US4856185A
Expired / Lapsed
US
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Method for fastening electronic components to a substrate using a film
Assignee: EUPEC GmbH
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Filing: 1987-12-11
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Granted: 1989-08-15
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Expires: 2007-12-11
Abstract
Abstract For fastening electronic components to substrates, a connecting layer having good adhesion and good electrical and thermal conductivity is manufactured by sintering from a metal powder layer. A paste formed of metal powder, such as a silver powder, and of a solvent, is processed into a solvent-free presintered film in a separate process. This film is punched in accordance with a cross-section of the component and is provided for fastening the component. In manufacturing the film, a specific solvent is employed, together with heating up rates of 5° to 30° C./Min and holding times of 0.5 to 5 minutes at a maximum temperature of 300° C. The fastening is carried out at temperature of at least 150° C. and at a minimum mechanical pressure of 30 N/cm 2 . The use of a film speeds up the method and enables of sintering at low temperatures and, at the same time, at low mechanical pressure.
Inventors
- 👤 Werner Baumgartner
- 👤 Johannes Fellinger
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 05:07
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10W72/00; H10W72/30; H05; H05K; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H10W72/071; H10W72/073; H10W72/07331; H10W72/07336; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/381; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 33
Claim 1
Independent Claim
68 words
A method for fastening an electronic component to a substrate, comprising steps of: making a substantially solvent free connecting layer in the form of pre-sintered mechanically strong film formed from metal powder in a separate process prior to applying it to the component or substrate; placing the connectig layer between the component and substrate; and pressing the electronic component, connecting layer, and substrate together in a sintering process.
Claim 2
Independent Claim
68 words
A method for fastening an electronic component to a substrate, comprising steps of: making a substantially solvent free connecting layer in the form of pre-sintered mechanically strong film formed from metal powder in a separate process prior to applying it to the component or substrate; placing the connectig layer between the component and substrate; and pressing the electronic component, connecting layer, and substrate together in a sintering process.
Claim 3
Dependent Claim
29 words
A method according to claim 1 including the step of pressing together the component, film, and substrate with a pressure of at least 30N/cm 2 during the sintering process.
Claim 4
Dependent Claim
22 words
A method according to claim 1 including the step of carrying out the sintering process at temperatures of at least 150° C.
Claim 5
Dependent Claim
28 words
A method according to claim 1 including the step of forming the film by spreading said metal powder in planar fashion and holding it together through the presintering.
Claim 6
Dependent Claim
27 words
A method according to claim 4 including the step of forming the film of lamina-shaped metal powder particles whose grain size have a maximum of 15 μm.
Claim 7
Dependent Claim
17 words
A method according to claim 1 including the step of forming the film of a precious metal.
Claim 8
Dependent Claim
13 words
A method according to claim 6 wherein the film is formed of silver.
Claim 9
Dependent Claim
18 words
A method according to claim 1 including the step of forming the film of a precious metal alloy.
Claim 10
Dependent Claim
67 words
A method according to claim 1 including the steps of making the film by mixing metal powder with solvent to form a paste; applyihng the paste to a foundation with a ductor mechanism; driving the solvent out from the paste by applying heat; at least partially sintering the metal powder particles to one another by pre-sintering to create the film; and lifting the film from the foundation.
Claim 11
Dependent Claim
31 words
A method according to claim 9 including the step of employing as said solvent a mixture of cyclo-hexanol and methanol in a weight ratio within a range of 1:1 to 1:10.
Claim 12
Dependent Claim
22 words
A method according to claim 10 including the step of mixing the cyclo-hexanol and the methol in a weight ratio of 1:1.
Claim 13
Dependent Claim
33 words
A method according to claim 9 including the step of forming the paste from a mixture of the solvent and the metal powder in a weight ratio within limits of 1:4 to 1:6.
Claim 14
Dependent Claim
20 words
A method according to claim 12 wherein the weight ratio between the solvent and the metal powder amounts to 1:4.8.
Claim 15
Dependent Claim
16 words
A method according to claim 9 including the step of after-working the film with a calender.
Claim 16
Dependent Claim
22 words
A method according to claim 14 including the step of giving the film a uniform layer thickness of at least 5 μm.
Claim 17
Dependent Claim
26 words
A method according to claim 9 including the step of spreading the paste on with a ductor having a layer thickness between 10 and 500 μm.
Claim 18
Dependent Claim
29 words
A method according to claim 9 including the step of setting heating-up rates from 5 to 30° C./Min for driving the solvent out and for pre-sintering the metal powder.
Claim 19
Dependent Claim
18 words
A method according to claim 9 including the step of providing the temperature maximum at about 300° C.
Claim 20
Dependent Claim
27 words
A method according to claim 9 including the step of maintaining the holding time during which the maximally set temperature is maintained between 0.5 and 5 minutes.
