US5243142A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Printed wiring board and process for producing the same
Assignee: Lincstech Circuit Co Ltd
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Filing: 1991-07-25
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Granted: 1993-09-07
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Expires: 2011-07-25
Abstract
Abstract A printed wiring board obtained by filling a non-electroconductive resin paste containing a metal powder in inner wall metallized through holes of double sided copper-clad insulating substrate, followed by curing by two steps, can mount leadless parts in high mounting density without losing a function of electroconnecting wiring layers.
Inventors
- 👤 Kazumitsu Ishikawa
- 👤 Haruo Suzuki
- 👤 Shoji Oikawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 09:57
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4069; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H05K1/113; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/0959; H05K3/0094; H05K3/22; H05K3/24; H05K3/245; H05K3/246; H05K3/42; H05K3/425; H05K3/427
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
84 words
A printed wiring board comprising a double-sided copper-clad insulating subtrate, said insulating substrate having through holes at desired portions, an electroconductive plating layer being formed on inner walls of through holes and both surfaces of insulating substrate, inner portions of said through holes being filled with a cured product of non-electroconductive resin paste containing a metal powder, at least both surfaces of cured product being covered with a second plating layer for mounting parts, and said second layer being subjected to circuit formation treatment.
Claim 2
Dependent Claim
84 words
A printed wiring board comprising a double-sided copper-clad insulating subtrate, said insulating substrate having through holes at desired portions, an electroconductive plating layer being formed on inner walls of through holes and both surfaces of insulating substrate, inner portions of said through holes being filled with a cured product of non-electroconductive resin paste containing a metal powder, at least both surfaces of cured product being covered with a second plating layer for mounting parts, and said second layer being subjected to circuit formation treatment.
Claim 3
Dependent Claim
42 words
A printed wiring board according to claim 1, wherein said second plating layer is provided in a circuit pattern by said circuit formation treatment and wherein the circuit formation treatment is carried out by using a dry film layer and etching treatment.
Claim 4
Dependent Claim
40 words
A printed wiring board according to claim 1, wherein the non-electroconductive resin paste is a paste of a thermosetting resin containing a powder of at least one metal selected from the group consisting of copper, nickel, silver, palladium and gold.
Claim 5
Dependent Claim
23 words
A printed wiring board according to claim 3, wherein the resin of non-electroconductive resin paste is a phenol resin or an epoxy resin.
Claim 6
Dependent Claim
27 words
A printed wiring board according to claim 3, wherein the powder is contained in an amount of 50 to 90% by weight of said non-electroconductive resin paste.
Claim 7
Dependent Claim
19 words
A printed wiring board according to claim 1, further comprising a leadless part mounted on said second plating layer.
Claim 8
Dependent Claim
24 words
A printed wiring board according to claim 6, wherein said leadless part is mounted on the second plating layer over a respective through hole.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-09-06 | 1997-03-08 | 1997-09-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-09-06 | 2001-03-08 | 2001-09-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-09-06 | 2005-03-08 | 2005-09-07 | $7700.00 | Window Closed / Lapsed |