securing two electrically conductive members together, said method including the steps of: applying an adhesive including a resin having a viscosity of 10,000 to 40,000 cps and having a twenty to twenty-five percent by weight content of spaced conductive metal particles suspended therein between the two members wherein the resin is a dielectric preventing conductivity between the spaced metal particles, and forcing the members together and flowing the resin out from between the terminal (20) and conductive path (16) at a faster rate than the conductive metal particles to concentrate the percent by weight content of the metal particles in the resin between the members to between forty and fifty percent by weight to decrease the spacing between the metal particles allowing conductivity through the resin and making the resin conductive between the members while maintaining the resin not between the members in the unconcentrated and nonconductive state.