Claim 21
Independent Claim
102 words
A method for fastening an electronic component to a substrate, comprising: manufacturing a connecting layer by providing a metal powder with solvent to form a paste; applying the paste to a foundation to create a layer; driving out the solvent with heat; at least partially sintering the metal powder particles so as to create a pre-sintered film as said connecting layer; cutting the pre-sintered film to a shape of a mounting area of said electronic component; introducing the pre-sintered film connecting layer between the electronic component and substrate; and pressing the electronic component, connecting layer, and substrate together in a sintering process.
Claim 22
Independent Claim
102 words
A method for fastening an electronic component to a substrate, comprising: manufacturing a connecting layer by providing a metal powder with solvent to form a paste; applying the paste to a foundation to create a layer; driving out the solvent with heat; at least partially sintering the metal powder particles so as to create a pre-sintered film as said connecting layer; cutting the pre-sintered film to a shape of a mounting area of said electronic component; introducing the pre-sintered film connecting layer between the electronic component and substrate; and pressing the electronic component, connecting layer, and substrate together in a sintering process.
Claim 23
Independent Claim
84 words
A method for manufacturing a connecting layer for use in fastening an electronic component in a sintering process to a substrate wherein the connecting layer is provided between the substrate and electronic component, comprising: mixing metal powder with solvent to form a paste; applying the paste to a foundation; driving out the solvent from the paste by applying heat; at least partially sintering the metal powder particles to one another in a pre-sintering to create a film; and removing the film from the foundation.
Claim 24
Independent Claim
84 words
A method for manufacturing a connecting layer for use in fastening an electronic component in a sintering process to a substrate wherein the connecting layer is provided between the substrate and electronic component, comprising: mixing metal powder with solvent to form a paste; applying the paste to a foundation; driving out the solvent from the paste by applying heat; at least partially sintering the metal powder particles to one another in a pre-sintering to create a film; and removing the film from the foundation.
Claim 25
Dependent Claim
31 words
A method according to claim 21 wherein the film is cut to a desired shape corresponding to a mounting area of the electronic component with which it is to be used.
Claim 26
Independent Claim
70 words
A method for fastening an electronic component to a substrate, comprising the steps of: providing a connecting layer in the form of a presintered film formed from metal powder, said film being formed by spreading said metal powder in planar fashion and holding it together through pre-sintering; introducing the connecting layer between the component and substrate; and pressing the electronic component, connecting layer, and substrate together in a sintering process.
Claim 27
Independent Claim
70 words
A method for fastening an electronic component to a substrate, comprising the steps of: providing a connecting layer in the form of a presintered film formed from metal powder, said film being formed by spreading said metal powder in planar fashion and holding it together through pre-sintering; introducing the connecting layer between the component and substrate; and pressing the electronic component, connecting layer, and substrate together in a sintering process.
Claim 28
Independent Claim
106 words
A method for fastening an electronic component to a substrate, comprising the steps of: providing a connecting layer in the form of a presintered film formed from metal powder by mixing metal powder with solvent to form a paste, applying the paste to a foundation with a ductor mechanism, driving the solvent out from the paste by applying heat, at least partially sintering the metal powder particles to one another by pre-sintering to create the film, and lifting the film from the foundation; introducing the connecting layer between the component and substrate; and pressing the electronic component, connecting layer, and substrate together in a sintering process.
Claim 29
Independent Claim
106 words
A method for fastening an electronic component to a substrate, comprising the steps of: providing a connecting layer in the form of a presintered film formed from metal powder by mixing metal powder with solvent to form a paste, applying the paste to a foundation with a ductor mechanism, driving the solvent out from the paste by applying heat, at least partially sintering the metal powder particles to one another by pre-sintering to create the film, and lifting the film from the foundation; introducing the connecting layer between the component and substrate; and pressing the electronic component, connecting layer, and substrate together in a sintering process.
Claim 30
Independent Claim
61 words
A method for fastening an electronic component to a substrate, comprising steps of: making a connecting layer with a desired contour in the form of a pre-sintered film formed from metal powder with desired contour; placing the connecting layer with desired contour between the component and substrate; and pressing the electronic component, connecting layer, and substrate together in a sintering process.
Claim 31
Independent Claim
61 words
A method for fastening an electronic component to a substrate, comprising steps of: making a connecting layer with a desired contour in the form of a pre-sintered film formed from metal powder with desired contour; placing the connecting layer with desired contour between the component and substrate; and pressing the electronic component, connecting layer, and substrate together in a sintering process.
Claim 32
Dependent Claim
16 words
The method of claim 25 wherein the pre-sintered film is stamped to provide the desired contour.
Claim 33
Dependent Claim
15 words
The method of claim 26 wherein the desired contour matches a contour of the component.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-08-14 | 1993-02-13 | 1993-08-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-08-14 | 1997-02-13 | 1997-08-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-08-14 | 2001-02-13 | 2001-08-15 | $7700.00 | Window Closed / Lapsed |