US4694572A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Printed polymer circuit board method
Assignee: Tektronix Inc
•
Filing: 1986-06-13
•
Granted: 1987-09-22
•
Expires: 2006-06-13
Abstract
Abstract A method of manufacturing printed circuit boards includes injection molding a polymer component which may include a substrate for a printed circuit, forming circuit runs and circuit pads on the substrate with conductive adhesive, placing circuit components onto the circuit pads and curing the conductive adhesive. The adhesive may be silkscreened onto the polymer substrate. This process obviates the need for the large number of expensive manufacturing steps necessary to produce conventional etched fiberglass printed circuit boards.
Inventors
- 👤 David C. Leber
- 👤 Timothy L. Falk
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 04:14
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K1/095; H05K3/10; H05K3/12; H05K1/18; H05K1/181; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09118; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10636; H05K2203/00; H05K2203/14; H05K2203/1453; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49155
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
82 words
A method of manufacturing a printed circuit board having electrical circuit elements secured thereto comprising the steps of: (a) forming a polymer component, at least a portion of said component comprising a substrate for a printed electrical circuit; (b) forming electrical circuit runs and electrical contact pads on said substrate with an electrically conductive, adhesive ink; (c) mounting said electrical circuit elements to said electrical contact pads; and (d) curing said electrically conductive, adhesive ink with said electrical circuit elements secured thereto.
Claim 2
Independent Claim
82 words
A method of manufacturing a printed circuit board having electrical circuit elements secured thereto comprising the steps of: (a) forming a polymer component, at least a portion of said component comprising a substrate for a printed electrical circuit; (b) forming electrical circuit runs and electrical contact pads on said substrate with an electrically conductive, adhesive ink; (c) mounting said electrical circuit elements to said electrical contact pads; and (d) curing said electrically conductive, adhesive ink with said electrical circuit elements secured thereto.
Claim 3
Dependent Claim
17 words
The method of claim 1 wherein step (b) is accomplished through the use of a silkscreening process.
Claim 4
Dependent Claim
16 words
The method of claim 1 wherein said polymer components are formed by an injection molding process.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-09-21 | 1991-03-23 | 1991-09-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-09-21 | 1995-03-23 | 1995-09-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-09-21 | 1999-03-23 | 1999-09-22 | $7700.00 | Window Closed / Lapsed |